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Chapter 15 Cooling of Electronic Equipment

15-55 A plastic DIP with 16 leads is cooled by forced air. Using data supplied by the manufacturer, the
junction temperature is to be determined.
Assumptions teady operating conditions e!ist.
Analysis "he junction#to#ambient thermal resistance of
the de$ice with 16 leads corresponding to an air $elocity
of %&& m'min is determined from (ig.1)#*% to be
R
junction ambient
= )& +' ,
"hen the junction temperature becomes
C 125 = + =

- +',. ,./)& /* 0 + *)
ambient junction ambient junction
ambient junction
ambient junction
R Q T T
R
T T
Q

,hen the fan fails the total thermal resistance is determined from (ig.1)#*% by reading the $alue for 1ero
air $elocity /the intersection point of the cur$e with the $ertical a!is. to be
R
junction ambient
= 2& +' ,
which yields
- +',. ,./2& /* 0 + *) C 165 = + =

ambient junction ambient junction


ambient junction
ambient junction
R Q T T
R
T T
Q

15-56 A P+3 with copper cladding is gi$en. "he percentages of heat conduction along the copper and
epo!y layers as well as the effecti$e thermal conducti$ity of the P+3 are to be determined.
Assumptions 1 teady operating conditions e!ist. 2 4eat conduction along the P+3 is one#dimensional
since heat transfer from side surfaces is negligible. 3 "he thermal properties of epo!y and copper layers
are constant.
Analysis 4eat conduction along a layer is proportional to
the thermal conducti$ity#thic5ness product /5t. which is
determined for each layer and the entire P+3 to be
/ . / . .
/ . / . . .
/ . / . . . .
kt
kt
kt kt kt
copper
epoxy
PCB copper epoxy
= =
= =
= + = + =
%66 & &*%16
& *6 & &&&1%
& &*%16 &&&&1% & &*%*7
,' m. +./&.&6 1& m ,' +
,' m. +./&.) 1& m ,' +
/ . ,' +
#%
#%
"herefore the percentages of heat conduction along the
epo!y board are
0.6% =

= = &&)6 . &
+ ,' &*%16 . &
+ ,' &&&1% . &
. /
. /
PCB
epoxy
epoxy
kt
kt
f
and
99.4% = = .8 6 . & 1&& /
copper
f
"hen the effecti$e thermal conducti$ity becomes
C W/m. 41.6 =

+
=
+
+
=
m 1& &.). 0 /&.&6
+ ,' . &&&1% . & &*%16 . & /
. / . /
% #
copper epoxy
copper epoxy
eff
t t
kt kt
k
1)#16
Air
*)+
%&& m'min
* ,
Q
P+3
1* cm
1* cm
9po!y
t - &.) mm
+opper
t - &.&6 mm
Chapter 15 Cooling of Electronic Equipment
15-57 "!PROBLEM 15- 057"
"GIVEN"
length=0. 12 "[m] "
!"th=0. 12 "[m] "
"t#$%&&e' =0. 0( [mm]) &*'*mete' t% +e ,*'!e""
t#e&%-.=0. 5 "[mm] "
/#$%&&e' =01( "[23m- 4]"
/#e&%-.=0. 2( "[23m- 4]"
"5N5L67I7"
/t#$%&&e' =/#$%&&e'8t#$%&&e'84%n,e't9mm) m:
/t#e&%-.=/#e&%-.8t#e&%-.84%n,e't9mm) m:
/t#P4B=/t#$%&&e' ;/t#e&%-.
<#$%&&e' =/t#$%&&e'3/t#P4B84%n,e't9) =:
<#e&%-.=100- <#$%&&e'
/#e<< =9/t#e&%-.;/t#$%&&e':399t#e&%-.;t#$%&&e':84%n,e't9mm) m::
"copper :mm; fcopper :8; 5eff :,'m#+;
&.&* 76.%< 1).1
&.&*) 76.62 16.6%
&.&% 76.67 **.&7
&.&%) 77.&) *).)
&.&< 77.12 *6.6%
&.&<) 77.*6 %*.11
&.&) 77.%% %).%%
&.&)) 77.%7 %6.<7
&.&6 77.<< <1.)7
&.&6) 77.<6 <<.6<
&.&2 77.)* <2.6%
&.&2) 77.)) )&.)2
&.&6 77.)6 )%.<2
&.&6) 77.61 )6.%1
&.&7 77.6% )7.1
&.&7) 77.6) 61.6)
&.1 77.66 6<.))
1)#12
Chapter 15 Cooling of Electronic Equipment
0.02 0.00 0.0> 0.05 0.0( 0.07 0.01 0.0? 0.1
?1.2
?1.>
?1.(
?1.1
??
??.2
??.>
??.(
??.1
10
20
00
>0
50
(0
70
t
copper
[mm]
f
c
o
p
p
e
r


[
%
]
k
e
f
f


[
W
/
m
-
C
]
f
copper
k
eff

1)#16
Chapter 15 Cooling of Electronic Equipment
15-58 "he heat generated in a silicon chip is conducted to a ceramic substrate to which it is attached. "he
temperature difference between the front and bac5 surfaces of the chip is to be determined.
Assumptions 1 teady operating conditions
e!ist. 2 4eat conduction along the chip is one#
dimensional.
Analysis "he thermal resistance of silicon chip is
R
L
kA
chip
= =


=
&.) 1& m
/1%& ,' m. +./&.&&6 &.&&6.m
+' ,
#%
*
&1&66 .
"hen the temperature difference across the chip becomes
C 0.32 = = - +',. ,./&.1&66 % /
chip
R Q T

15-59E "he dimensions of an epo!y glass laminate are gi$en. "he
thermal resistances for heat flow along the layers and across the
thic5ness are to be determined.
Assumptions 1 4eat conduction in the laminate is one#dimensional in
either case. 2 "hermal properties of the laminate are constant.
Analysis "he thermal resistances of the P+3 along the 2 in long side
and across its thic5ness are
/a.
F/Btu h. 186 =

=
=
ft. * ft./&.&)'1 (./6'1* 3tu'h.ft. /&.1)
ft /2'1*.
kA
L
R
length
along
/b.
F/Btu h. 0.095 =

=
=
ft. ft./6'1* (./2'1* 3tu'h.ft. /&.1)
ft /&.&)'1*.
kA
L
R
thickness
across
1)#17
%,
+hip
6 6 &.) mm
+eramic
substrate
Q

Q
thic5ness
Q
length
2 in
6 in
&.&) in
Chapter 15 Cooling of Electronic Equipment
15-60 +ylindrical copper fillings are
planted throughout an epo!y glass
board. "he thermal resistance of the
board across its thic5ness is to be
determined.
Assumptions 1 4eat conduction along
the board is one#dimensional. 2
"hermal properties of the board are
constant.
Analysis "he number of copper
fillings on the board is

%&&&
mm. mm./% % /
mm. mm./16& 1)& /
s=uare one of Area
board of Area
= =
= n
"he surface areas of the copper fillings and the remaining part of the epo!y layer are
A n
D
A length i!th
A A A
copper
total
epoxy total copper
= = =
= =
= = =

*
<
%&&&
& &&1
&&&*%)6
&1)
&&*2 & &&*%)6 &&*<6<<
/ .
/ .
.
/ ./ . / .
. . .
m.
<
m
m./&.16 m. - &.&*2 m
m
*
*
*
*
"he thermal resistance of each material is
R
L
kA
R
L
kA
copper
epoxy
= =

=
= =

=
&.&&1< m
/%66 ,' m. +./&.&&*%)6 m
+' ,
&.&&1< m
/&.*6 ,' m. +./&.&*<6<< m
+' ,
*
*
.
.
.
.
& &&1)<
& *16)
ince these two resistances are in parallel, the e=ui$alent thermal resistance of the entire board is
C/W 0.00153 =

= + =
boar!
copper epoxy boar!
R
R R R +', &&1)< . &
1
+', *16) . &
1 1 1 1

1)#*&
% mm
% mm
1 mm
9po!y
board
+opper
filing
Chapter 15 Cooling of Electronic Equipment
15-61 "!PROBLEM 15- 0(1"
"GIVEN"
length=0. 11 "[m] "
!"th=0. 15 "[m] "
/#e&%-.=0. 2( "[23m- 4]"
t#+%*'"=1. >31000 "[m] "
/#<!ll!ng=01( "[23m- 4]) &*'*mete' t% +e ,*'!e""
"@#<!ll!ng=1 [mm]) &*'*mete' t% +e ,*'!e""
A=031000 "[m]"
"5N5L67I7"
5#+%*'"=l engt h8! "t h
n#<!ll!ng=5#+%*'"3AB2
5#<!ll!ng=n#<! l l! ng8&! 89@#<!ll! ng84%n,e't9mm) m:: B23 >
5#e&%-.=5#+%*'"- 5#<!ll!ng
R#<!ll!ng=t#+%*'"39/#<!ll! ng85#<!ll! ng:
R#e&%-.=t#+%*'"39/#e&%-.85#e&%-.:
13R#+%*'"=13R#e&%-.;13R#<!ll! ng
kfilling [W/m-C] R!ar" [C/W]
1& &.&<621
*7.) &.&16<<
<7 &.&11<7
66.) &.&&6%<%
66 &.&&6))
1&2.) &.&&)%71
1*2 &.&&<)6
1<6.) &.&&%76*
166 &.&&%)**
16).) &.&&%1)2
*&) &.&&*66
**<.) &.&&*61)
*<< &.&&*<&6
*6%.) &.&&**%*
*6% &.&&*&6
%&*.) &.&&17<2
%** &.&&16%
%<1.) &.&&12*6
%61 &.&&16%<
%6&.) &.&&1))
<&& &.&&1<2)
#filling [mm] R!ar" [C/W]
&.) &.&&)722
&.6 &.&&<167
&.2 &.&&%&7)
&.6 &.&&*%26
&.7 &.&&166<
1 &.&&1)*7
1.1 &.&&1*6)
1.* &.&&1&6<
1.% &.&&&7&2%
1.< &.&&&26*6
1.) &.&&&66*%
1.6 &.&&&)777
1.2 &.&&&)%16
1.6 &.&&&<2<%
1)#*1
Chapter 15 Cooling of Electronic Equipment
1.7 &.&&&<*)6
* &.&&&%6<%
0 50 100 150 200 250 000 050 >00
0
0.01
0.02
0.00
0.0>
0.05
k
f!""!#$
[W/m-C]
%
&
o
'
r
(


[
C
/
W
]

0.5 0.1 1.1 1.> 1.7 2
0
0.001
0.002
0.000
0.00>
0.005
0.00(
)
f!""!#$
[mm]
%
&
o
'
r
(


[
C
/
W
]

1)#**
Chapter 15 Cooling of Electronic Equipment
15-62 A circuit board with uniform heat generation is to be conduction
cooled by a copper heat frame. "emperature distribution along the heat
frame and the ma!imum temperature in the P+3 are to be determined.
Assumptions 1 teady operating conditions e!ist
2 "hermal properties are constant. 3 "here is no
direct heat dissipation from the surface of the
P+3, and thus all the heat generated is
conducted by the heat frame to the heat sin5.
Analysis "he properties and dimensions of
$arious section of the P+3 are summari1ed
below as
ection and material "hermal
conducti$ity
"hic5ness 4eat transfer surface
area
9po!y board
+ ,'m. *6 . &
* mm
1& mm 1*& mm
9po!y adhesi$e
+ ,'m. 6 . 1
&.1* mm
1& mm 1*& mm
+opper heat frame
/normal to frame.
+ ,'m. %66
1.) mm
1& mm 1*& mm
+opper heat frame
/along the frame.
9>39D 9=uation
+ ,'m. %66
1& mm
1) mm 1*& mm
Using the $alues in the table, the $arious thermal resistances are determined to be
R
L
kA
R
L
kA
R
L
kA
R R
L
kA
epoxy
a!hesi"e
copper
frame copper parallel
= =

=
= =

=
= =

=
= = =

=

&.&&* m
/&.*6 ,' m. +./&.&1 m m.
+' ,
&.&&&1* m
/1.6 ,' m. +./&.&1 m &.1* m.
+' ,
&.&&1) m
/%66 ,' m. +./&.&1 m &.1* m.
+' ,
&.&1 m
/%66 ,' m. +./&.&&1) &.1* m.
+' ,
&1*
6 <1
& &)6
& &&%*
&1<<
.
.
.
.
.
,
,
"he combined resistance between the electronic components on each strip and the heat frame can be
determined by adding the three thermal resistances in series to be
R R R R
"ertical epoxy a!hesi"e copper
= + + = + + =
,
. . . . 6<1 & &)6 &&&%* 6 <67 +' ,
"he temperatures along the heat frame can be determined from the relation
T T T QR
high lo
= =

. "hen,
T T Q R
T T Q R
T T Q R
T T Q R
T T Q R
T T Q R
1 & 1 & 1 &
* 1 * 1 * 1
% * % * % *
< % < % < %
) < ) < ) <
6 ) 6 ) 6 )
%&
%%*<
%6&)
%6 <*
<& %6
= + =
= + =
= + =
= + =
= + =
= +





+0/**.) ,./&.1<< +' ,. -


+0/17.) ,./&.1<< +' ,. -
+0/16.) ,./&.1<< +' ,. -
+0/1%.) ,./&.1<< +' ,. -
+0/1&.) ,./&.1<< +' ,. -
33$2% C
36$05 C
38$%2 C
%0$36 C
%1$87 C
=
= + =
= + =


<162
<* 7)
<%66
2 6 2 6 2 6
6 2 6 2 6 2
.

.
+0/2.) ,./&.1<< +' ,. -
+0/<.) ,./&.1<< +' ,. -
+0/1.) ,./&.1<< +' ,. -
%2$95 C
%3$60 C
%3$81 C
T T Q R
T T Q R
"he ma!imum surface temperature on the P+3 is
T T T Q R
"ertical "ertical ma!

. = = + =
7 6
<%61 +0/% ,./6.<67 +' ,. - 63$2 C
1)#*%
P+3
1) cm 16 cm
9po!y
adhesi$e
4eat frame
+old plate
R
copper

T
7
R
epo!y
R
adhesi$e
**.) , 17.) , 16.) , 1%.) , 1&.) , 2.) , <.) , 1.) ,
T
&
T
1
T
*
T
%
T
<
T
)
T
6
T
2
T
6
% ,
Chapter 15 Cooling of Electronic Equipment
15-63 A circuit board with uniform heat generation is to be conduction cooled by aluminum wires inserted
into it. "he magnitude and location of the ma!imum temperature in the P+3 is to be determined.
Assumptions 1 teady operating conditions e!ist 2 "hermal properties are constant. 3 "here is no direct
heat dissipation from the surface of the P+3.
Analysis "he number of wires in the board is
n = =
1)&
*
2)
mm
mm
"he surface areas of the aluminum wires and the
remaining part of the epo!y layer are

A n
D
A length i!th
A A A
alu um
total
epoxy total alu um
min
min
/ .
/ .
.
/ ./ . / .
. . .
= = =
= =
= = =

*
<
2)
& &&1
&&&&&)67
& &&%
&&&&<) & &&&&)67 & &&&%711
m.
<
m
m./&.1) m. - &.&&&<) m
m
*
*
*
*
+onsidering only half of the circuit board because of symmetry, the
thermal resistance of each material per 1#cm length is determined to be
R
L
kA
R
L
kA
alu um
epoxy
min
.
.
.
.
= =

=
= =

=
&.&1 m
/*%2 ,' m. +./&.&&&&)67 m
+' ,
&.&1 m
/&.*6 ,' m. +./&.&&&%711 m
+' ,
*
*
&216
76%<
ince these two resistances are in parallel, the e=ui$alent thermal resistance per cm is determined from
1 1 1 1
& 216
1
76 %<
& 211
R R R
R
boar! epoxy alu um
boar!
= + =

=
min
. .
.
+' , +' ,
+' ,
>a!imum temperature occurs in the middle of the plate along the *& cm length, which is determined to
be
T T T T Q R T R Q
en! boar! total en! i boar! cm en! boar! cm i ma! , , ,

= + = + = +
=

1 1
%& +0/&.211 +' ,./1)01%.)01* 01&.)07 02.)06 0<.)0%01.).,- 88$7 C
1)#*<
Double sided P+3
1* cm 1) cm
% mm
* mm
Aluminum
wire,
D - 1 mm
1) , 1%.) , 1* , 1&.) , 7 , 2.) , 6 , <.) , % , 1.) ,
%&+
T
ma!
R
board
1 cm
Chapter 15 Cooling of Electronic Equipment
15-6% A circuit board with uniform heat generation is to be conduction cooled by copper wires inserted in
it. "he magnitude and location of the ma!imum temperature in the P+3 is to be determined.
Assumptions 1 teady operating conditions e!ist 2 "hermal properties are constant. 3 "here is no direct
heat dissipation from the surface of the P+3.
Analysis "he number of wires in the circuit board is
n = =
1)&
*
2)
mm
mm
"he surface areas of the copper wires and the
remaining part of the epo!y layer are

A n
D
A length i!th
A A A
copper
total
epoxy total copper
= = =
= =
= = =

*
<
2)
& &&1
& &&&&)67
& &&%
& &&&<) &&&&&)67 & &&&%711
/ .
/ .
.
/ ./ . / .
. . .
m.
<
m
m./&.1) m. - &.&&&<) m
m
*
*
*
*
+onsidering only half of the circuit board because of symmetry, the
thermal resistance of each material per 1#cm length is determined to be
R
L
kA
R
L
kA
copper
epoxy
= =

=
= =

=
&.&1 m
/%66 ,' m. +./&.&&&&)67 m
+' ,
&.&1 m
/&.*6 ,' m. +./&.&&&%711 m
+' ,
*
*
.
.
.
.
&<<&
76 %<
ince these two resistances are in parallel, the e=ui$alent thermal resistance is determined from
1 1 1 1
& <<&
1
76%<
& <%6
R R R
R
boar! epoxy copper
boar!
= + =

=
. .
.
+' , +' ,
+' ,
>a!imum temperature occurs in the middle of the plate along the *& cm length which is determined to be
T T T T Q R T R Q
en! boar! total en! i boar! cm en! boar! cm i ma! , , ,

= + = + = +
=

1 1
%& +0/&.<%6 +' ,./1)01%.)01* 01&.)07 02.)06 0<.)0%01.).,- 66$1 C
1)#*)
1) , 1%.) , 1* , 1&.) , 7 , 2.) , 6 , <.) , % , 1.) ,
%&+
T
ma!
R
board
1 cm
Double sided P+3
1* cm 1) cm
% mm
* mm
+opper
wire,
D - 1 mm
Chapter 15 Cooling of Electronic Equipment
15-65 A circuit board with uniform heat generation is to be conduction cooled by aluminum wires inserted
into it. "he magnitude and location of the ma!imum temperature in the P+3 is to be determined.
Assumptions 1 teady operating conditions e!ist 2 "hermal properties are constant. 3 "here is no direct
heat dissipation from the surface of the P+3.
Analysis "he number of wires in the board is
n = =
1)&
<
%2
mm
mm
"he surface areas of the aluminum wires and the
remaining part of the epo!y layer are

A n
D
A length i!th
A A A
alu um
total
epoxy total alu um
min
min
/ .
/ .
.
/ ./ . / .
. . .
= = =
= =
= = =

*
<
%2
&&&1
& &&&&*7
& &&%
&&&&<) & &&&&*7 & &&&<*1
m.
<
m
m./&.1) m. - &.&&&<) m
m
*
*
*
*
+onsidering only half of the circuit board because of symmetry, the
thermal resistance of each material per 1#cm length is determined to be
R
L
kA
R
L
kA
alu um
epoxy
min
.
.
.
.
= =

=
= =

=
&.&1 m
/*%2 ,' m. +./&.&&&&*7 m
+' ,
&.&1 m
/&.*6 ,' m. +./&.&&&<*1 m
+' ,
*
*
1<))
71%6
ince these two resistances are in parallel, the e=ui$alent thermal resistance is determined from
1 1 1 1
1<))
1
71%6
1<%*
R R R
R
boar! epoxy alu um
boar!
= + =

=
min
. .
.
+' , +' ,
+' ,
>a!imum temperature occurs in the middle of the plate along the *& cm length which is determined to be
T T T T Q R T R Q
en! boar! total en! i boar! cm en! boar! cm i ma! , , ,

= + = + = +
=

1 1
%& +0/1.<%* +' ,./1)01%.)01* 01&.)07 02.)06 0<.)0%01.).,- 1%8$1 C
1)#*6
1) , 1%.) , 1* , 1&.) , 7 , 2.) , 6 , <.) , % , 1.) ,
%&+
T
ma!
R
board
1 cm
Double sided P+3
1* cm 1) cm
% mm
< mm
Aluminum
wire,
D - 1 mm
Chapter 15 Cooling of Electronic Equipment
15-66 A thermal conduction module with 6& chips is cooled by water.
"he junction temperature of the chip is to be determined.
Assumptions 1 teady operating conditions e!ist 2 4eat transfer
through $arious components is one#dimensional.
Analysis "he total thermal resistance between the junction and
cooling water is

R R R R R
total junction ater chip ernal external
= = + + = + + =
int
. . 1* 7 2 12 * +
"hen the junction temperature becomes

C 86.8 = + =

- +',. ,./12.* /< 0 + 16
ater junction ater junction
R Q T T

15-67 A layer of copper is attached to the bac5 surface of an epo!y board. "he effecti$e thermal
conducti$ity of the board and the fraction of heat conducted through copper are to be determined.
Assumptions 1 teady operating conditions e!ist 2 4eat
transfer is one#dimensional.
Analysis 4eat conduction along a layer is proportional
to the thermal conducti$ity#thic5ness product /kt.
which is determined for each layer and the entire P+3
to be
+ ,' &%6626 . & &&&&26 . & &%66 . & . / . / . /
+ ,' &&&&26 . & . m +./&.&&&% ,'m. *6 . & / . /
+ ,' &%66 . & . m +./&.&&&1 ,'m. %66 / . /
= + = + =
= =
= =
epoxy copper PCB
epoxy
copper
kt kt kt
kt
kt
"he effecti$e thermal conducti$ity can be determined from
C W/m. 96. =
+
=
+
+
=
m. &.&&&1 0 m /&.&&&%
+ ,' . &&&&26 . & &%66 . & /
. / . /
copper epoxy
copper epoxy
eff
t t
kt kt
k
"hen the fraction of the heat conducted along the copper becomes
99.8% = =

= = 776 . &
+ ,' &%6626 . &
+ ,' &%66 . &
. /
. /
PCB
copper
kt
kt
f
Discussion ?ote that heat is transferred almost entirely through the copper layer.
1)#*2
R
chip
+ooling
water
< ,
R
internal
@unction
R
e!ternal
Q
P+3
1) cm
*& cm
9po!y,
t - &.% mm
+opper,
t - &.1 mm
Chapter 15 Cooling of Electronic Equipment
15-68 A copper plate is sandwiched between two epo!y boards. "he effecti$e thermal conducti$ity of the
board and the fraction of heat conducted through copper are to be determined.
Assumptions 1 teady operating conditions e!ist 2 4eat
transfer is one#dimensional.
Analysis 4eat conduction along a layer is proportional
to the thermal conducti$ity#thic5ness product /kt.
which is determined for each layer and the entire P+3
to be

/ . / . .
/ . / ./ . . .
/ . / . . . .
kt
kt
kt kt kt
copper
epoxy
PCB copper epoxy
= =
= =
= + = + =
%66 &17%
* & *6 & &&1)6
&17% & &&1)6 &17<)6
,' m. +./&.&&&) m ,' +
,' m. +./&.&&% m ,' +
/ . ,' +
"he effecti$e thermal conducti$ity can be determined from
[ ]
C W/m. 29.9 =

+
=
+
+
=
m &.&&&) 0 m. &.&&% /*
+ ,' . 17% . & &&1)6 . & /
. / . /
copper epoxy
copper epoxy
eff
t t
kt kt
k
"hen the fraction of the heat conducted along the copper becomes
99.2% = =

= = 77* . &
+ ,' 17<)6 . &
+ ,' 17% . &
. /
. /
PCB
copper
kt
kt
f
15-69E A copper heat frame is used to conduct heat generated in a P+3. "he temperature difference
between the mid section and either end of the heat frame is to be determined.
Assumptions 1 teady operating conditions e!ist 2 4eat
transfer is one#dimensional.
Analysis ,e assume heat is generated uniformly on the
6 in 6 in board, and all the heat generated is
conducted by the heat frame along the 6#in side. ?oting
that the rate of heat transfer along the heat frame is
$ariable, we consider 1 in 6 in strips of the board.
"he rate of heat generation in each strip is /*& ,.'6 -
*.) ,, and the thermal resistance along each strip of
the heat frame is
('3tu h. 1<7 . &
ft. * ft./&.&6'1 (./6'1* 3tu'h.ft. /**%
ft /1'1*.
=

=
=
kA
L
R
frame
>a!imum temperature occurs in the middle of the plate
along the *& cm length. "hen the temperature
difference between the mid section and either end of
the heat frame becomes
F 12.8 =
= = =

- 3tu'h.,. 1 ,./%.<1* *.) 0 ) 0 2.) 0 & (.h'3tu./1 /&.1<7
1 , 1 , frame of edge # section mid ma! i in frame in frame i
Q R R Q T T

1)#*6
Q
1* cm
9po!y,
t - % mm
+opper,
t - &.) mm
P+3
6 in 6 in
4eat frame
+old plate
6 in
1& , 2.) , ) , *.) ,
T
mid
R
board
1 in
T
end
Chapter 15 Cooling of Electronic Equipment
15-70 A power transistor is cooled by mounting it on an aluminum brac5et that is attached to a li=uid#
cooled plate. "he temperature of the transistor case is to be determined.
Assumptions 1 teady operating conditions e!ist
2 +onduction heat transfer is one#dimensional.
Analysis "he rate of heat transfer by conduction is

/ . ./ Q
con!uction
= &6& 1* ,. - 7.6 ,
"he thermal resistance of aluminum brac5et and epo!y adhesi$e are

R
L
kA
R
L
kA
alu um
epoxy
min
.
.
= =

=
= =

=
&.&1 m
/*%2 ,' m. +./&.&&% m./&.&* m.
+' ,
&.&&&* m
/1.6 ,' m. +./&.&&% m./&.&* m.
+' ,
& 2&%
16)*
"he total thermal resistance between the transistor and the cold plate is
R R R R R
total case col! plate plastic epoxy alu um
= = + + = + + =

+' ,
min
. . . . *) 16)* & 2&% )&))
"hen the temperature of the transistor case is determined from
C 98.5 = + =

- +',. ,./).&)) /7.6 0 + )&
plate col! case
plate
col! case
R Q T T

1)#*7
* cm
* cm
Ai=uid
channels
"ransistor
Aluminum
brac5et

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