REPORT OF RADIOGRAPHIC

EXAMINATION(A)

Owner / CUSTOMER

MANUFACTURER./CONTRACTOR

REPORT No.

SCOP

HDGSK-JV

IONE-QA-A-RT-APN-WQT-0003

PROJECT NAME.

PROJECT(or JOB) No.

DATE OF REPORTING

PAGE N

KARBALA REFINERY PROJECT

IONE

23-Jan-16

1 of 2

PROCEDURE No. / Rev.

APPLICABLE(ACCEPTANCE) STANDARD

IONE-AA00-PE-QA-0022 / Rev 0

ASME Sec IX

LINE CLASS.(or ITEM NAME/NO.)

MATERIALS.

IONE-IN-A-TK-WN-0001(NFWQT-0001)

A283-C

BASIC MATETIAL
THICHNESS

16

mm

WELDING PROCESS.
GTAW

SAW

GMAW

X-ray

VOLTAGE.

250

-Ray

SOURCE TYPE

FILM

Single-Image

ASTM

FCAW
CURRENT.

10

STRENGTH.

BRAND.

TYPE.

Agfa

D7

FILM VIEWING.

I.Q.I No.

SMAW
KVP

MATERIALS FORM

FILM DENSITY

Double-Wall

1.8 ~ 4.0

2.0

3 mm

SOURCE SIZE:

I.Q.I PLACEMENT
%

Source-Side

EXPOSURE TIME.

Min

EXPOSURE TIME.

FFD(SFD)
700

TYPE.

mm

Min

As Welded

THICKNES

SCREEN
Pb

SURFACE CONDITION
As Ground

Basic Material

Welding

Sensitivity
1B

FOCAL SPOT SIZE :

0.03

DEVELOPING CONDITION.

Manual

Total

Auto

20

Sheet

Remarks

Location Marker Placement

KIND
POSITION
NAME

Source Side

CONSTRUCTION

ASNT Level-III
Bong Seok Cho

SIGNATURE

DATE
RT-001-A(Rev.0)

23-Jan-16

Film Side
HDGSK JV QA/QC

EMPLOYER

12

REPORT OF RADIOGRAPHIC
EXAMINATION(A)

IONE-QA-A-RT-APN-WQT-0003

Report No.

A P N I I C

22-Jan-16

DATE of TEST

DWG(or Line, or Item) Number(or Name)

Position

Joint
No.

Size
(Inch)

Thickn
ess
(mm)

Welding
Process

NAME

SIGNATURE

Result

Rej

Acc

Interpreta
tion

Request
No.

2G

16mm

FCAW

A-TK-WN-0001

"

3G

"

"

"

Nazmul Hossain

2G

16mm

FCAW

A-TK-WN-0001

"

3G

"

"

Sadekul Islam

2G

16mm

FCAW

"

3G

"

"

Babul Mondol

2G

16mm

FCAW

A-TK-WN-0001

"

3G

"

"

"

Moazzem Hossain

2G

16mm

FCAW

A-TK-WN-0001

"

3G

"

"

UC

"

Juwel Rana

2G

16mm

FCAW

UC

A-TK-WN-0001

"

3G

"

"

PO

"

DEFECT
CODE

POSITION

Location

Abu Hanif

--------

KIND

of

PAGE No

UC

"
A-TK-WN-0001

PO

"

BLANK -------

ND : No Defect

CR : Crack

IP : Incomplete Penetration

UC : Surface Under Cut

SD : Surface Defect

SI : Slag

PO : Porosity

WP :

CP : Cluster Porosity

R/UC : Root Under Cut

R/CV : Root Concavity

BT : Burn Through

M : Mismatch

ID : Internal Debris

H/LM : Hi-Low Misaligment

F/M : Film Mark

S/M : Screen Mark

CONSTRUCTION

ASNT Level-III
Bong Seok Cho

Worrm Hole(Porosity)

Inclusion

HDGSK JV QA/QC

LF : Lack of Fusion
TI : Tungsten Inclusion

R/EP : Root Excess Penetration

EMPLOYER

DATE
RT-001-A(Rev.0)

23-Jan-16

REPORT No.
IONE-QA-A-RT-APN-WQT-0003
PAGE No.
1 of 2
APPLICABLE(ACCEPTANCE) STANDARD
ASME Sec IX
MATERIALS FORM
Basic Material

I.Q.I PLACEMENT
Source-Side

Film-Side
Min

00

Min

Sec
Sec

THICKNESS.
0.03 mm
DEVELOPING CONDITION.

12
Remarks

EMPLOYER

Min
SH'T

IONE-QA-A-RT-APN-WQT-0003
22-Jan-16

of
Request
No.

2
Remark

A-TK-WN-0001

"
A-TK-WN-0001

"
A-TK-WN-0001

"
A-TK-WN-0001

"
A-TK-WN-0001

"
A-TK-WN-0001

"

LF : Lack of Fusion
TI : Tungsten Inclusion
R/EP : Root Excess Penetration
M : Mismatch
S/M : Screen Mark

EMPLOYER