1

An Introduction to
Microelectromechanical Systems(MEMS)
Bing-Feng Ju, Professor
Institute of Mechatronic Control Engineering,
College of Mechanical and Energy Engineering,
Zhejiang University
P.R.China, 310027
Email: mbfju@zju.edu.cn
Tel: 86-571-8795-1730
Fax: 86-571-8795-1941
Presented to
Graduate students at
College of Mechanical and Energy Engineering
Zhejiang University
February to May 2010
Who am I?
Education: Ph.D. from Zhejiang University, 1999
MEng from Harbin Institute of Technology, 1996
BEng from Harbin Institute of Technology, 1994
(All degrees were in mechanical engineering; Ph.D. thesis in Precision Metrology)
Research and Teaching experiences:
2006.12-Present
College of Mechanical and Energy Engineering, Zhejiang University
Position: Professor (2007.12 Ph.D. Tutor Qualification)
2004.12-2007.04
Department of Nanomechanics, Tohoku University(), Japan
Position: Assistant Professor
2003.11-2004.11
Department of Nanomechanics, Tohoku University(), Japan
Position: JSPS Young Foreigner Scientist
2002.05-2003.11
DSO National Laboratories, Singapore
Position: Research Scientist
Adjunct Assistant Professor of National University of Singapore (NUS)
2000.05-2002.05
School of Mechanical & Aerospace Engineering,
Nanyang Technological University (NTU), Singapore
Position: Postdoctoral Research Fellow
Courses taught: BioMEMS, Precision & Nao Metrology
CONTENT
Self-introduction
1. Overview of MEMS and Microsystems
Working Principles of Microsystems
2. The Scaling Laws
Electromechanical Design of MEMS and Microsystems
3. Material for MEMS and Microsystems
Part 1: Silicon and silicon compounds
Part 2: Piezoelectric and polymers
4. Microfabrication Processes
Part 1: Photolithography, doping with ion implantation and diffusion
Part 2: Etching
Part 3: Depositions: physical, chemical and epitaxy
5. Micromanufacturing
Assembly, Packaging and Testing to Nanoscale Engineering
Part 1: Microassembly
Part 2: Packaging with surface and wire bonding
Part 3: Reliability and testing
6. Introduction to Nanoscale Engineering
Part 1: Overview of nanoscale engineering
Part 2: Material characterization and measurements
Textbooks:
1. MEMS and Microsystems: design and manufacture, by Tai-Ran Hsu, McGraw-Hill
Companies, Boston, 2002 (ISBN 0-07-239391-2)
MEMS2004
2. Albert P. Pisano, An Introduction to Microelectromechanical Systems Engineering, Artech
House, 2000
3. Marc Madou, Fundamentals of Microfabrication, CRC Press, 2002
4. VLSI1996
Journals:
1. Journal of MEMS
http://www.ieee.org/pub_preview/mems_toc.html
2. Sensors Journal, IEEE
http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?puNumber=7361
3. Journal of Micromechanics and Microengineering
http://www.iop.org/Journals/jm
Covering microelectronics and vacuum microelectronics, this journal focuses on fundamental
work at the structural, devices and systems levels, including new developments in practical
applications.
4. Sensors and Actuators A: Physical
http://www.elsevier.com:80/inca/publications/store/5/0/4/1/0/3/
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MEMS-Related Newsletters:
Micromachine Devices is a very thorough newsletter on MEMS and the MEMS industry. Contact
the editor Mr. Sid Marshall at:sid_marshall@msn.com for your free subscription.
R&D Magazine periodically contains articles on MEMS and related areas.
Alternative website: http://www.manufacturing.net/magazine/rd/index.htm
MST News based in Germany is a newsletter (available in English) which focuses on European
MEMS/MST activities. Also available from MST are "special reports" on US and Japanese
MEMS/MST activities.
Sensor Business Digest covers the sensor industry. Contact the editor Peter Adrian for
subscription information at: 415-345-7018.
Microtechnology News published by the Business Communications Company, Inc. (BCC) offers
an on-line sample issue. (http://www.vdivde-it.de/mst)
Nanotech Alert is a newsletter from John Wiley & Sons Technical Insights, covering the MEMS
and Nanotechnology industries. (http://www.wiley.com/technical_insights)
Sensors Magazine is a general magazine covering all aspects of the sensors industry.
(http://www.sensorsmag.com/)
Lecture 1Part I
Overview of MEMS and Microsystems
Unit
10
-9
m-nm:nano-meter
10
-6
m-m:micro-meter
10
-3
m-mm:milli-meter
10
-2
m-cm:centi-meter
10
-1
m-dm: deci-meter
10
-15
m-fm:femto-meter
10
-12
m-pm:pico-meter
10
-18
m-am:atto-meter
10
6
m-Mm:mega-meter
10
9
m-Gm:giga-meter
10
12
m-Tm:tera-meter
10
2
m-hm:hecto-meter
10
3
m-km:kilo-meter
10
1
m-dam:deca-meter
10
0
m-m:meter
WHAT IS MEMS?
MEMS = MicroElectroMechanical System
Any engineering system that performs electrical and mechanical functions
with components in micrometers is a MEMS. (1 m = 1/10 of human hair)
Available MEMS products include:
Microsensors (To sense and detect certain physical, chemical, biological
and optical quantity and convert it into electrical output
signal)
Microactuators (to operate a device component, e.g., valves, pumps, electrical
and optical relays and switches; grippers, tweezers and tongs;
linear and rotary motors; micro gyroscopes, etc.)
Read/write heads in computer storage systems.
Inkjet printer heads.
Microdevices components (palm-top reconnaissance aircrafts, toy cars, etc.)
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HOW SMALL ARE MEMS DEVICES?
They can be of the size of a rice grain, or smaller!
Three examples:
- Inertia sensors for airbag deployment systems
in automobiles
- A microcar
- Robot musician
Inertia Sensor for Automobile Air Bag Deployment System
Micro inertia sensor (accelerometer) in place:
(Courtesy of Analog Devices, Inc)
Sensor-on-a-chip:
(2 mm x 3 mm-
smaller than a
rice grain)
Micro Cars
(Courtesy of Denso Research Laboratories, Denso Corporation, Aichi, Japan)
Rice grains
Robot musician
(Waseda University, Japan)
Over 100 micro-sensors and micro-actuators by MEMS technology
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MEMS = a major milestone in
Miniaturization
A leading technology for the 21
st
Century, and
an inevitable trend in industrial products and
systems development
Miniaturization
An irresistible trend in the New Century
Miniaturization of Digital Computers
- A remarkable case of miniaturization!
The ENIAC Computer in 1946
A Lap-top Computer in 1996
A Palm-top Computer in 2003
Size: 10
6
down
Power: 10
6
up
Size: 10
8
down
Power: 10
8
up
This spectacular miniaturization took place in 50 years!!
The ENIAC computer
- 50 years later
Principal Driving Force for the 21
st
Century
Industrial Technology
There has been increasing strong market demand for:
Intelligent,
Robust,
Multi-functional, and
Low-cost industrial products.
Miniaturization is the only viable solution to satisfy such
market demand
Market Demand for Intelligent, Robusting, Smaller,
Multi-Functional Products - the evolution of cellular phones
Mobil phones 15 Years Ago:
Current State-of-the Art:
Transceive voice only
Transceive voice+ others
(Video-camera, e-mails, calendar,
and access to Internet; and a PC
with key board; GPS and multimedia
entertainment)
Size reduction
Palm-top Wireless PC
The only solution is to pack many miniature function components into the device
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Miniaturization Makes Engineering Sense !!!
Small systems tend to move or stop more quickly due to low mechanical inertia.
It is thus ideal for precision movements and for rapid actuation.
Miniaturized systems encounter less thermal distortion and mechanical vibration
due to low mass.
Miniaturized devices are particularly suited for biomedical and aerospace
applications due to their minute sizes and weight.
Small systems have higher dimensional stability at high temperaturedue to
low thermal expansion.
Smaller size of the systems means less space requirements.
This allows the packaging of more functional components in a single device.
Less material requirements mean low cost of production and transportation.
Ready mass productionin batches.
Enabling Technologies for Miniaturization
Miniature devices
(1 nm - 1 mm)
** 1 nm = 10
-9
m span of 10 H
2
atoms
Microsystems Technology
(MST)
(1 m - 1 mm)* Initiated in 1947 with the invention of
transistors, but the term Micromachining
was coined in 1982
* 1 m = 10
-6
m one-tenth of human hair
Nanotechnology (NT)
(0.1 nm 0. 1 m)**
Inspired by Feynman in 1959, with active
R&D began in around 1995
There is a long way to building nanodevices!
A top-down approach
A bottom-up approach
The Lucrative Revenue Prospects for
Miniaturized Industrial Products
Microsystems technology:
$43 billion - $132 billion* by Year 2005
( *High revenue projection is based on different definitions
used for MST products)
Nanotechnology:
$50 million in Year 2001
$26.5 billion in Year 2003
(if include products involving parts produced by nanotechnology)
$1 trillion by Year 2015 (US National Science Foundation)
An enormous opportunity for manufacturing industry!!
There has been colossal amount of research funding to NT by
governments of industrialized countries around the world b/c
of this enormous potential.
Major Industrial Applications
1. Automotive Industry:
Safety
Engine and Power Trains
Comfort and Convenience
Vehicle Diagnostics and
Health Monitoring
2. Healthcare Industry:
Diagnostics and Monitoring
Testing
Surgical Tools
Drug Discovery and Delivery
3. Aerospace Industry:
Instrumentations
Safety
Navigation and Control
Micro Satellites
4. Information Technology Industry:
Read/write Heads
Inkjet Printer Heads
Position Sensors
Flat Panel Displays
5. Telecommunication Industry:
Optical Switching for Fiber Optical
Couplings
RF Switches
Tunable Resonators, etc.
6. Industrial Products:
Manufacturing Process Sensors
Robotic Sensing
Sensors for HVAC Systems
Remote Sensing in Agriculture
Environmental Monitoring
7. Consumer Products:
Sporting Goods
Smart Home Appliances
Smart Toys and Games
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34290 6807 13033 1595 TOTAL
40 0.15 3 0.006 Microspectrometers
60 60 20 15 Magnetoresistive sensors
360 30 150 6 Gyroscopes
430 90 240 24 Accelerometers
800 0.4 220 0.01 Infrared imagers
800 400 300 100 Chemical sensors
1300 309 600 115 Pressure sensors
2000 7 1150 4 Hearing aids
2800 4000 450 700 In vitro diagnostics
3700 0.8 1000 0.5 Heart pacemakers
10000 500 4400 100 Inkjet printer heads
12000 1500 4500 530 Hard disk drives
Revenue
($ million)
2002 Units
(million)
Revenue
($ million)
1996 Units
(millions)
Product Types
MST Global Markets for Established Product Types
(Source: NEXUS 1998)
$34 billion +
4205 1045 107 33 TOTAL
5 0.05 0.1 0.001 Electronic noses
20 2 0.5 0.01 Anti-collision sensors
30 30 10 10 Injection nozzles
70 20 10 1 Inclinometers
80 2 5 0.1 Micromotors
100 50 0.1 Micro relays
100 600 10 20 Coil-on-chip
300 1 10 0.1 Projection valves
500 100 1 0.01 Magneto optical heads
1000 100 0 0 Lab-on-chip (DNA)
1000 40 50 1 Optical switches
1000 100 10 1 Drug delivery systems
Revenue
($ millions)
2002 Units
(millions)
Revenue
($ millions)
1996 Units
(millions)
Product Types
MST Global Market for Emerging Products
Source: NEXUS 1998
0
10
20
30
40
50
60
2000 2001 2002 2003 2004 2005
Year
R
e
v
e
n
u
e
, $
b
i
llio
n
Market Growth of MST Products
Source: NEXUS
Source: Nexus=Network of Excellence in Multifunctional Microsystems of European Community
$50 Billion
MEMS and Microsystems Devices and Products
Micro Sensors:
Acoustic wave sensors
Biomedical and biosensors
Chemical sensors
Optical sensors
Pressure sensors
Stress sensors
Thermal sensors
Micro Actuators:
Grippers, tweezers and tongs
Motors - linear and rotary
Relays and switches
Valves and pumps
Optical equipment (switches, lenses &
mirrors, shutters, phase modulators, filters,
waveguide splitters, latching & fiber alignment
mechanisms)
RF MEMS (oscillators, varactors, switches)
Microsystems = sensors + actuators
+ signal transduction:
Airbag deployment systems
Microfluidics, e.g. Capillary electrophoresis (CE)
Drug delivery systems with micropumps and valves
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Micro
Sensing
Element
Input
Signal
Transduction
Unit
Output
Signal
Power
Supply
MEMS as a Microsensor
Micro pressure sensors
Micro
Actuating
Element
Output
Action
Transduction
Unit
Power
Supply
MEMS as a Microactuator
Micromotor produced
by a LIGA Process
Components of Microsystems
Sensor
Signal
Transduction &
Processing
Unit
Actuator
Power
Supply
Microsystem
Microsystems = sensors + actuators + signal transduction
Typical Microsystems Products
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Inertia Sensor for Air Bag Deployment System
(Courtesy of Analog Devices, Inc.)
Inertia Sensor for Automobile Air Bag Deployment System
Micro inertia sensor (accelerometer) in place:
(Courtesy of Analog Devices, Inc)
Sensor-on-a-chip:
(the size of a
rice grain)
Unique Features of MEMS and Microsystems (1)
- A great challenge to engineers
Components are in micrometers with complex geometry
using silicon, si-compounds and polymers:
25m
25 m
A microgear-train by
Sandia National Laboratories
Capillary Electrophoresis (CE) Network Systems for Biomedical Analysis
A simple capillary tubular network with cross-sectional area of 20-30 m
is illustrated below:
Analyte
Reservoir,A
Analyte Waste
Reservoir,A
Buffer
Reservoir,B
Waste
Reservoir,B
Injection Channel
S
e
p
a
r
a
t
i
o
n

C
h
a
n
n
e
l
Silicon Substrate
Plug
Work on the principle of driving capillary fluid flow by applying electric voltages at the
terminals at the reservoirs. Fast separation of species in analyte sample for biomedical
Applications.
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Commercial MEMS and Microsystems Products
Micro Sensors:
Acoustic wave sensors
Biomedical and biosensors
Chemical sensors
Optical sensors
Pressure sensors
Stress sensors
Thermal sensors
Micro Actuators:
Grippers, tweezers and tongs
Motors - linear and rotary
Relays and switches
Valves and pumps
Optical equipment (switches, lenses &
mirrors, shutters, phase modulators,
filters, waveguide splitters, latching &
fiber alignment mechanisms)
Microsystems = sensors + actuators
+ signal transduction:
Microfluidics, e.g. Capillary electrophoresis (CE)
Micro accelerometers (inertia sensors)
INPUT:
Desired
Measurements
or
functions
Sensing and/or
actuating
element
Transduction
unit
Signal
Conditioner
& Processor
Controller Actuator
Signal
Processor
Measurements
Comparator
OUTPUT:
Measurements
or Actions
MEMS
Package on a single Chip
Intelligent Microsystems - Micromechatronics systems
Evolution of Microfabrication
There is no machine tool with todays technology can produce any device or MEMS
component of the size in the micrometer scale.
The complex geometry of these minute MEMS components can only be produced
by various physical-chemical processes the microfabrication techniques originally
developed for producing integrated circuit (IC) components.
Significant technological development towards miniaturization was
initiated with the invention of transistors by three Nobel Laureates, W.
Schockley, J. Bardeen and W.H. Brattain of Bell Laboratories in 1947.
This crucial invention led to the development of the concept of
integrated circuits (IC) in 1955, and the production of the first IC three
years later by Jack Kilby of Texas Instruments.
ICs have made possible for miniaturization of many devices and
engineering systems in the last 50 years.
The invention of transistors is thus regarded as the beginning of
the 3rd Industrial Revolution in human civilization.
Evolution of IC Fabrication
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Comparison of Microelectronics and Microsystems
Microelectronics Microsystems (silicon based)
Primarily 2-dimensional structures Complex 3-dimensional structure
Stationary structures May involve moving components
Transmit electricity for specific electrical functions Perform a great variety of specific biological, chemical,
electromechanical and optical functions
IC die is protected from contacting media Delicate components are interfaced with working media
Use single crystal silicon dies, silicon compounds,
ceramics and plastic materials
Use single crystal silicon dies and few other materials,
e.g. GaAs, quartz, polymers, ceramics and metals
Fewer components to be assembled Many more components to be assembled
Mature IC design methodologies Lack of engineering design methodology and standards
Complex patterns with high density of electrical
circuitry over substrates
Simpler patterns over substrates with simpler electrical
circuitry
Large number of electrical feed-through and leads Fewer electrical feed-through and leads
Industrial standards available No industrial standard to follow in design, material
selections, fabrication processes and packaging
Mass production Batch production, or on customer-need basis
Fabrication techniques are proven and well
documented
Many microfabrication techniques are used for
production, but with no standard procedures
Manufacturing techniques are proven and well
documented
Distinct manufacturing techniques
Packaging technology is relatively well established Packaging technology is at the infant stage
Primarily involves electrical and chemical
engineering
Involves all disciplines of science and engineering
Natural Science:
Physics, Chemistry
Biology
Mechanical Engineering
Machine components design.
Precision machine design.
Mechanisms & linkages.
Thermomechanicas:
solid & fluid mechanics, heat
transfer, fracture mechanics.
Intelligent control.
Micro process equipment
design and manufacturing.
Packaging and assembly design.
Quantum physics
Solid-state physics
Scaling laws
Electrical Engineering
Power supply.
Electric systems
design in electro-
hydrodynamics.
Signal transduction,
acquisition,condition-
ing and processing.
Electric & integrated
circuit design.
Electrostatic & EMI.
Materials Engineering
Materials for device
components & packaging.
Materials for signal
transduction.
Materials for fabrication
processes.
Process Engineering
Design & control of
micro fabrication
processes.
Thin film technology.
Industrial & Systems Engineering
Process implementation.
Production control.
Micro packaging & assembly.
Electromechanical
-chemical Processes
Material
Science
(Multidiscipline of MEMS.Slide presentation)HSU
Commercialization of MEMS and Microsystems
Major commercial success:
Pressure sensors and inertia sensors (accelerometers) with
worldwide market of:
Airbag inertia sensors at 2 billion units per year.
Manifold absolute pressure sensors at 40 million units per year.
Disposable blood pressure sensors at 20 million units per year.
Recent Market Dynamics
Old MEMS New MEMS
Pressure sensors
Accelerometers
Other MEMS
BioMEMS
IT MEMS for Telecommunication:
(OptoMEMS for fiber optical networks
RF MEMS for wireless)
Application of MEMS and Microsystems
in
Automotive Industry
52 million vehicles produced worldwide in 1996
There will be 65 million vehicle produced in 2005
Principal areas of application of MEMS and microsystems:
Safety
Engine and power train
Comfort and convenience
Vehicle diagnostics and health monitoring
Telematics, e.g. GPS, etc.
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(1)
(7)
(10)
(2)
(3)
(4)
(5)
(6)
(8)
(9)
(2) Exhaust gas differential
pressure sensor
(1) Manifold or Temperature manifold
absolute pressure sensor
(3) Fuel rail pressure sensor
(4) Barometric absolute pressure sensor
(5) Combustion sensor
(7) Fuel tank evaporative fuel pressure sensor
(6) Gasoline direct injection pressure sensor
(8) Engine oil sensor
(9) Transmission sensor
(10) Tire pressure sensor
Principal Sensors
Silicon Capacitive Manifold Absolute Pressure Sensor
Application of MEMS and Microsystems
in
Aerospace Industry
Cockpit instrumentation.
Wind tunnel instrumentation
Microsattellites
Command and control systems with MEMtronics
Inertial guidance systems with microgyroscopes, accelerometers and fiber optic gyroscope.
Attitude determination and control systems with micro sun and Earth sensors.
Power systems with MEMtronic switches for active solar cell array reconfiguration, and
electric generators
Propulsion systems with micro pressure sensors, chemical sensors for leak detection,
arrays
of single-shot thrustors, continuous microthrusters and pulsed microthrousters
Thermal control systems with micro heat pipes, radiators and thermal switches
Communications and radar systems with very high bandwidth, low-resistance radio-
frequency switches, micromirrors and optics for laser communications, and micro variable
capacitors, inductors and oscillators.
Sensors and actuators for safety - e.g. seat ejection
Sensors for fuel efficiency and safety
Application of MEMS and Microsystems
In Biomedical Industry
Disposable blood pressure transducers
Catheter tip pressure sensors
Biosensors
Pace makers
Respirators
Lung capacity meters
Barometric correction instrumentation
Medical process monitoring
Kidney dialysis equipment
Micro bio-analytic systems: bio-chips, capillary electrophoresis, etc.
Drug delivery systems
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Application of MEMS and Microsystems
in
Consumer Products
Scuba diving watches and computers
Bicycle computers
Sensors for fitness gears
Washers with water level controls
Sport shoes with automatic cushioning control
Digital tire pressure gages
Vacuum cleaning with automatic adjustment of brush beaters
Smart toys, e.g., fish, dogs, etc.
Application of MEMS and Microsystems
in the
Telecommunication Industry
Optical switching and fiber optic couplings
RF relays and switches
Tunable resonators
Micro lenses:
Micro switches:
Micro Optical Switches
2-Dimensional
3-Dimensional
Concluding Remarks
1. Miniaturization of machines and devices is an inevitable trend
in technological development in the new century.
2. There is a clear trend that microsystems technology will be further
scaled down to the nano level.
(1 nm = 10
-3
m = 10 shoulder-to-shoulder H
2
atoms).
3. Despite the fact that many IC fabrication technologies can be
used to fabricate silicon-based MEMS components, microsystems
engineering requires the application of principles involving multi-
disciplines in science and engineering.
4. Team effort involving multi-discipline of science and engineering is
the key to success for any MEMS industry.
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Lecture 1Part II
Working Principles of
MEMS and Microsystems
Due to the minute sizes, microactuators work on radically different
principles than the conventional electromagnetic means, such as
solenoids and ac/dc motors.
Instead, electrostatic, thermal, piezoelectric and shape-memory
alloys are extensively used in microactuations.
In this lecture we will learn the working principles of many microsensors and
actuators in MEMS and microsystems.
Minute sensors are expected to detect a variety of signals associated
with:
Accelerations (velocity and forces)
Pressure,
Chemical,
Optical,
Thermal (temperatures), humidity,
Biological substances,
etc.
Input samples may be: motion of a solid, pressurized liquids or gases,
biological and chemical samples.
Working Principles for Microsensors
Micro
Sensing
Element
Input
Signal
Transduction
Unit
Output
Signal
Power
Supply
BioMEMS
The term BioMEMS has been a popular terminology in the MEMS industry in
recent years due to the many breakthroughs in this emerging technology, which
many believe to be a viable lead to mitigate the sky-rocketing costs in health care
In many industrialized countries in which aging population is a common problem.
BioMEMS include the following three major areas:
(1) Biosensors for identification and measurement of biological substances,
(2) Bioinstruments and surgical tools, and
(3) Bioanalytical systems for testing and diagnoses.
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Major Technical Issues in BioMEMS Production:
(1) Functionality for the intended biomedical operations.
(2) Adaptivity to existing instruments and equipment.
(3) Compatibility with biological systems of the patients.
(4) Controllability, mobility, and easy navigation for operations
such as those required in laparoscopy surgery.
(5) Functions of MEMS structures with high aspect ratio
(defined as the ratio of the dimensions in the depth of the
structure to the dimensions of the surface)
Note: Almost all bioMEMS products are subjected to the approval
for marketing by the FDA (Food and Drug Administration)
of the US government.
Biomedical Sensors and Biosensors
These sensors are extensively used in medical diagnosis, environmental protection,
drug discovery and delivery, etc.
Biomedcial Sensors
For the measurements of biological substances in the sample and also for medical
diagnosis purposes.
Input signal: Biological sample (typically in minute amount in L or nL)
Microsensing element: a chemical that reacts with the sample.
Transduction unit: the product of whatever the chemical reactions between the
sample and the chemical in the sensing element will convert
itself into electrical signal (e.g. in millivolts, mV).
Output signal: The converted electrical signal usually in mV.
Example of a biomedical sensor:
A sensor for measuring the glucose concentration of a patient.
Pt electrode
Ag/AgCl Reference electrode
Polyvinyl alcohol solution
Blood sample
H
+
H
+
H
+
H
+
H
+
V
i
Working principle:
The glucose in patients blood sample reacts with the O
2
in the polyvinyl
alcohol solution and produces H
2
O
2
.
The H
2
in H
2
O
2
migrates toward Pt film in a electrolysis process, and builds up
layers at that electrode.
The difference of potential between the two electrodes due to the build-up of
H
2
in the Pt electrode relates to the amount of glucose in the blood sample.
Power
supply
Biosensors
These sensors work on the principle of interactions between the
biomolecules in the sample and the analyte (usually in solution)
in the sensor.
Signal transduction is done by the sensing element as shown
below:
B B
B B
ANALYTE
B
B
B
Sensor
Chemical
Optical
Thermal
Resonant
Electrochemical
ISFET (Ion Sensitive
Field Effect Transducer)
Output
Signals
Biomolecule
Supply
B
Biomolecule Layer
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Chemical Sensors
Work on simple principles of chemical reactions between the sample, e.g. O
2
and the sensing materials, e.g. a metal.
Signal transduction is the changing of the physical properties of the sensing
materials after the chemical reactions.
There are four (4) common types of chemical sensors:
(1) Chemiresistor sensors.
(2) Chemicapacitor sensors.
Chemically
Sensitive
Polyimide
Metal Insert
Metal Electrodes
Input current
or voltage
Output:
Change of Resistance
Input Voltage Output:
Capacitance Change
Measurand Gas
Chemical Sensors-Contd
(3) Chemimechanical sensors:
Work on certain materials (e.g. polymers) that change shapes when they
are exposed to chemicals. Measuring the change of the shape of the
sensing materials to determine the presence of the chemical.
(4) Metal oxide gas sensors:
Sensing materials: certain semiconducting materials, e.g. SnO
2
change
their electrical resistance when exposed to certain chemicals.
SnO
2
SiO
2
Electric Contact
Silicon Substrate
Measurand Gas
Chemical Sensors-Contd
O
3
None In
2
O
3
NO
2
, CO None MoO
3
CO Au Ga
2
O
3
CO Ti-doped + Au Fe
2
O
3
NH
3
Pt WO
3
Halogenated hydrocarbons V, Mo ZnO
H
2
S CuO SnO
2
H
2
, O
2
, H
2
S Sb
2
O
3
SnO
2
Alcohols Pt SnO
2
CO Pt + Sb SnO
2
CO
2
La
2
O
3
, CaCO
3
BaTiO
3
/CuO
Gas to be Detected Catalyst Additives Semiconducting Metals
Available metal oxide gas sensors:
Optical Sensors
These sensors are used to detect the intensity of lights.
It works on the principle of energy conversion between the photons in
the incident light beams and the electrons in the sensing materials.
The following four (4) types of optical sensors are available:
Photon Energy
Semiconductor B
Semiconductor A R
Photon Energy
R
(a) Photovoltaic junction
(b) Photoconductive device
V
out
_
+
R
Photon Energy
p-Material
n-Material
Bias
Voltage
Reverse
Bias
Voltage
Junction
p n
Photon Energy
Leads
(c) Photodiodes
A is more
transparent to
photon energy in
incident light
than B.

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Optical Sensors-Contd
n
p p
Base
Photon Energy
n
p p
Base
Collector Emitter Collector Emitter
P
h
o
t
o
n

E
n
e
r
g
y
(d) Phototransistors
Silicon (Si) and Gallium arsenide (GaAs) are common sensing materials.
GaAs has higher electron mobility than Si- thus higher quantum efficiency.
Other materials, e.g. Lithium (Li), Sodium (Na), Potassium (K) and
Rubidium (Rb) are used for this purpose.
Working Principle of Silicon Solar Photovoltaic (PV)
n-silicon (excessive electrons)
p-silicon (atoms with holes by unbalanced electrons)
Junction (weak dielectric)
-
+ + + + + + + + + + + +
- - - - - - - - - - - -
Electric field with 2 electrodes (a battery):
-
-
- - - - -
- - -
Extra electrons:
Photons from Sun
Migrating
Electrons
C
u
r
r
e
n
t
Pressure Sensors
Micro pressure sensors are used to monitor and measure minute gas
pressure in environments or engineering systems, e.g. automobile intake
air pressure to the engine.
They are among the first MEMS devices ever developed and produced for
real world applications.
Micro pressure sensors work on the principle of mechanical bending of
thin silicon diaphragm by the contacting air or gas pressure.
Cavity Cavity
Silicon Die
with
Diaphragm
Constraint
Base
Measurand
Fluid Inlet
Measurand
Fluid Inlet
(a) Back side pressurized
(b) Front side pressurized
Pressure Sensors-Contd
The strains associated with the deformation of the diaphragm are
measured by tiny piezoresistors placed in strategic locations on
the diaphragm.
Silicon
Diaphragm
Pyrex Glass
Constraining
Base or Metal
Header
Metal
Casing
Passage for
Pressurized
Medium
Silicone gel
Wire bond
Metal film
Dielectric layer
Piezoresistors
Die
Attach
Interconnect
R1
R3
R4
R2
Metal Pad Metal Pad
R1, R2, R3, R4 = Piezoresistors
Top view of silicon die
V
o
V
in
R
1
(+ve)
R
2
(-ve)
R
3
(+ve)
R
4
(-ve)
+
-
a
b
Wheatstone bridge for signal
transduction
These tiny piezoresistors are made
from doped silicon. They work on
the same principle as foil strain
gages with much smaller sizes (in
m) with much higher sensitivities
and resolutions.
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Pressure Sensors-Contd
Other ways of transducing the deformation of the diaphragm to electronic
output signals are available, e.g.,
Cavity
Constraint
Base
Measurand
Fluid Inlet
V
Metallic
Electrode
Metallic
Electrode
Silicon Die
Silicon Cover
Silicon diaphragm
1200 msq.x 100 m thick
Vibrating beam:
(n-type Si wafer,40 m wide
x 600 m long x 6 m thick)
Silicon die
(400 mthick)
Constraint base Pressurized medium
Diffused p-type
electrode
by capacitance changes
(for higher temperature applications)
by resonant vibration
(for higher resolutions)
MEMS microphones work
on this principle.
Major problems in pressure sensors involve the
packaging and protection of the diaphragm from
the contacting air or gas pressure.
Pressure Sensors-Contd
Thermal Sensors
Thermal sensors are used to monitor or measure temperature in an
environment or an engineering systems.
Common thermal sensors involve thermocouples and thermopiles.
Thermal sensors work on the principle of the electromotive forces (emf)
generated by heating the junction made by dissimilar materials (beads):
V
Heat
Bead
Metal Wire A
Metal Wire B
Voltage Output
(a) A thermocouple
V
Voltage Output
Metal Wire A
Metal Wire B
Cold
Junction
Hot
Junction
Heat
(b) A dual junction thermocouple
i
i
i
i
T V =
The generated voltage (V) by a temperature rise at the bead (T) is:
where = Seebeck coefficient
Thermal Sensors-Contd
The Seebeck coefficients for various thermocouples are:
-0.23 to 21.11 -50 to 1768 11.35 at 600
o
C Pt (13%)-Rh/Pt S
-6.26 to 20.87 -270 to 400 38.74 at 0
o
C Copper/constantan T
-0.24 to 18.70 -50 to 1768 10.19 at 600
o
C Platinum (10%)-Rh/Pt R
-6.55 to 54.87 -270 to 1372 39.48 at 0
o
C Chromel/alumel K
-8.10 to 69.54 -210 to 1200 50.37 at 0
o
C Iron/constantan J
-9.84 to 76.36 -270 to 1000 58.70 at 0
o
C Chromel/constantan E
Range (mV) Range (
o
C) Seebeck Coefficient
(V/
o
C)
Wire Materials Type
Common thermocouples are of K and T types
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Thermal Sensors-Contd
Thermopiles are made of connecting a series of thermocouples in parallel:
V
H
o
t

J
u
n
c
t
i
o
n
R
e
g
i
o
n
,

T
h
Cold Junction
Region, T
c
Thermocouples
The induced voltage (V) by the temperature change at the hot junction (T) is:
T N V =
with N = number of thermocouple pairs in the thermopile.
Thermal Sensors-Contd
A micro thermal sensor:
Hot
Junction
Region
32 Thermocouples
16 m wide
3
.
6

m
m
3.6 mm
Diaphragm: 1.6 mm dia
x 1.3 mthick
Cold Junction
Region
2
0

m
Hot Junction
Region
Thermocouples
Diaphragm
Silicon Rim
Support
Top view
Elevation
32 polysilicon-gold thermocouples
dimension of thermopile is:
3.6 mm x 3.6 mm x 20 m thick
Typical output is 100 mV
Response time is 50 ms.
Working Principles for Microactuators
Micro
Actuating
Element
Output
Action
Transduction
Unit
Power
Supply
Power supply: Electrical current or voltage
Transduction unit: To covert the appropriate form of power supply
to the actuating element
Actuating element: A material or component that moves with power
supply.
Output action: Usually in a prescribed motion.
Actuation Using Thermal Forces
Solids deform when they are subjected to a temperature change (T)
A solid rod with a length L will deform in length by L = T, in which
= coefficient of thermal expansion (CTE) a material property.
When two materials with distinct CTE bond together and subject to a
temperature change, the compound material will change its geometry
as illustrated below with a compound beam:
Heat

1
>
2
These compound beams are commonly used as microswitches and relays
in MEMS products.
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Actuation Using Shape Memory Alloys (SMA)
SMA are the materials that have a memory of their original geometry (shape)
at a typically elevated temperature of production.
These alloys are deformed into desired geometry at typically room temperature.
The deformed SMA structures at room temperature will return to their original
shapes when they are heated to the elevated temperature of their production.
Ti-Ni is a common SMA.
A micro switch actuated with SMA:
Constraint Base
Shape Memory Alloy Strip
e.g. TiNi or Nitinolor
Resistance Heating Strip
Silicon Cantilever Beam
Actuation Using Piezoelectric Crystals
A certain crystals, e.g. quartz, exhibit an interesting behavior when subjected
to mechanical deformation or electric voltage.
This behavior may be illustrated as follows:
V
Mechanical
Forces
A
p
p
l
i
e
d

V
o
l
t
a
g
e
,

V
Induced Mechanical
Deformation
Mechanical force induced
electric voltage
Electric voltage induced
mechanical deformation
This peculiar behavior makes piezoelectric crystals ideal candidate for
micro actuation as illustrated in the following case:
Actuation Using Piezoelectric Crystals-Contd
Constraint Base
V
Piezoelectric
Electrodes
Silicon Cantilever Beam
Actuation Using Electrostatic Forces
Electrostatic Force between Two Particles The Coulombs Law:
(with charge q)
(with charge q)
A
B
D
i
s
t
a
n
c
e
,
r
A
t
tr
a
c
tio
n
F
R
e
p
u
ls
io
n
F
2
'
4
1
r
qq
F

=
The attraction or repulsive force:
where = permittivity of the medium between the two particles
= 8.85 x 10
-12
C
2
/N-m
2
or 8.85 pF/m in vacuum (=
o
)
r = Distance between the particles (m)
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Electrostatic Force Normal to Two Electrically Charged Plates:
Actuation Using Electrostatic Forces-Contd
V
Gap, d
Length, L
W
id
th
, W
The induced capacitance, C is:
d
WL
d
A
C
o r o r
= =
The induced normal force, F
d
is:
2
2
2
1
V
d
WL
F
o r
d

=
in which
r
= relative permittivity of the dielectric material between the two plates
(see Table 2.2 for values of
r
for common dielectric materials).
Actuation Using Electrostatic Forces-Contd
Electrostatic Force Parallel to Two Misaligned Electrically Charged Plates:
W
d
L
F
d
F
w
F
L
V
Force in the Width direction:
2
2
1
V
d
L
F
o r
w

=
Force in the Length direction:
2
2
1
V
d
W
F
o r
L

=
Applications of Micro Actuations
Micromotors
Unlike traditional motors, the driving forces for micro motors is primarily the parallel
electrostatic forces between pairs of misaligned electrically charged plates
(electrodes), as will be demonstrated in the following two cases:
Linear stepping motors:
Two sets of electrodes in the form of plates separated by dielectric material
(e.g. quartz film).
One electrode set is fixed and the other may slide over with little friction.
The two sets have slightly different pitch between electrodes
Fixed set
electrodes:
Moving set
electrodes:
A
A B C D
Pitch:
w+w/3
W/3
Dielectric material
B C D
W W
W
Step Movements
Applications of Micro Actuations-Contd
Energize the set A-A will generate a force pulling A over A due to initial misalignment.
Once A and A are aligned, the pair B and B become misaligned.
Energize the misaligned B-B will generate electrostatic force pulling B over B.
It is now with C and C being misaligned.
Energize C and C will produce another step movement of the moving set over the
stationary set.
Repeat the same procedure will cause continuous movements of the moving sets
The step size of the motion = w/3, or the size of preset mismatch of the pitch
between the two electrode sets.
Fixed set
electrodes:
Moving set
electrodes:
A
A B C D
Pitch:
w+w/3
W/3
Dielectric material
B C D
W W
W
Step Movements
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Applications of Microactuations-Contd
Rotary stepping motors:
Involve two sets of electrodes - one set for the rotor and the other for the stator.
Dielectric material between rotor and stator is air.
There is preset mismatch of pitches of the electrodes in the two sets.
Applications of Microactuations-Contd
Working principle of this rotary motor is similar to that in linear motors.
Stator
Rotor
Gear for
transmitting
torque
A micro motor produced by Karlsruhe Nuclear Research Center, Germany:
Microvalves
Electric Resistance
Heating Rings
Flexible Silicon Diaphragm
Silicon
Base
Constraint Base
INLET FLOW
FLOW OUTLET
Centerline
A special microvalve designed by Jerman in 1990.
Circular in geometry, with diaphragm of 2.5 mm in diameter x 10 m thick.
The valve is actuated by thermal force generated by heating rings.
Heating ring is made of aluminum films 5 m thick.
The valve has a capacity of 300 cm
3
/min at a fluid pressure of 100 psig.
Power consumption is 1.5 W.
Micropumps
Electrode
Inlet
Check
Valve
Outlet
Check
Valve
Pumping Chamber
Deformable
Silicon
Diaphragm
Constraint
Base
V
Low Pressure
Fluid Inlet
High Pressure
Fluid Outlet
Electrostatically actuated micropump:
An electrostatic actuated pump in 1992.
The pump is of square geometry with 4 mm x 4mm x 25 m thick.
The gap between the diaphragm and the electrode is 4 m.
Pumping rate is 70 L/min at 25 Hz.
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Piezoelectrically actuated pump:
An effective way to pump fluid through capillary tubes.
Tube wall is flexible.
Outside tube wall is coated with piezoelectric crystal film, e.g. ZnO
with aluminum interdigital transducers (IDTs).
Radio-frequency voltage is applied to the IDTs, resulting in mechanical
squeezing in section of the tube (similar to the squeezing of toothpaste)
Smooth flow with uniform velocity profile across the tube cross section.
F V
Flexible Tube
Wall
Piezoelectric coating
with transducer
Flow
Micro Heat Pipes- a viable solution to cooling
in molecular electronics
Evaporator
Adiabatic Section Condenser
Heat Source
Heat Sink
Heat
Source
VAPOR
LIQUID
Heat
Sink
Cross-Sections
Elevation
Heat Source
Heat Sink
Vapor
Wick
Condensed
liquid
Wick Heat Source Heat Sink
Conventional Heat Pipes
Micro Heat Pipe
Sharp corners of microconduit
provide capillary driving pressure
for the return of condensed liquid
- no wicks is necessary
Microaccelerometers
Accelerometers are used to measure dynamic forces associated
with moving objects.
These forces are related to the velocity and acceleration of the moving
objects.
Traditionally an accelerometer is used to measure such forces.
A typical accelerometer consists of a proof mass supported by a spring and
a dashpot for damping of the vibrating proof mass:
Spring
k
Mass
M
Dashpot
with
damping
C
Vibrating
Solid Body
The accelerometer is
attached to the vibrating
solid body
Micro Accelerometers-Contd
Spring
k
Mass
M
Dashpot
with
damping
C
Vibrating
Solid Body
The accelerometer is
attached to the vibrating
solid body
The instantaneous displacement of the mass
y(t) induced by the attached moving solid
body is measured and recorded with respect
to time, t.
The associated velocity, V(t) and the acceleration
(t) may be obtained by the following derivatives:
2
2
) ( ) (
) (
) (
) (
dt
t y d
dt
t dy
t and
dt
t dy
t V = = =
The associated dynamic force of induced by the moving solid is thus obtained
by using the Newtons law, i.e. F(t) = M (t), in which M = the mass of the
moving solid.
In miniaturizing the accelerometers to the microscale, there is no room for the
coil spring and the dashpot for damping on the vibrating mass.
Alternative substitutes for the coil spring, dashpot, and even the proof mass
need to be found.
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Microaccelerometers-Contd
There are two types microaccelerometers available.
(1) The cantilever beam accelerometer:
Mass, M
Piezoresistor
Silicon Cantilever
Beam
Constraint Base
Casing
Constraint Base
Vibrating Base
In this design: Cantilever beam = coil spring;
Surrounding viscous fluid = dashpot for damping of the proof mass
The movement of the proof mass is carried out by the attached piezoresistor.
Microaccelerometers-Contd
(2) Balanced force microaccelerometer:
This is the concept used in the air-bag deployment sensor in automobiles
In this design: Plate beam = proof mass;
Two end tethers = springs
Surrounding air = dashpot
Stationary
electrodes
Moving electrode
The movement of the proof mass is carried out by measuring the
change of capacitances between the pairs of electrodes.
B
e
a
m
M
o
v
e
m
e
n
t
A
c
c
e
le
r
a
t
io
n
Inertia Sensors Unique Micromechatronics Devices
Working Principle of Balanced-
Force Accelerometers: Balanced-Force Accelerometers:
The need for integrating microelectronics (ICs)
and moving microstructures A great challenge!
A
c
c
e
le
r
a
tio
n
3 mm
2 mm
Diaphragm:
1m thick
Backplate (2 m)
Acoustic holes
Pressure equalization hole
Air gap (2 m)
Acoustic Wave Input
(air pressure wave)
dBMPa
C
Electrical signal output:
MEMS Microphones
Applications:
Beamforming microphone arrays for wind tunnels
Beamforming microphone arrays for smart hearing aids
Mobile telephones
Notebook and palm-top computers
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x
y
z
x
y
z
x
y
z
x
y
z
x
y
z
x
y
z
x
y
z
x
y
z
V
F
c

V F
c

V
F
c

V
F
c
(a)
(b)
(c)
(d)
Microgyroscopes
- for precision motion control
The Vectorial Representation of Coriolis Motion:
Proof
Mass
x x
y
y
Gyro Frame
y-Spring for
Force
Measurements
Resonator
for Linear Motion
Generation
x-Position
x-Spring
y-Position
A Microgyroscope Actuated by Electrostatic Forces
SUMMARY
MEMS and microsystems consist of sensors, actuators, power supply
and signal transducers.
Microsensors work on the principle of change of sensing material properties
in response to the substances to be sensed and detected.
Actuating forces for MEMS and microsystems are radically different from
traditional electromagnetic forces.
Microactuating forces include:
Electrostatic forces low in magnitudes, but fast responsransductioes
Thermal forces larger in magnitudes, but slow in response
Piezoelectric forces flexible in magnitudes, fast responses,
but with limited lasting power.
Signal transduction and power supply are two major challenging factors in
the design of microsystems.

1. PPT7
2. MEMSSensorPPT24
3. MEMSActuatorPPT25
4. MicrosystemPPT26
5. MEMS
Actuator(linear motor, miropump)
Sensor(Biosensor, Gas sensor, Pressure sensor)
MicrosystemPPT55-93
5. MEMS
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