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All manuscripts must be submitted through Manuscript Central at http://mc.manuscriptcentral.com/tpel-ieee. Submissions must be clearly marked Special Issue on Robust Design and Reliability in Power Electronics, 2015 on the cover page. When uploading your paper, please indicate, under step 4 Details & Comments, that it is for the Special Issue on Robust Design and Reliability in Power Electronics 2015. Refer to http://www.pels.org for general information about electronic submission through Manuscript Central. Manuscripts submitted for the special issue will be reviewed separately and will be handled by the guest editorial board: Deadline for Submission of Manuscript: April 1, 2014 Guest Editor-in-Chief: Frede Blaabjerg, Aalborg University, Denmark (fbl@et.aau.dk) Guest Editor-in-Chief: Michael Pecht, CALCE, University of Maryland, US (pecht@calce.umd.edu) Guest Associate Editors: Robert Balog, Texas A&M, US Maryan Saeedifard, Purdue Univ., US Huai Wang, Aalborg University, Denmark Rik De Doncker, RWTH, Aachen, Germany Tim Zgonena, Underwriters Laboratories, US Stan Atcitty, Sandia National Laboratories, US Barry Mather, NREL, US Aminul Huque, Electric Power Research Institute, US Thomas Levitsky, First Solar, US Pedro Rodriguez, Abengoa Research, Spain Faisal Khan, Univ. Utah, US Alejandro Dominguez-Garcia, UIUC, US Peter P. D. Rimmen, Danfoss Power Electronics, Denmark Suresh Perinpanayagam, Boeing Prognostic Center, UK Meir Adest, SolarEdge Technologies Inc., US Henry S. H. Chung, City University of Hong Kong, HK Sarah Kurtz, NREL, US Thomas Key, Electric Power Research Institute, US Thierry Lebey, LEGT, France Khurram Afridi, CU Boulder, US Dorin Neacsu, Technical University of Iasi, Romania
Timeline: December 2013 April 2014 Call for Papers in the Transactions and Newsletter April 1, 2014 Manuscripts Submission Deadline July 1, 2014 First Review Complete August 15, 2014 Revised Manuscripts Due October 1, 2014 Final Acceptance Notification December 15, 2014 Final Manuscripts Due January 1, 2015 Manuscripts Forwarded to IEEE for Publication August 2015 Special Issue Appears in Transactions