This document describes the 2D modeling and simulation of stresses in solder joint connections between different materials commonly used in electronics, such as organic FR4 and ceramic Al2O3 and AlN, using both SnPb and SnAgCu solders. The study used ANSYS finite element analysis software to model various material combination structures under thermal cycling conditions. The results showed that ceramic materials experience much higher stresses than FR4, with AlN structures inducing the greatest stresses. Lead-free SnAgCu solder also resulted in higher stresses than SnPb solder for most material combinations. The maximum stresses occurred at the edges and interfaces of the solder joints.
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How to modelling a rebar embeded into a concrete beam? You will see the way or a treated way to modelling this issue in 2D.
This document describes the 2D modeling and simulation of stresses in solder joint connections between different materials commonly used in electronics, such as organic FR4 and ceramic Al2O3 and AlN, using both SnPb and SnAgCu solders. The study used ANSYS finite element analysis software to model various material combination structures under thermal cycling conditions. The results showed that ceramic materials experience much higher stresses than FR4, with AlN structures inducing the greatest stresses. Lead-free SnAgCu solder also resulted in higher stresses than SnPb solder for most material combinations. The maximum stresses occurred at the edges and interfaces of the solder joints.
This document describes the 2D modeling and simulation of stresses in solder joint connections between different materials commonly used in electronics, such as organic FR4 and ceramic Al2O3 and AlN, using both SnPb and SnAgCu solders. The study used ANSYS finite element analysis software to model various material combination structures under thermal cycling conditions. The results showed that ceramic materials experience much higher stresses than FR4, with AlN structures inducing the greatest stresses. Lead-free SnAgCu solder also resulted in higher stresses than SnPb solder for most material combinations. The maximum stresses occurred at the edges and interfaces of the solder joints.
2D Modelling of Stresses in Solder Joint Connection
Jindrich Bulva, Ivan Szendiuch
Dept. of Microelectronics, Faculty of Electrical Engineering and Communication, Brno University of Technology, Udolni 53, 602 00, Brno, Czech Republic Phone: +420 541 146 158, Fax: +420 541 146 298, Email: bulvaj@feec.vutbr.cz, szend@feec.vutbr.cz Abstract This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices organics FR4 and two ceramics material Al 2 O 3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu. Keywords (12 points bold): Thermomechanical modelling, solder joint, reliability, ANSYS, MSM
1 Introduction Fast development of semiconductor chips and demand for improvement in assembly technologies is closed generally to increased number of the soldered joints, which can have different and variable shape and performance. Most failures, which occur in electronic systems, are solder joint troubles caused by the thermal mismatch among different materials. Reason is use of materials with different Coefficient of Thermal Expansion (CTE) that are assembled together. During the manufacturing and use, the structure goes through various temperature cycles. Such temperature variations cause thermal expansion, but the materials cannot expand freely, because they are constrained by the packaged assembly. Therefore, significant stresses are induced in solder joints. These stresses can be mathematically modelled using ANSYS software, which is based on Finite Element Method (FEM). This software allows relatively quick and cheap analyses of strains and stresses, which occur in a device as a result of a temperature changes. The aim of this paper is to describe new approach to investigation solder joint reliability through computer, modelling. As today to reach low cost in production process is desirable, the behaviour forecast by mathematical modelling is more and more useful. ANSYS software is used for modelling influences of combination of materials are investigated and results from several analyses are discussed.
2 Multisubstrate Model Multisubstrate structure representing simple interconnection of two substrates with 25 solder bonds was modelled. Contacting pads are not considered in those simple analyses. 2.1 Geometry of Structure The modelled structure consists of two substrates, organic FR4 and ceramic one, Al 2 O 3 or AlN. Fig. 1 shows the cross-section geometry of structure with net of elements. Left figure represents ball solder joint with real shape. It is obvious, that balls are deformities during reflow process. Right figure shows cross-section of two substrates connected with five solder joints. All substrates have dimension 8x8mm. The organic substrate is 1mm thick and the thickness of both ceramics substrates is 0.5mm.
Fig. 1. Geometry of modelling structure a) Solder bump b) Multisubstrate modul 2.2 Material Properties The basic thermomechanical properties of using materials are listed in the Tab. 1 [1,2]. Element PLANE42 is used in the ANSYS program for meshing. PLANE42 is used for 2-D modeling of solid structures. The element can be used either as a plane element (plane stress or plane strain) or as an axisymmetric element. Four nodes having two degrees of freedom at each node define the element: translations in the nodal x and y directions [4]. Tab. 1. Mechanical and thermal properties of using materials Material FR4 Al 2 O 3 AlN SnPb SnAgCu Density [kg/m 3 ] 1500 3690 3260 8420 7250 Elastic modulus [GPa] -70 C 20 C 140 C
22
300
330
38.1 30.2 19.7
57.3 52.6 44 Poissons ratio 0.28 0.21 0.24 0.40 0.34 CTE [ppm/K] -55 C 22 C 100 C
18.5
8.1
4.5
24
12.7 22 23.4 2.3 Boundary Conditions ANSYS software is used for investigation thermomechanical stress, which comes up due to cooling from the solder melting temperature to the normal room temperature (20C). Melting temperature for eutectic solder SnPb is 183C and melting temperature for lead-free solder SnAgCu is 217C. Bottom substrate is fixed in left bottom corner in X and Y direction and in right bottom corner in Y direction to prevent rotation in space.
3 Results of Analyses The study is focused to mathematical modelling of thermomechanical stress within structure containing different materials. On the Fig. 2 is shown structure with one FR4 substrate and one Al 2 O 3 substrate connected with eutectic solder SnPb. Colour scale below structure shows numerical values of von Mises stress in terms of MPa. Deforming shape and edge of non- deformed shape are shown there. It can be seen that cooling causes different curtail substrates and stress is displacement to the alumina substrate and solder joint in the main. Maximal stress is in the outside solder joints, especially their upper edges. These are areas, where cracks can occur. The value of maximum stress in this area is approximately 305MPa. Areas above three middle joints are strained heavily too.
Fig. 2. Stress within the structure FR4-SnPb-Al 2 O 3
Fig. 3 shows connection of two ceramics substrates AlN with SnAgCu solder. There it can be seen, that problem is not connection of two different substrates but connection the same materials with solder. Deformation is not so big such as first example, but maximum stress is higher than the first. Highest stress occurs in top and bottom part of solder joints and its maximum value is approximately 330MPa. This figure shows strict symmetric of stress distribution within substrates.
Fig. 3. Stress within the structure AlN-SnAgCu-AlN Tab. 2 shows results of maximum values of stress of all combinations using materials. It can be seen, that the smallest stress have been occurred in the structure FR4-FR4. Lead free solder SnAgCu achieves better results (58MPa) than SnPb solder (86MPa) in this case. Using ceramics increase internal stress dramatically. If maximum value of stress in structure Al 2 O 3 - Al 2 O 3 will be compared, it can be seen, that the result is very similar for both solder compound. Difference between SnAgCu solder (230MPa) and SnPb solder (232MPa) is minimal. Sizable differences are for structures with AlN ceramic. The biggest difference between using lead- free or lead-contained solder is for structure AlN-AlN, where we obtained 286MPa for eutectic solder SnPb and 329MPa for lead-free solder SnAgCu. In the Tab. 2 it can be seen the influence of AlN ceramic too. Maximum stress occurs in all structures include it. The worst cases can be seen within combination ceramics AlN and lead- free solder SnAgCu in the Fig. 3, where stress achieves value 329MPa. Tab. 2. Maximum stress within modeling structure using SnPb and SnAgCu solder SnPb SnAgCu FR4 Al 2 O 3 AlN FR4 Al 2 O 3 AlN FR4 86 243 304 58 239 343 Al 2 O 3 243 232 280 239 230 316 AlN 304 280 286 343 316 329 4 Conclusion This work has focused on the 2D simulation and theromechanical analysis of improved multisubstrate modules concept. It has been demonstrated that reliability of structure strongly depends on the material properties of the structure. The results obtained from the various predictive models were compared. It can be said, that substrate FR4 is very yielding and its usage is possible with both types of solders, eutectic SnPb and lead- free SnAgCu. Connection of ceramics is better ensuring by eutectic solder SnPb due to its lower stress. It applies for AlN substrates especially.
Acknowledgments The paper has been prepared as a part of the research work under grant projects Research of Microelectronics Technologies for 3D systems GACR 102/04/0590, Modelling of Microelectronics Systems and Structures MSMT 1609, and with the support of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 MIKROSYT Microelectronic Systems and Technologies.
References [1] SZENDIUCH, I., SANDERA, J., BILEK, J. Multi Substrate Modules Cheap Solution for 3D Packaging. In Proceedings of The IMAPS Nordic Annual Conference. Stockholm, 2002, p. 114-122. ISBN 951-98002-4-7. [2] Accuratus Fine Technical Ceramics and Glasses, accessible from www.accuratus.com [3] BULVA, J., SZENDIUCH, I. Modelling of 3D Multimodule Substrate. In Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003. Gliwice, Poland, 2003, p. 126 129. ISBN 83-917701-0-9. [4] ANSYS 8.0 Complete Users Manual Set
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