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DATA SHEET
TDA7056
3 W mono BTL audio output
amplifier
Product specification May 1992
File under Integrated Circuits, IC01
Philips Semiconductors Product specification
ORDERING INFORMATION
EXTENDED PACKAGE
TYPE NUMBER PINS PIN POSITION MATERIAL CODE
TDA7056 9 SIL plastic SOT110(1)
Note
1. SOT110-1; 1996 August 21.
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage − 18 V
IORM Peak output current repetitive − 1 A
IOSM Peak output current non-repetitive − 1.5 A
Tstg storage temperature range −55 150 °C
Tj junction temperature − 150 °C
Ptot total power dissipation Tcase < 60 °C − 9 W
Tsc short circuiting time see note 1 − 1 hr
Note
1. The load can be short-circuited at all input conditions.
THERMAL RESISTANCE
POWER DISSIPATION
Assume: VP = 11 V; RL = 16 Ω.
The maximum sine-wave dissipation is 1.52 W.
The Rth j-a of the package is 55 K/W.
Tamb max = 150 − 55 × 1.52 = 66.4 °C.
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Philips Semiconductors Product specification
CHARACTERISTICS
At Tamb = 25 °C; f = 1 kHz; VP = 11 V; RL = 16 Ω (see Fig.2).
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Philips Semiconductors Product specification
(1) This capacitor can be omitted if the supply electrolytic capacitor is placed closer to pin 2.
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Philips Semiconductors Product specification
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
D1
q
P P1 A2
A3
q2
q1
A4
E
seating plane
pin 1 index
L c
1 9
Z e b Q
b2 w M
b1
0 5 10 mm
scale
UNIT A
A2
A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1)
max. max.
18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 3.9 2.75 3.4 1.75 15.1 4.4 5.9
mm 3.7 0.25 1.0
17.8 8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20 3.4 2.50 3.2 1.55 14.9 4.2 5.7
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
92-11-17
SOT110-1
95-02-25
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Philips Semiconductors Product specification
DEFINITIONS
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