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Helge Kristiansen
Helge Kristiansen
Conpart AS
Gsevikvn. 4, Kjeller P.O. Box 144, N-2027 Kjeller NORWAY Phone +47 64 84 43 00 Mobile +47 930 36 073 E-mail: helge@conpart.no www.conpart.no
IC Chip ACF
Conductive Microspheres
Substrate
Adhesion
Adhesion relates to the interface between adherent and adhesive The most important mechanism for adhesion is inter-molecular and surface forces