SF-530 531P 550 Apollo2 SF-530

SAMSUNG FACSIMILE
SF-530/531P/550
SERVICE
Manual
SAMSUNG FACSIMILE
CONTENTS
1.
Precautions
2.
Specifications
3.
Disassembly and Reassembly
4. Troubleshooting
5. Exploded Views and Parts List
6.
Block Diagram
7. Connection Diagram
Electronics
This service manual is also provided on the web,

the ITSELF system Samsung Electronics Co., Ltd.
http://itself.sec.samsung.co.kr
Samsung Electronics Co.,Ltd. May 2003

Printed in Korea.
VERSION NO. : 1.05
CODE : JC-0059A
1. Precautions
Please read the following carefully to prevent any accidents and not to damage the unit during service.
1-1 Safety Precautions

1. Safety Precautions
There are some electric or machinery parts with safety
related property. If the parts replaced are different from
the original, the safety may not function. Even if the part
could allow higher voltage than that of the part used, do
not replace it and use a regular product clarified in specifications.
2. Be careful not to leave a switch, a cover or a safety device
out when reinstalling or assembling the product after
repair.
3. Replacing Precautions
Do not change or add parts as you like. You cannot benefit from such a remodeled product at your will during the
term of guarantee.
4. You must replace overheated or damaged parts or cords
with regular products. Please solve the problem causing
any damage or overheating and troubles beforehand.
LASER STATEMENT (LASERTURVALLISUUS)

WARNING : NEVER OPERATE AND SERVICE THE PRINTER
WITH THE PROTECTIVE COVER REMOVED
FROM LASER/SCANNER ASSEMBLY. THE
REFLECTIVE BEAM, ALTHOUGH INVISIBLE, CAN
DAMAGE YOUR EYES.
Class 1 laser product

Luokan 1 laserlaite
Klass 1 laser apparat
Allonpituus 770-795nm
Teho 0.3mW0.03mW
CAUTION
INVISIBLE LASER RADIATION WHEN

THIS COVER OPEN. DO NOT OPEN
THIS COVER.
VORSICHT
UNSICHTBARE LASERSTRAHLUNG,
WENN ABDECKUNG GEOFFNET.
NIGHT DEM STRAHL AUSSETZEN.
ATTENTION
Especially mind the safety on the part with this

mark.
You must use regular parts described in specifications for the parts inflammable and where the current can be flown. Otherwise any hazard such as
an electric shock or a fire could occur.
REYONNEMENT LASER INVISIBLE EN CAS

DOUVERTURE. EXPOSITION DANGERUSE AU
FAISCEAU.
ATTENZIONE RADIAZIONE LASER INVISIBLE IN CASO DI

APERTURA. EVITARE LESPOSIZONE LA FASCIO.
PRECAUCION REDIACION LASER INVISIBLE CUANDO SE

ABRE. EVITAR EXPONERSE AL RAYO.
CAUTION :
Avoid exposure to invisible laser radiation when the

development unit is not installed.
1-2 Precautions on Disassembly and Reassembly

Very careful precautions should be taken when replacing
parts. Before replacing, please check cables because you
cannot put the cables that you removed for replacing parts
into the proper place if you would not make sure of where
they were connected and in which condition.
7. When disassembling, assembling, also observe small

components are located in place.
8. If you uncover and turn the machine over to replace some
parts, toner or paper particles may contaminate the LSU
window. Protect the LSU window with clean paper.
Please do the following before disassembling

for a repair or replacement of parts.
1. Pull out paper cassette, printer cartridge installed.
Especially careful not to be scratched by the surface of
developer or not to expose them to light.
2. Turn the power switch off.
3. Take out the power plug, printer cable from the printer.
4. Use only the same type of part as original when replacing
parts.
5. Do not force to open or fasten plastic material components.
6. Be careful that small parts such as screws should not get
in the printer.
Samsung Electronics
Releasing Plastic Latches

Many of parts are held in
place with plastic latches.
The latches break easily :
release them carefully.
To remove such parts, press
the hook end of the latch
away from the part to which
it is latched.
1-1
Precautions
1-3 ESD Precautions

Certain semiconductor devices can be easily damaged by
static electricity. Such components are commonly called
Electrostatically Sensitive (ES) Devices, or ESDs.
Examples of typical ESDs are: integrated circuits, some field
effect transistors, and semiconductor chip components.
The techniques outlined below should be followed to help
reduce the incidence of component damage caused by static electricity.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
1. Immediately before handling a semiconductor component or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known
earth ground. Alternatively, employ a commercially available wrist strap device, which should be removed for your
personal safety reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with
ESDs, place the assembly on a conductive surface, such
as aluminum or copper foil, or conductive foam, to prevent electrostatic charge buildup in the vicinity of the
assembly.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static can
generate electrical charges sufficient to damage ESDs.
5. Do not use Freon-propelled chemicals. When sprayed,
these can generate electrical charges sufficient to damage ESDs.
6. Do not remove a replacement ESD from its protective
packaging until immediately before installing it. Most
replacement ESDs are packaged with all leads shorted
together by conductive foam, aluminum foil, or a comparable conductive material.
7. Immediately before removing the protective shorting
material from the leads of a replacement ESD, touch the
protective material to the chassis or circuit assembly into
which the device will be installed.
8. Maintain continuous electrical contact between the ESD
and the assembly into which it will be installed, until completely plugged or soldered into the circuit.
9. Minimize bodily motions when handling unpackaged
replacement ESDs. Normal motions, such as the brushing together of clothing fabric and lifting ones foot from a
carpeted floor, can generate static electricity sufficient to
damage an ESD.
3. Use only a grounded tip soldering iron to solder or desolder ESDs.
1-2
Samsung Electronics
Precautions
1-4 Tools for Troubleshooting

The following tools are recommended for safe and smooth troubleshooting described in this service manual.
1 DVM(Digital Volt Meter)
Standard: Indicates more than 3 digits.
4 Pinset
Standard: For general home use, small type.
5 Cotton Swab
Standard: For general home use, for medical service.
2 Electronic Scale
Standard: Equipment to check the weight of consumables(toner cartridge) . (The gram unit can
be measured.)
3 Driver
Standard: "-" type, "+" type (M3 long, M3 short,

M2 long, M2 short)
Equipments a IPA(Isopropyl
6 Cleaning
Alcohol)dry cloth or a soft stuff neutral
detergent.
7 Software(Driver) installation CD ROM
Note
Samsung Electronics
Mind your hands not to be touched when

you disassemble and reassemble PBA ASS'Y,
such as the main board, SMPS, HVPS.
1-3
2.Specifications
FAX
SF-530
ITEMS
General
Size(W*D*H)
370 X 356 X 195 mm
Weight
Power Rating
6.9 Kg (With accessories)

AC 110V ~ 120V 15%, 50/60Hz 3Hz
AC 220V ~ 240V 15%, 50/60Hz 3Hz
Temperature : 10 ~ 32C
Humidity : 20 ~ 85% RH
16*1 Char
NA
ECP(IEEE1284), USB
Operating Environment
LCD
Interface
Power
Print
Halftone
64 Level
Life
50000 Pages
Power Button
Input Voltage
No
110V~120V, 220V~240V
Power
Idle
10 W/H
Consumption
Max
140 W/H
Power Save Mode
OFF, 15, 30, 60 Min
Print Method
Speed
Laser
8ppm (FAX Print Out)
8ppm (PC Print & Fax Print)
NA
600 x 600 DPI
Print language
Toner Save
No
30 ~ 50 %
PrinThru
Scan Method
CIS
Quick Scan Speed
6 sec
3 sec
Resolution
200 x 200 DPI
300 x 300 DPI
Resolution
Scan
MFP
SF-531P
Normal
Scan Width
Max
Effective
216 mm
210 mm
Scan Length
Max
1000 mm
REMARKS
(Std Mode : 365 mm)

Copy
Speed
8 cpm
Resolution
600 x 600 DPI
Zoom Range
50 ~ 130 %
Collate/Reverse
Yes
Multi Copy
1 ~ 99
Samsung Electronics
50 ~ 200%
2-1
Specifications
FAX
SF-530
ITEMS
Telephone Handset
MFP
SF-531P
REMARKS
Yes
1-Touch Dial
20 EA
Speed Dial
80 EA
Group Dial
20 EA
Caller ID
Yes
(Germany, France, Canada, Australia, New Zealand, US)
TAD
No
TAD I/F
Yes
Tone/Pulse
Tone : US, UK, Korea
No Power Operation
No
Tone/Pulse : ETC
FAX
Earth/Recall
Yes
External Phone Transfer
Yes
Compatibility
ITU G3
Communication System
PSTN/PABX
Modem Speed
33.6Kbps Fax Modem
TX Speed
3sec
Using CCitt #1 Chart

with Standard Resolution
Compression
MH/MR/MMRc
Rcv. Mode
TEL, FAX, AUTO, ANS/FAX
ECM
Yes
DRPD
Yes
USA, New Zealand,

Australia, SEMI only
Resolution
Memory
Functions
Battery B/U
2-2
Std
203*98dpi
Fine
203*196dpi
S.Fine
203*392dpi
Capacity
2MB
Optional Memory
None
Voice Request
Yes
TTI
Yes
RTI
Yes
Polling
Yes
Flash
Yes
Auto Reduction
Yes
Broadcasting
20 EA (99 locations)
Forced Memory
Yes
Delay TX
20 Locations
Memory RX
Yes
RDC
Yes
20 EA(98 locations)
19 locations
Yes (Max 20 Min)
Samsung Electronics
Specifications
ITEMS
Paper
ASF
Handling
FAX
SF-530
Type
Input Capacity
Optional Cassette
Output Capacity
Output Control
Bypass
Media Type
BIN
150 Sheets / 20Ib
No
100Sheets / 20Ib
Face up
No
Plain Paper
Media Size
A4, Letter, Legal
Media Weight
Input Capacity
Media Weight
Software Compatibility DOS
Win 3.x
Win 95
Win 98
Win NT 4.0
Win 2000
Driver
Printer
TWAIN
PC-FAX
Media
CD-ROM
Diskette
Y2K Compliant
Including Software
16~24Ib
20 Sheets / 20Ib
12.5 ~32Ib
No
No
No
No
No
No
No
No
No
No
No
Yes
No
Special Direct E-mail Send

Features Fax Forward
Toner Save
Reprint
2-up FAX Receive
Scan to
PC-FAX
Toner
Life
Initial
Cartridge
Running
Toner Sensor Support
Method
Lock Key (With Printer & OEM)
Maintena ADF Rubber
nce Cycle Paper Feeding Roller
Transfer Roller
Fuser Unit
No
Yes
Yes
No
Yes
No
1,000 Pages
2,500 Pages
Yes
Software
Yes
10K Pages Scan
50K Pages Printer
60K Pages Print
50K Pages Print
ADF
Samsung Electronics
MFP
SF-531P
Yes
Plain, Coated, Transparency,
Envelop, Card, Post Card,
Label
Paper : A4, Letter, Legal,
Folio, Executive,
B5, A5
Envelop : 6 3/4, 7 3/4, #9,
#10, DL, C5,
B5, Baronial
16~43Ib
REMARKS
Envelop : Manual
feeding only
Yes
Yes
Yes
Provide After Launch Win 2000
Samsung PrinThru
Samsung ScanThru (TWAIN)
Samsung FaxThru
Yes
Print/Scan/Copy/Driver,
PC-Fax/ E-mail/ OCR Software
Yes
Yes (Only Last PC Print)

Yes
Using 4% Coverage Pattern
Using 4% Coverage Pattern
Dot Counting
2-3
3. Disassembly and Reassembly

3-1 General Precautions on Disassembly
When you disassemble and reassemble components, you must use extreme caution. The close
proximity of cables to moving parts makes proper
routing a must.
If components are removed, any cables disturbed
by the procedure must be restored as close as
possible to their original positions. Before removing
any component from the machine, note the cable
routing that will be affected.
Releasing Plastic Latches

Many of the parts are held in place with plastic
latches. The latches break easily; release them
carefully.
To remove such parts, press the hook end of the
latch away from the part to which it is latched.
Whenever servicing the machine, you must perform as follows:
1. Check to verify that documents are not stored in

memory.
2. Be sure to remove the toner cartridge before you
disassemble parts.
3. Unplug the power cord.
4. Use a flat and clean surface.
5. Replace only with authorized components.
6. Do not force plastic-material components.
7. Make sure all components are in their proper
position.
Samsung Electronics
3-1
3-2 Cradle
1. Push the lever and remove the cradle as shown
below.
00000
00000
00000000000
0000
00000
000000 0000000000000
00000
000000 0000000000000
1. Open the OPE cover.

A
Note : Check the Roller for any dirt. If dirty, wipe it off with
soft cloth dampened with water. If the Roller is
heavily worn, replace it with a new one.
Bushing
White Roller
Control Panel
3-2
00000000000
00000
3-3 White Roller
2. Push the bushing on the end of the Roller slightly

inward, then rotate it until it reaches the slot.
Then lift, the Roller out.
00000
00000
00
00000000000
00000
00000000000
0000
00
Samsung Electronics
3-4 OPE Cover

1. Pull the cover release button on both sides of the
machine, and open the front cover.
4. Remove two screws securing bracket scan board,

then take out the bracket scan board.
5. Unplug two connectors and one wire from the scan

board.
2. Remove two stoppers holding the front cover unit and

unplug one connector and one wire.
2
1
6. Lift the OPE cover.
2
1
3. Pull the bottom left end of the cover downward to

unlatch the front cover unit and remove the cover
from the main frame.
Samsung Electronics
3-3
7. Remove the stopper holding the OPE cover.
2
1
8. Unlatch the bottom ends, then remove the OPE

cover.
3-4
Samsung Electronics
3-5 ADF Rubber

1. Open the OPE unit.
2. Insert a flat blade screw driver and pinset into the slot
as shown below, and release the latches. Take out the
Holder Rubber, Sheet ADF and the Rubber ADF.
Guide Boss
Holder Rubber
Holder Rubber
Rubber ADF
Rubber ADF
Guide Boss
0000000000000
0000000000 00000
000000
000
Notes : When you reassemble the them, be sure that

the Rubber ADF and Holder Rubber fit into the
guide boss and the Holder Rubber latches fit
into the corresponding hole. Then push firmly
until it clicks.
00000
000000
Holder Rubber
000000
0000000 00000000
Rubber ADF
00000
000000
0000000000000
0000000000 00000
000000
000
000000
0000000 00000000
Safely Precautions :
Do not force to open or fasten plastic material
components.
3. Clean the surface of the rubber pad with IPA (Isopropyl

Alcohol). After wiping it, be sure to dry it. Check the rubber wear. If the wear reaches 1/2 its original thickness,
replace it with a new one.
Pinset or
Screw Driver
Samsung Electronics
3-5
3-6 OPE Board

1. Before you remove the OPE board, you should
remove:
3. Release two latches securing the both side of the

LCD and the two of four latches securing the board.
Then remove the OPE board.
OPE cover (see page 3-3)
2. Remove four screws securing the OPE board.
3-7 Lever Sensor Doc.

1. Unlatch the lever sensor Doc from the scan upper
frame and take it out.
3-8 Lever Sensor Scan

1. Push the both sides of Lever sensor Scan inward,
then unlatch and take out the sensor Scan from the
scan upper frame.
3-6
Samsung Electronics
3-9 Scan Board

1. Before you remove Scan board, you should remove:
Bracket scam board (see page 3-3)
2. Unplug all the connectors from the scan board and

remove the board.
3-10 Scan Motor

1. Before you disassemble Scan Motor, you should
remove:
Bracket scan board (see page 3-3)
4. Take out the gear from the Motor Assy.
5. Remove two screws and remove the motor.
2. Unplug one connector from the scan board.
3. Remove three screws, then remove the motor Assy

from the main frame.
Samsung Electronics
3-7
3-11 ADF Roller

1. Before you remove the ADF Roller, you should
remove:
3. Remove ADF Roller from the scan front frame.
ADF Roller
2. Remove two screws securing the guide paper and

remove the guide paper.
Guide Paper
3-12 CIS
1. Remove one screw and push CIS as shown below
and lift it.
2. Separate the Dummy CIS from CIS.
CIS
tape
3-8
Samsung Electronics
3-13 Rear Cover

1. Remove two screws.
2. Push the metal clip on the parallel port down and

remove the rear cover from the main frame.
3-14 Top Cover

1. Before you remove the ADF Roller, you should
remove:
Rear cover (see above)
3. Remove two screws and slide the left and right paper
guides fully inward. Then spread the bottom of the top
cover and lift the cover to remove.
Paper guides
2. Remove two screws securing the top cover from the

back side of the machine.
Samsung Electronics
3-9
3-15 Tray
1. Before you remove the tray, you should remove:
Rear cover (see page 3-9)
Top cover (see page 3-9)
2. Take out the tray from the main frame.
3-16 LSU
1. Before you remove the LSU, you should remove:
All covers (see page 3-3, 3-9)
3. Unplug two connectors from the LSU and remove the

LSU.
2. Remove three screws securing the LSU.
3-10
Samsung Electronics
3-17 Transfer Roller

1. Pull the cover release button on both sides of the
machine, and open the front cover.
2. Lift the transfer Roller using a proper tool (-Driver) and

take out the Roller.
3-18 Engine Board

1. Before you remove the Engine board, you should
remove:
2. Unplug five connectors and remove one screw from

the engine board, then remove the board.

LSU (see page 3-10)
Samsung Electronics
3-11
3-19 Pick-up Roller Assy

1. Before you remove the pick-up Roller Assy, you
should remove:
4. Remove two screws and remove the Roller from the

plate.

LSU (see page 3-10)
2. Unplug all the connectors from the engine board.
Note : When you reassemble the pick-up Roller, make

sure that the right end of the pick-up Roller fits
into the pick-up gear shaft.
3. Remove four screws securing the plate upper and

remove the plate upper as below.
Pick-up gear shaft
3-12
Samsung Electronics
3-20 Knock-up Assy

1. Before you remove the knock-up Assy, you should
remove:
3. Remove the knock-up Assy from the main frame.

LSU (see page 3-10)
Plate upper (see page 3-12)
2. Pull the knock-up Assy fully backward.
3-21 Cap-Pad
1. Before you remove the cap-pad, you should remove:
2. Take out the cap-pad from the main frame.

LSU (see page 3-10)
Knock-up Assy (see above)
Samsung Electronics
3-13
3-22 Holder-Pad
1. Before you remove the holder-pad, you should
remove:
LSU (see page 3-10)
Knock-up Assy (see 3-13)
Cap-Pad (see 3-13)
2. Remove the holder-pad from the main frame.
3-23 Motor Assy

1. Before you remove the motor Assy, you should
remove:
Note : When you reassemble the motor Assy, make

sure that the boss shown in the figure below fit
into the corresponding screw holes on the motor
Assy to allow the screws to be fastened properly.
2. Remove four screws securing the motor Assy and

unplug one connector from the engine board, then
remove the motor Assy.
Boss
3-14
Samsung Electronics
3-24 Fan
1. Before you remove the fan, you should remove:
All covers (see page 3-0)
Motor Assy (see page 3-15)
2. Unplug one connector from the engine board and

remove the fan.
3-25 Gear pick-up Assy

1. Before you remove the gear pick-up Assy, you
should remove:
2. Release two snap-fits and remove the gear pick-up

Assy from the main frame.
Note: When reassembling, make sure that the direction

of the gear is correct.
Samsung Electronics
3-15
3-26 Solenoid
1. Before you remove the solenoid, you should remove:
2. Unplug one connector from the engine board and

remove one screw, then remove the solenoid.
3-27 HVPS Board

1. Before you remove the HVPS board, you should
remove:
2. Remove three screws and one connector from the

HVPS board, then remove the board.
Note : when reassembling, make sure that the terminal

is five.
3-16
Samsung Electronics
3-28 Hook Board

1. Before you remove the hook board, you should
remove:
2. Unplug one connector from the main board and

remove two screws, then remove the hook board from
the main frame.
3-29 Fuser Assy

1. Before you remove the fuser Assy, you should
remove:
3. Remove two screws and unlatch the fuser Assy using

a proper tool.
2. Remove two wires after remove two screws from the

main frame and one connector from the inter connector.
Samsung Electronics
3-17
3-30 Thermostat
1. Remove one screw and remove the cover thermostat
from the fuser Assy.
2. Remove two screws and take out thermostat from the

fuser Assy.
3-31 Halogen Lamp

1. Before you remove the thermostat, you should
remove:
3. Remove the halogen lamp from the heat Roller.

Fuser Assy (see page 3-17)
2. On the fuser Assy, remove the two screws, then

remove the heat Roller.
3-18
Samsung Electronics
3-32 Pressure Roller

1. Before you remove the pressure Roller, you should
remove:
2. Lift and remove the pressure Roller from the main

frame.
3-33 Actuator-Exit
1. Before you remove the actuator-exit, you should
remove:
2. Lift and remove the actuator-exit from the main

frame.
Samsung Electronics
3-19
3-34 Shield Engine Assy

1. Before you remove the shield engine Assy, you
should remove:
2. Remove eight screws securing the shield engine

Assy and remove the shield engine Assy from the
main frame.
3-34 SMPS Board

1. Before you remove the SMPS board, you should
remove:
Shield Engine Assy (see page 3-19)
2. Remove four screws and three connectors, then

remove the SMPS board from the main frame.
3-20
Samsung Electronics
3-36 Speaker
1. Before you remove the speaker, you should remove:
SMPS board (see above)
2. Remove one connector that connects the speaker to

the main board and two screws securing the speaker,
then remove the speaker.
3-37 LIU Board

1. Before you remove the LIU board, you should
remove:
2. Remove three screws and three connectors from the

LIU board, then remove the board from the main
frame.
Samsung Electronics
3-21
3-38 Main Board

1. Before you remove the main board, you should
remove:
2. Remove four screws and all the connectors (9) from

the main board, then remove the board.
3-39 Sensor Board

1. Before you remove the sensor board, you should
remove:
2. Release four snap-fits securing the sensor board and

unplug one connector from the main board, then
remove the sensor board.
3-22
Samsung Electronics
3-40 Actuator Empty/Feeder

1. Before you remove the actuator empty/feeder, you
should remove:
3. Remove the Feed sensor and the Empty sensor.
Feed Sensor
2. Remove one connector from the main board and two

screws securing the holder feed Assy, then remove
the holder feeder Assy.
Empty Sensor
Samsung Electronics
3-23
3-41 Roller Feeder

1. Before you remove the actuator empty/feeder, you
should remove:
3. Rotate the pick-up bushing as shown below and

remove holder feeder Assy and Roller feeder.
All covers (see page 3-0)

Motor Assy (see page 3-15)
2. Release two snap-fits and remove the gear-feed,

clutch-feed, and the spring-clutch.
Spring-clutch
Gear-feed
4. Separate the Roller Feeder from the Holder Feeder

Assy.
Clutch-feed
Roller Feed
Holder Feed
3-24
Samsung Electronics
4. Troubleshooting
4-1 Preventative Maintenance
The cycle period outlined below is a general guideline for maintenance. The example list is for an average usage of 50 transmitted and received documents per day.
Environmental conditions and actual use will vary these factors. The cycle period given below is for reference only.
COMPONENT
SCANNER
CLEANING CYCLE
ADF Rubber
6 Months
10,000 Pages
ADF Roller
1 Year
20,000 Pages
White Roller
As Needed
10,000 Pages
CIS
As Needed
Cartridge
PRINTER
REPLACEMENT CYCLE
SOLUTION
2,500 Pages
Pickup Roller
60,000 Pages
Feed Roller
50,000 Pages
Transfer Roller
60,000 Pages
Fuser
50,000 Pages
4-2 Tech Mode

In Tech mode, the technician can perform various tests to isolate the causes of a malfunction, and set the technical option features to customize the machine depending on the users operation environment.
To access TECH mode

: Press SETUP, #, 1, 9, 3, 4 in sequence, and the LCD displays TECH in the standby mode screen. While in TECH mode,
the machine still performs all normal operations.
To return to the normal user mode
: Turn the power off, then back on.
The technical options you have set in TECH mode are not changed unless you clear the machines memory in TECH mode.
To communicate via direct connection with another fax machine, press OHD/V.REQ followed by Start/Enter.
Caution :
When you finish operating in Tech Mode, you must turn the power Off/On.
Samsung Electronics
4-1
Troubleshooting
4-2-1 System Data List in TECH MODE

Function
Item
Content
Default
FAX NUMBER/NAME
FAX NUMBER
FAX NAME
TIME/DATE SETUP
DATE FORMAT
TIME/DATE
EUROPE/USA
EUROPE
SYSTEM SETUP
LANGUAGE
SENDING MEMORY
SEND FROM CONFIRM
FAX PAPER SIZE
AUTO REDUCTION
DISCARD SIZE
RINGS TO ANSWER
STAMP RCV.NAME
RCV.START CODE
ECM MODE
CALLER ID
JUNK FAX BARRIER
DRPD MODE
ENG/GER/FRE/ITA/SPA/POR/DUT
ON/OFF
ON/OFF/ERROR
LETTER/A4/LEGAL
ON/OFF
0~30mm
1~7
ON/OFF
0~9
ON/OFF
ON/OFF
ON/OFF
ON/OFF
ENGLISH
ON
ERROR
A4
ON
20MM
2
OFF
*9*
ON
OFF
OFF
OFF
TECH MODE
MODEM SPEED
DIALING MODE
SEND FAX LEVEL
RCV. FAX LEVEL
FLASH TIME(RECALL TIME)
PAUSE TIME
REDIAL INTERVAL
REDIAL COUNT
DP MAKE/BREAK
SILENCE TIME
ERROR RATE
IGNORE TONER EMPTY
2.4/4.8/7.2/9.6/12.0/14.4/28.8/33.6
TONE/PULSE
0~15
40~50
80/280/600
1~9
1~15
0~5
40/60~33/67
UNLIMITED/12SEC
5%/10%
ON/OFF
26.4 KBPS
TONE
-12 DBM
-43DBM
80 MS
4 SEC
3 MIN
2
33/67
UNLIMITED
10%
OFF
GROUP DIAL SETUP
GROUP NO[1-20]
VOLUM SETUP
ALARM VOLUM
KEY VOLUM
ON/OFF
ON/OFF
ON
ON
MEMORY CLEAR
FAX NUMBER/NAME
DIAL/SCHEDULE
JOURNAL
DEFAULT SETUP
MAINTENANCE
CLEANING DRUM
ADJUST SHADING
REMOTE TEST
NOTIFY TONER LOW
ROM TEST
CIS TEST
DRAM TEST
SWITCH TEST
DTMF TEST
TONER COUNT
PRINTING INFO
PROGRAM DOWNLOAD
SCAN COUNT CLEAR
OFF/ON
OFF/ON
ROM OK! (VERSION)
DRAM OK
OFF/ON
COUNT CLEARING .
: Only Tech Mode
4-2
Samsung Electronics
Troubleshooting
4-2-2 Tech Mode Options

In TECH mode, press SETUP, then press
or
until
TECH MODE appears in the display. Press Start/Enter.
The following technical options are available.
Note : If necessary, print System Data List in TECH mode.

The list shows all current system data settings
including the TECH MODE options. To print the system data list, press Report/Help, then press
or
until SYSTEM DATA appears in the display, and press Start/Enter.
PAUSE TIME
Pause time mean delay time (unit: second) inserted
between dial number signal and the next number of signal
in the automatic dial (One touch, Speed dial, Redial) and
the manual dial.
Caution: The Send Fax Level is set at the best condition
in the shipment from factory. Never change settings arbitrarily.
REDIAL INTERVAL
Modem Speed
You can set the maximum modem speed.
Communication is done with modem speed automatically
set at lower speed when communicating with the modem
with lower speed since communication is done on the standard of the side where modem speed is low for transmission/reception. It is better set 26.4KBPS as default setting.
DIALING MODE
Select the dialing mode according to the user's line status.
TONE: Electrical type of dial
PULSE: Mechanical type of dial
If the remote machine is busy when the machine sends a

fax using automatic dialing, the machine automatically
redials the number. Select the time interval between automatic redial attempts. Enter the desired redial interval
using the number keypad: 1 - 15 minutes.
REDIAL COUNT
You can set times that redial automatically attempts when
automatic transmission is done or when the remote
machine is busy or when the machine send a fax. If there
is no response after redialing by the times already set,
redial is no longer attempted. No redial is attempted if the
settings is 0. Enter the desired times from 1 through 5.
DP Make/Break
SEND FAX LEVEL
Select the dial pulse make and break time: 40-60 or 33-67
You can set the level of the transmission signal. Typically,

the Tx level should be under -12 dBm. The level within the
range of 1 to -15 dBm is acceptable.
Caution: Send Fax Level is set at the best condition in the shipment from factory. Never change settings arbitrarily.

RCV FAX LEVEL

You can set the level of the receiving signal.
The reception level may be too low due to the cable losses.
If it is set to -43 dBm, the reception sensitivity will be
between 0 and -43 dBm. If it is set to -48 dBm, the reception sensitivity will be between 0 and -48 dBm.
SILENCE TIME
In ANS/FAX mode, after a call is picked up by the answering machine, the machine monitors the line.
If a period of silence is detected on the line at any time, the
call will be treated as a fax message and the machine
begins receiving.
Silence detection time is selectable between limited (about
12 seconds) and unlimited time.
When '2 sec' is selected, the machine switches to receiving mode as soon as it detects a period of silence. When
'unlimited'is selected, the machine waits until the answering operation is concluded even though a period of silence
is detected. After the answering operation is concluded,
the machine switches to receiving mode.
ERROR RATE
FLASH TIME
Set the flash time to 80, 280, or 600 milliseconds.
When the error rate is about to be over the setting value,

the Baud rate automatically lowers up to 2400 bps to make
the error rate remain below the setting value.
You can select the rate between 5% and 10%.
IGNORE TONER EMP

You can set this function ON if desiring to drive the engine
continuously even though the life of toner is run out and it
becomes Toner Empty status.
Samsung Electronics
4-3
Troubleshooting
4-2-3 Maintenance Options

In TECH mode, press SETUP, then press
or
until
MAINTENANCE appears in the display. Press Start/Enter.
The following technical options are available
CLEAN DRUM
Use this feature to get rid of the toner remained in the
development unit, so you can get a clean printout.Perform
this feature if stains or specks appear on the printing materials and print quality falls.
Perform this feature several times until a clean printing
material appears.
NOTIFY TONER LOW

With this feature enabled, when the toner becomes low, the
toner low information will be sent to ta specified contact
point, for example, the service company. After you access
this menu, select ON, and when the LCD prompts, enter
the name and the number of the contact point, the customer's fax number, the model name, and the serial number.
ROM TEST
Use this feature to test the machine'S ROM. The result and
the software version appear in the LCD display.
ADJUST SHADING
Use this feature to correct the white reference of the scanner if you experience bad copy images. When using this
feature, a white paper should be used to get clean copy
images.
Use this adjustment feature to achieve best image (scan)
quality depending on the characteristics of the CIS (Contact
Image Sensor) parts.
1. Select [ADJUST SHADING] from the Service Mode.
2. Insert a clean white original [Letter Size] into the paper
loading part.
3. Original is scanned if pressing the Setting button.
4. If the original scan is completed, message is displayed
on the LCD window and CIS SHADING PROFILE is
output.
If the output image is different from the normal screen, the
CIS is poor.
Caution:
1. Always perform the CIS TEST after downloading
Firmware. Otherwise, the system may not operate properly.
2. Always perform ADJUST SHADING after replacing the
CIS.
3. Always use a clean white paper in ADJUST SHADING
(Maximum paper width: Letter Size).
4. ADJUST SHADING may be performed even in the User
Mode but ADJUST SHADING profile is output only in the
TECH MODE.
REMOTE TEST
The Remote Test feature can be enabled in order to allow
a remote location to call up and run a diagnostic test on
your machine. You may be instructed by a service representative to enable this feature.
4-4
CIS TEST
This test checks the operation of the Contact Image Sensor
(CIS). Each time the number changes by one increment,
the average ADC value of CIS prints out.
DRAM TEST
Use this feature to test the machine's DRAM. The result
appears in the LCD display.
SWITCH TEST
Use this feature to test all keys on the operation control
panel. The result is displayed on the LCD window each time
you press a key.
MODEM TEST
Use this feature to hear various transmission signals to the
telephone line from the modem and to check the modem.
If no transmission signal sound is heard, it means that the
modem part of the main board is poor.
DTMF TEST
DTMF (Dual Tone Multi Frequency) signal. When you
press any key on the number keypad including and #, you
will hear the corresponding key tone.
TONER COUNT
This feature shows the current state of the toner cartridge.
TONER CNT: The total number of the dots used to print up
to current time.
CRU STATE: The page number which the toner cartridge
can print.
Caution : After replacing Main board to new one, you

should update the information to the new board.
Samsung Electronics
Troubleshooting
PRINTING INFO
Adjust Shading Sample Pattern
This feature allows the machine to automatically print various information, like toner count, transfer voltage, fusing
temperature and so on, at the bottom of each printed page.
PAGE TONER CNT: prints the number of dots used to print
the page.
TOTAL TONER CNT: prints the total number of the dots
used to print up to current time.
THV ON DUTY: prints ADC value of transfer voltage.
THERMISTER: prints ADC value of fusing temperature.
P: prints the page number.
PROGRAM DOWNLOAD
Use this feature to download a new upgraded ROM file
from a PC that is connected to the machine with a parallel
cable (IEEE 1284).
SCAN COUNT CLEAR

If performing this feature, the value of scanning original until
now is initialized (0). (Total scan count value on the system
data list becomes 0.)
Samsung Electronics
4-5
Troubleshooting
4-2-4 Printout Report

In TECH mode, press Report/Help, then select the desired
list or report by using
or
key, then press Start/Enter.
The following options are available
SCHEDULE INFORM
This list shows a specific information on the documents
currently stored for delayed transmission. It provides the
operation number, starting time, type of operation, etc.
HELP
It shows a brief description on the machine's basic functions and commands.Use it as a quick reference guide
SYSTEM DATA
This list provides a list of the user system data settings and
tech mode settings.
SENT JOURNAL
This journal shows a specific information concerning transmission activities, the time and dates of up to 40 of the
most recent transmissions.
PROTOCOL LIST
RECEIVED JOURNAL
This list shows the sequence of the CCITT group 3 T.30

protocol during the most recent sending or receiving operation. Use this list to check for send and receive errors. If
a communication error occurs while the machine is in
TECH mode, the protocol list will print automatically.
This journal shows a specific information concerning

reception activities, the time and dates of up to 40 of the
most recent receptions.
PATTERN PRINT
It lists all telephone numbers that have been stored in the

machine.
Using this pattern printout, you can check if the printer

mechanism is functioning properly. Examine the pattern
and look for a break in the diagonal line. If the diagonal
lines are not broken, the printer mechanism is functioning
properly.
SENDING CONFIRM
SHADING PRIN
It shows the result of the last send operation.
With this print, you can check the scanning elements of the
CIS (Contact Image Sensor).
PHONEBOOK
4-2-5 Engine Test Mode

The Engine test mode is used to check the operation of the
components related to the printer engine.
The following test are available.
To access the Engine Test Mode:
1. Press Setup, #, 1, 9, 3, 1 in sequence.
2. When ENGINE TEST? appears, press Start/Enter.
3. Scroll the options by pressing
or
repeatedly find
the one you want.
4. Press Start/Enter to start the test.
5. Press Stop to exit the Engine test mode.
Caution :
When you finish operating in Engine Test Mode, you must turn
the power Off/On.
Engine Test Mode Options :

1.
2
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
MAIN MOTOR TEST

PTL TEST
FAN TEST
FUSER TEST ( FUSER ON : 145C , FUSER OFF : 145C )
LSU MOTOR TEST
LD(LASER DIODE) TEST
HSYNC TEST (NG/OK)
LSU OPERATION TEST (NG/OK)
SENSOR TEST ( FEED , EXIT , PAPER EMPTY , COVER OPEN)
SOLENOID TEST
MHV TEST ( -1550 V )
DEV TEST ( - 430 V )
THV(+) TEST ( +1300 V )
THV(-) TEST
THV TRIGGER TEST
ALL FUNCTION TEST :
This function is for a manufacturing press . You can test
all function(1~15)
When you push the Start button, the Main Motor runs.
If you push the Start button again , the current test
stops, and the next test starts.
4-6
Samsung Electronics
Troubleshooting
4-2-6 Maintenance List

A number of reports can be printed from the fax machine
within the test mode. The protocol list all contain detailed
information which may be required when contacting technical support.
To printout the protocol list :

1. Get into the Tech mode by pressing Setup, #, 1, 9, 3, 4.
2. In Tech mode, press Report/Help.

3. Press
or
repeatedly until you find the Protocol
List. When you find PROTOCOL LIST, press ENTER.
SAMPLE OF A PROTOCOL DUMP LIST
Facsimile Information Field

data described in hexdecmal code
Sending/Receiving
Name of signal
(Facsimile Control Field)
PROTOCOL DUMP LIST
S/R
S
S
S
S
S
S
R
R
S
R
R
S
R
S
S
FCF
FIF data described

in ASCII code
OCT-20-1999 06:35
FIF DATA
ASCII
NSF 61005820003380140200001302090018010000
CSI 2020202020202020202020202O20202020202020
DIS 00000000 01110111 00010111 00100010
NSF 61005020003380140200001302090018010000
CSI 202020202020202020202022O202020220202020
DIS 00000000 01110111 00010111 00100010
TSI 2020202020202020202020202O20202020202020
DCS 00000000 01100001 00010101 00000000
FTT
TSI 2020202020202020202020202O20202020202020
DCS 00000000 01100001 00010101 00000000
CFR
MPS
MCF
DCN
< SAMPLE OF A PROTOCOL DUMP LIST >
Samsung Electronics
4-7
Troubleshooting
4-3 Diagnostics
This section describes methods and procedures to isolate the cause of a malfunction in the machine. This machine displays diagnostic information on the LCD. In addition, it can perform a series of tests that allow the machine to observe individual machine
functions.
4-3-1 Error Messages

Error Message
Description
Solution
DOCUMENT JAM
The loaded document has jammed in the feeder.
Clear the document jam.
DOOR OPEN
The top cover is not securely latched.
Press down on the cover until it clicks in

place.
FUSER ERROR
There occurs a problem in the fuser unit.
Unplug the power code and plug it back

in. If the problem still persists, please call
for service.
JAM/NO CARTRIDGE
Recording paper has jammed inside the unit, or

the toner cartridge is not installed.
Clear the jam, or install the cartridge
LINE ERROR
Your unit cannot connect with the remote

machine, or has lost contact because of a problem on the phone line.
Try again. If failure persists, wait an hour

or so for the line to clear, then try again.
Or, turn the ECM mode on.
LOAD DOCUMENT
You have attempted to set up a sending operation with no document loaded.
Load a document and try again.
LSU ERROR
There occurs a problem in the LSU

(Laser Scanning Unit).
Unplug the power code and plug it back

in. If the problem still persists, please call
for service.
The memory is full.
Either delete unnecessary documents, or

retransmit after more memory becomes
available, or split the transmission into
more than one operation.
NO ANSWER
The remote machine has not answered after all

the redial attempts.
Try again. Make sure the remote machine

is operational.
NO. NOT ASSIGNED
The one-touch or speed dial location you tried

to use has no number assigned to it.
Dial the number manually with the keypad, or assign a number.
MEMORY FULL
4-8
Samsung Electronics
Troubleshooting
Error Message
Description
Solution
NO PAPER
The recording paper has run out.
Load the recording paper.
OVER HEAT
The printer part in your unit has overheated.
Please wait until it cools down.

If you cannot solve the problem, please
call for service.
PAPER JAM 0
Recording paper has jammed in the paper feeding area.
Clear the jam.
PAPER JAM 2
Jammed paper still remains inside the unit.
Clear the jam, or install the cartridge
POLLING ERROR
The remote fax machine you want to poll is not

ready to respond to your poll.
Or When setting up to poll another fax machine,
you have used an incorrect poll code.
The remote operator should know in

advance that you are polling and have
their fax unit loaded with the original document. Enter the correct poll code.
POWER FAILURE
A power failure has occurred.
If documents have been stored in the

memory, a Power Failure Report will be
printed automatically when the power is
restored.
RECEIVE ERROR
A fax has not been received successfully.
A problem with the facsmile communications has occurred. Ask the sender to try
again.
RETRY REDIAL ?
The machine is waiting for a specified time interval to redial a previously busy station.
You can press Start to immediately redial, or Stop to cancel the redial operation.
SEND ERROR
Your fax has not gone through successfully.
A problem with the facsmile communications has occurred. Try again.
TONER EMPTY
The toner cartridge has run out. The machine

stops.
Replace with a new toner cartridge.
TONER LOW
The toner is almost empty.
Take out the toner cartridge and gently

shake it. Using this way, you can temporarily re-establish the print quality.
WARMING UP
The printer is warming up and is off-line.
Wait until the printer is on-line.
Samsung Electronics
4-9
Troubleshooting
4-4 Print Quality

No
Roller
Abnormal image period
Kind of abnormal image
OPC Drum
75.4mm
White spot on black image

Black spot
Charge Roller
37.7mm
Black spot
Supply Roller
26.8mm
Horizontal density band
Develope Roller
31.6mm
Horizontal density band
Transfer Roller
47.1mm
Black side contamination/transfer fault
Heat Roller
50.1mm
Black spot, White spot
Pressure Roller
50.2mm
Black side contamination
4-5 Note for replacing Main board

When you replace the main board to new one, the information on the toner state is cleared. Therefore, you should
update the information to the new board by entering the
exact value of total toner count and specifying the toner cartridge installed currently is shipped with the machine or new.
If not, TONER LOW/EMPTY message may not appear
when the toner is run out.
1. In Tech mode, print SYSTEM DATA LIST. The list

includes the total toner count and CRU state information.
TOTAL TONER COUNT: The total number of the dots
used to print up to current time.
CRU STATE: The page number which the toner cartridge can print. (The yield of a new toner cartridge is
approximately 2,500 pages and that of the cartridge
supplied with the machine is approximately 1.000
pages.)
4-10
2. Replace Main board.
3. In Tech mode,
3-1) Press Setup, and find MAINTENANCE by pressing
repeatedly
or
, then press Start/Enter.
3-2) When TONER COUNT is displayed in LCD, press
Start/Enter, and enter the value of the total toner
count in the system data list.
3-3) When you are prompted to enter CRU STATE, press
Start/Enter.
3-4) When you see [1.1000 2.2300] in LCD, select the
value of the CRU state in the system data list.
4. In Tech mode, print SYSTEM DATA LIST and make sure

that the toner information is updated.
Samsung Electronics
Troubleshooting
4-6 Troubleshooting Flow Chart

Vertical black line and band
OK after replacing
developer?
YES
Any obstacles on
the developer blocking
the laser beam.
NO
Replace the developer
YES
NO
OK after
removing the
obstacles?
NO
YES
END
OK after
replacing the LSU?
NO
Remove part on the paper

path causing the trouble
YES
Any obstacles ON
mirror lens of LSU and
laser path?
NO
Replace the LSU
YES
Remove the obstacles.
Samsung Electronics
4-11
Troubleshooting
No Image
No image?
A on
next page
NO
YES
Self test
pattern prints?
YES
Check connection to
computer or replace
controller
NO
Self testing
is possible via
Tech Mode?
NO
Re-test after replacing the

conector or Main board
YES
Take out the cartridge

and prepare the tester
for electronic connection
Is the OPC
terminal of machine
is well-connected
to Frame?
NO
Repair or replace the GND

terminal
YES
Does the
video data line to
LSU transit to High/Low
when printing?
NO
Check the path between

video controller, engine board
and HVPS. Repair or replace
the defective component
or board
YES
The mirror in LSU might be

misplaced so the light path to the
OPC deviates ->Repair or replace
LSU or remove any deffective
matters in the machine
4-12
Samsung Electronics
Troubleshooting
Is the
connection of
OPC GND and Frame Ground
correct? (less than
10 )
Check the connection of

frame Ground and OPC GND
YES
Trnasfer
voltage OK? (on the
transfer roller
shaft)
NO
YES
Are the
connection terminal
and connection
correct?
NO
Repair or replace terminal
YES
Replace HVPS or repair defective component
Developing
(-350V) and supplying
(-550V) voltage
are OK?
NO
Is the connection
terminal OK?
NO
Repair or replace terminal
YES
YES
Replace HVPS or repair defective component
Does the
counter indicate over
the toners guarranty
life
NO
Transfer roller might be out of its location

-> Locate the roller into its place
This could occurrs when he power of LSU is low or
the density is low due to the obstacles on the window
-> Replace LSU or clean the window
YES
Replace the toner cartridge
Samsung Electronics
4-13
Troubleshooting
Light image
Is it not over
the guaranty life of dot
counter?
NO
YES
Is the toner save

mode or the light mode
is selected?
YES
Ok after setting to the

normal mode?
NO
Is the high voltage

normal? (charging,
developing,
transfer)
YES
END
NO
NO
Replace the HVPS

YES
YES
NO
Any obstacles on the

gab between high voltage
terminal and
developer?
YES
YES
HVPS works OK?
Remove the obstacles
NO
Transfer roller
works OK?
NO
Clean transfer roller

and gear holder
YES
OK after replacing
LSU?
YES
Replace the LSU
NO
4-14
Samsung Electronics
Troubleshooting
All Black
All black in
printing area?
NO
YES
Does the
video data line to LSU
transit to High/Low when
printing?
NO
Check the path among video

controller, engine board,
HVPS, LSU for the shortage
or open -> Repair or replace
the boards
YES
Replace LSU
Is transfer
voltage supplied
(-1.55 KV)?
NO
Repair or replace HVPS
YES
Is the
Hsync/ signal received
in LSU?
NO
Replace LSU
YES
Transfer parts contact

is bad -> Repair or
replace toner cartridge
Samsung Electronics
4-15
Troubleshooting
Vertical White Line (Band)
White line
missing definitely?
NO
Check if the
printout is still has the
same problem even right after
passed through the
transfer roller
YES
YES
NO
The ribs in fuser or toner on the roller may invoke

the image problem
-> Replace the fuser cover or the defective part
Dirt of dust stuck onto the window of internal

lens of LSU
-> Clean it or replace LSU
The image is originally black or the black part is

far close to the top
-> Use the pattern which has the image below bigger
than 10mm from the top
Preventive obstacles through the path between

OPC of developer and LSU prevent the path
-> Remove the obstacles
Does the problem

persist?
NO
END
YES
Toner material might be stuck to blade in the developer

inside and it prevents toner supply
-> Replace the toner cartridge
Check both if the toner cartridges counter is over its
guaranty and amount of the toner material
4-16
Samsung Electronics
Troubleshooting
Dark Image
NO
Dark selected
via RCP?
YES
Change to
Normal and test
NO
Same at Normal?
END
YES
Works cor
with -350V of Bias
voltage?
NO
Repair or replace the defective

component
YES
Works
correctly after
replaced LSU?
NO
Toner over supply due to the

adjustment fault of metering
blade in developer
-> Replace developer
YES
The power of LSU is set

high or internal problem
-> Replace LSU or adjust
voluem
Samsung Electronics
4-17
Troubleshooting
Background
Recommended
paper used?
NO
Print 20 to 30 pages using

the recommended paper
YES
Replace transfer
rollers holder
NO
Is pressure of
transfer roller too high?
Does the operation of
TR work properly?
YES
NO
Same problem
occurs?
END
YES
Transfer,
charge and developing
voltage are OK?
- Adjust voltage or replace HVPS

NO
- Repair or replace after checking the
terminals contacts
YES
Operating/
storage atmosphere is
too high temperature
/humidity?
YES
Solve the problem under

the recommended condition
(10-32 degree Centigrade)
NO
Dirt or
dust around the
charge roller?
NO
Replace the
toner cartridge
YES
Clean the charge roller

or replace step-up device
/terminal after check
Check Terminals or contacts and Guide-Deve Spring

are misplaced
-> Repair or replace transfer roller etc.
NO
Work OK?
YES
Internal blade or suppying

part of the developer is
defective
4-18
Samsung Electronics
Troubleshooting
Ghost
Clean transfer rollers holder and

TR drive gearor replace TR holder assy
NO
Is it regular
interval of 75.4mm?
NO
Is it regular
interval of 31.6mm?
NO
NO
YES
YES
Is it regular
interval of 47mm?
(as transfer roller
interval)
Is it regular interval of
50.4 mm?
NO
Developing
/suppying voltage
normal? (-350V/
-550V)
Transfer
voltage is set to
standard?
YES
Irregularity of NIP
between rollers in
developer
Does
the operation
of TR work properly?
YES
Clean TR drive
and OPC gear
NO
YES
YES
Check HVPS
contacts and
HVPSs self-output
-> If failed, repair/
replace HVPS
YES
Clean heat roller

or replace it
- Repair or replace HVPS

- Check and Repair or
replace the terminal
contacts
Does the same

problem persist?
YES
NO
END
A specific part of the transfer roller has

ruined or its resistance value is changed
-> Replace transfer roller
Bias voltage
is OK? (-350V)
NO
Adjust the Bias

voltage or replace HVPS
Transfer roller cannot force regularly due

to the gears eccentricity of transfer roller
-> Replace the defective component
YES
Operating/storage
temperature is too low or
not recommended
paper used?
NO
There may be a problem in toner

layer control in toner cartridge
-> Replace the developer
YES
Use the machine with

recommended paper and
at condition
Samsung Electronics
4-19
Troubleshooting
Black Spot
Is it regular
interval of 37.7mm?
NO
YES
Is it regular
YES
interval of 75.4 mm?
NO
Perform the OPC

cleaning using
the control panel
buttons.
When taking
out the cartridge,
toner leaks?
YES
Toner leaks and toner

material dropped onto
the paper -> Replace the
developer
Does the same

problesm
persist?
Remove obstacles
stuck on OPC
drums surface
YES
NO
Bad image
removes by
scratching?
NO
YES
The problem
randomly occured
due to the toner
fallen -> Clean the
machine
Check toner is stuck onto

the P/R or H/R in fuser
-> Clean it or replace
The problem occured

since the obstacles
stuck to charge roller
-> Replace toner cartridge
NO
END
4-20
Samsung Electronics
Troubleshooting
Horizontal Band
Black band?
NO
Black band
is far about 10mm from
white band?
NO
YES
The OPC is damaged under the

direct sunlight for around 5
minutes -> If the same problem
persists in 10 hours, replace
the developer
Problem of internal
contacts in OPC
The black
band has regular
interval?
NO
This occurs when no

Hsync/ at LSU
-> Replace LSU
YES
75.4 mm interval?
NO
YES
The OPC is damaged due to

the irregular transfer voltage
of HVPS
-> Repair/replace HVPS
-> If the same problem persists,
replace the developer
Samsung Electronics
Does it appear
at every 56.1mm at
specific place?
YES
NO
Problems of terminal contact,

transfer voltage supplying,
and transfer rollers due to the
charge roller is ruined (37.7mm)
-> Repair/replace HVPS,
developer
Heat roller is ruined

-> Replace the roller
4-21
Troubleshooting
Toner Contaminations on Back of Paper
Transfer roller
is clear ?
NO
Clean the transfer roller
YES
Paper path is
clear ?
NO
Clean the paper path
YES
Clean the pressure roller
4-22
Samsung Electronics
Troubleshooting
Partial Blank Image (not Periodic)
Is it not over
counter?
NO
YES
Is toner cartridge
installed correctly?
NO
Install the toner cartridge correctly
YES
Transfer roller
works properly?
NO
Clean the TR holder, the TR gear,

OPC roller gear and the transfer roller
YES
- Clean the contact point of transfer roller

- Check the output of high voltage terminal
and adjust or replace if required
Samsung Electronics
4-23
Troubleshooting
Partial Blank Image (Periodic)
Is it not over
counter?
NO
YES
Is toner
cartridge installed
correctly?
NO
Install the toner cartridge

correctly
YES
Is it regular
interval of 47.1mm?
YES
Transfer roller
works properly?
NO
Clean the TR holder, the TR

gear OPC roller gear and the
transfer roller
YES
END
YES
NO
OK after
replacing the transfer
roller?
NO
- Clean the contact point of
transfer roller.
- Check the output of high
voltage terminal and adjust or
replace if required.
Is it regular
interval of 75.4mm, 31.6mm
or 37.7mm?
YES
Replace the toner cartidge
NO
Replace the fuser
(50.2mm, 45.2mm or exit roller
4-24
Samsung Electronics
Troubleshooting
Irregular Density
OK after
taking out and
rocking the toner
cartridge?
YES
NO
When gray
pattern printing,
irregular density
persists?
NO
YES
transfer/
charge/developing
voltage drops while
printing?
YES
It is over the guaranty

life of toner cartridge
(Check the counter
and replace it)
NO
Defective agitator in
the toner supplying part
of developer
->Replace the developer
Check if the guide deve
spring works OK and
repair/repalce
Check high voltage

output and repair/
replace terminals, HVPS
Bad images
aroung the no image
area?
NO
Irregualrity of toner
suppy from developer
-> Repalce developer
YES
Light distortion due to

the mirror ruined or
LSUs diffused reflection
-> Replace LSU
Samsung Electronics
4-25
Troubleshooting
White Spot
Is it regular
interval of 75.4mm?
YES
Obstacles stuck on OPCs

surface
-> Clean the OPC and
machine or replace
developer
NO
Transfer
voltage is normal?
NO
Too high voltage supplied

due to the setting error of
transfer voltage
-> Adjust/replace HVPS
YES
D/R in developing unit has

the defect
When putting in/out the

developer, scratch is made
4-26
Samsung Electronics
Troubleshooting
Trembling at the End When OHP Printing
Is the OPC
mode selected using
the software
application?
NO
Set to OHP mode
YES
Recommended
OHP film used?
NO
Use the recommended film
YES
Inserted over
than 10 films into
the MPF?
YES
When multi-page OHP printng,

less than 10 films are
guranteed.
Samsung Electronics
NO
When OHP
printing, does the fan
temporarily stops
and revolves?
NO
Use the recommended film
YES
Other parts are touching the

fan and prevents it from
revolution
-> Check and repair
4-27
Troubleshooting
Poor Fusing Grade
After printing
NO
completed, any error
related fuser?
YES
Both ends
of thermostat
open?
The machine
placed under the
severe low tempera
ture for a long
time?
YES
NO
NO
While printing,
the voltage of pin 208
of U5 (CPU) on Main
board is 2.0V
~2.3V?
NO
Thermistors
contact is OK?
NO
YES
YES
Re-assemble
thermistor
Place the machine

at normal
temperature and
re-test
YES
Replace thermostat
and re-test
Open the top

cover. When black
printing, is the fuser NIP
width is 1.2~
3.0mm?
NO
Check if the hardness of

P/R, and spring force is OK?
(springs force: 2.5 Kg)
YES
Replace the contol

component on engine
board
Check any contact
problem in thermistor
and repair
4-28
The paper used is too

thick or contains too
much cotton in it
-> Re-test with the
recommended paper
Samsung Electronics
Troubleshooting
No Power (LCD NO display LED Off)
Plug in the
power cord?
NO
Check the voltage first and plug

the power cord
YES
The power
NO
voltage supplying is
the same as
rating?
Supply the power as the rating
YES
The fan
revolves when
powered on?
Connections
NO
on board are OK?
NO
YES
YES
LEDs blink
once when
powered on?
NO
Fuse of SMPS
if open?
The On-Line
key is being pressed NO
or shortage on
the panel
board?
Repair/replace the
board
Samsung Electronics
NO
Replace the fuse
YES
YES
YES
Re-connect firmly
and re-test
The connection
error between
controller board
and panel board
or malfunction
of boards.
-> Replace the
boards
Shortage
between 5V and
GND, or between
24V and
GND?
YES
Remove the shortage

or replace the board
NO
Toner cartridge
is in the set?
NO
Put in the
cartridge
YES
Detect failure due to the

board which detects top
cover open or switch error
-> Replace the board or switch
4-29
Troubleshooting
Fuser Error
Measure the resistance

at the both ends of AC
Line with covers open
NO
Less than 10W?
Thermostat is open due to the heat etc.

-> Replace the thermostat
YES
Remove the covers
AC is being supplied?
NO
Re-assemble the top

cover and close it
Check the PCI and fusing

control part and CN502
on the SMPS
-> Replace the component
or replace the SMPS
YES
The voltage
of pin #208 of U5
(CPU) on the Main board
is about 2.3V when
printing?
NO
Thermistor, connecting point or engine

board defect -> Repair/replace the
component/board
YES
END
4-30
Samsung Electronics
Troubleshooting
Paper Jam (Mis-feeding)
Sounds the
solenoid on when starts
print?
NO
The solenoid defected

-> Replace it
YES
Does the
paper move?
The Engine board defected

-> Replace boards
NO
The pick-up unit is

assembled wrong
-> Re-assemble or replace
the unit
YES
Does the
paper move more than NO
100mm?
Too many
papers in the
feeder?
YES
Feeder
sensor and paper
width detect sensor
are assembled
reverse?
YES
NO
The Sensor board

defected
-> Repair/replace
Reduce the amount

and re-test
YES
Switch them
Paper guides
fit the paper width?
NO
Take out the paper

and re-insert
YES
Paper end curled?
YES
Use the recommended
and quality paper
Samsung Electronics
NO
Does the
extender pulled out?
NO
Pull out the

extender
YES
<Recommendation>
Use the MPF for the thick
paper such as envelope
and cardstock
4-31
Troubleshooting
Paper Jam (Jam1)
Paper
NO
stopped before
the OPC?
Paper
NO
stopped before
the fuser?
YES
YES
The
actuator of
NO
paper exit sensor
works OK?
Check the actuator exists and its

operation and around the engine board
-> Replace
YES
Check the LSU and

if it has the defect
replace it
Is the paper
rolled around the
presseure
roller?
Feeds
NO
multiple pages?
NO
YES
YES
Remove the fuser, remove

the paper and replace the
pressure roller, if necessary
Severe skew
when feeding?
NO
YES
Adjust the paper guides to fit the

paper width
The force of springs pressing the
developer is weak
-> Check guide-DEVE
Check the roller

and ribs of fuser
are in place, and
remove burrs, if
any
-> Remove the
factors of jam
Remove any factors
The paper
came out through
between fuser and
developer?
NO
Check the input path

to the fuser (such as
mis-assembly)
YES
Too thin
or sensitive paper to
static electricity?
NO
Check guide transfer

is grounded Check
the shutter prevents
feeding
YES
Use the recommended

paper
4-32
Samsung Electronics
Troubleshooting
LSU Error
Check
CBF Harness28P
(MAIN BD to ENGINE
BD)
NO
Try again to connector

or
Replace connector
YES
Check
MAIN BD CN9-3,
P_MOTOR Signal
(
)
NO
Replace MAIN BD
YES
Check
MAIN BD CN9-4,
LREDADY Signal
(
)
NO
Replace LSU
YES
Check
MAIN BD CN9-9,
LDON Signal
(
)
NO
Replace MAIN BD
YES
Check
MAIN BD CN9-6,
HSYNC Signal
(
)
NO
Replace LSU
YES
END
Samsung Electronics
4-33
Appendix information
The following list shows different materials by model.
The material codes mentioned in the manual are subject to change without prior notice. For the latest exact information, see ITSELF System. (http://itself.sec.samsung.co.kr)
SF-530/XAA
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SF-531P/TEG
SEC.CODE
JC92-01379A
JC96-01629B
JC97-01463L
JC72-00665L
SF-530/XEC
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379C
JC96-01629A
JC97-01622D
JC72-00943D
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01622C
JC72-00943C
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01622H
JC72-00943H
SF-531P/XET
SEC.CODE
JC92-01367A
JC96-01629A
JC97-01463J
JC72-00665J
SF-530/XIL
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01622E
JC72-00943E
SF-531P/XEP
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01463P
JC72-00665P
SF-530/XEU
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SF-531P/XEG
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01463U
JC72-00665V
SF-530/XET
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379A
JC96-01629B
JC97-01621A
JC72-00942A
SF-531P/XEF
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01463M
JC72-00665M
SF-530/XEP
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SF-531P/XEC
SEC.CODE
JC92-01379C
JC96-01629A
JC97-01463N
JC72-00665N
SF-530/XEG
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01622C
JC72-00943C
SF-531P/XAA
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01463Q
JC72-00665Q
SF-530/XEF
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379E
JC96-01629A
JC97-01622F
JC72-00943F
SF-531P/XEU
SEC.CODE
JC92-01379D
JC96-01629A
JC97-01463R
JC72-00665R
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01367A
JC96-01629A
JC97-01622A
JC72-00943A
SF-531P/XEV
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379G
JC96-01629A
JC97-01622K
JC72-00943K
SF-531P/XIL
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
SEC.CODE
JC92-01379D
JC96-01629A
JC97-01622G
JC72-00943G
SF-531P/XSS
DESCRIPTION
PBA MAIN-LIU PBA
ELA HOU-HANDSET
MEA HOU-OPE FRONT
PMO-OPE COVER
Samsung Electronics
SEC.CODE
JC92-01379A
JC96-01629A
JC97-01622A
JC72-00943A
5. Exploded Views and Parts List

5-1 Main Assembly
5-2 Shield Engine Unit Assembly
5-3 Engine Assembly
5-4 Frame Lower Assembly
5-5 Fuser Assembly
5-6 Plate-Upper Unit Assembly
5-7 OPE Unit
5-8 Scan Upper Assembly
5-9 Front Assembly
5-10 RX Drive Unit Assembly
Samsung Electronics
5-1
Exploded Views and Parts List
5-1 Main Assembly
0
18-2
18
16-2
16-1
16
8
15
18-1
14
14-1
14-2
19-2
19
3
19-1
4
10 &12
13
7
11
17
17-2
1
17-1
5-2
Samsung Electronics
Main Assembly Parts List

O : Service available X : Service not available
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
14-1
14-2
15
16
16-1
16-2
17
17-1
17-2
18
18-1
18-2
19
19-1
19-2
Description
SF-530 / 531P
SMPS-V1
SMPS-V2(4CH)
UNIT-LSU
IPR-PLATE_CHANNEL
MEC-PLATE UPPER
MEC-TRAY
MEC-TRAY(P)
MEC-CRADLE
PBA MAIN-LIU PBA
ELA HOU-HANDSET
ELA-UNIT DEV APO6 E
ELA HOU-ENGINE ASSY
ELA HOU-SHIELD ENGINE
ELA HOU-FRAME LOWER
ELA HOU-FRAME LOWER
ELA HOU-FRAME LOWER
ELA HOU-RX DRIVE
MEA HOU-OPE FRONT
PBA MAIN-SCAN
PBA MAIN-SCAN
PMO-BASHING WHITE
PMO-COVER TOP
MEC-COVER REAR
PMO-COVER_REAR
PMO-TRAY_LARGE
MEC-STCKER
PMO-STACKER_MAIN
PMO-STACKER_SUB
MEA UNIT-CHUTE ASSY
PMO-CHUTE
PMO-DUMMY CHUTE
MEC-STACKER
PMO-STACKER TX(APOLLO)
PMO-STACKER TX(B)
SEC.Code
Qty
SA
Remark
JC44-00032A
JC44-00023A
JC59-00006A
JC70-00058A
JC75-00057A
JC75-00062A
JC75-00075A
JC75-00083A
Refer to Info.
Refer to Info.
*
*
*
*
JC96-02094B
JC96-02094A
JC96-02094C
JC96-01755A
Refer to Info.
JC81-00441A
JC81-00472A
JF72-41306A
JC72-00128A
JC75-00059A
*
*
JC75-00060A
*
*
JC97-01187E
*
*
JC75-00084A
JC72-00223A
*
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
O
O
O
O
O
O
O
O
O
O
X
X
X
X
O
O
O
O
O
O
O
O
O
O
X
X
O
X
X
O
X
X
O
O
X
110V
220V
SF-530
SF-531P
SF-530
SF-531P
110V
220V
for China
SF-530
SF-531P
Refer to the Appendix information
Samsung Electronics
5-3
5-2 Shield Engine Unit Assembly
S-9
2
S-9
4
10
S-9
S-9
1
11
LIU B'd
S2
6
S8
8
S2
12
5-4
Samsung Electronics
Shield Engine Unit Assembly Parts List

No.
0
1
2
3
4
5
6
7
8
9
10
10
11
12
13
S2
S8
S9
Description
SEC.Code
Qty
SA

CABLE-FLAT
CBF HARNESS-LSU
CBF HARNESS-MAIN-HVPS
CBF HARNESS-LIU/HOOK 2
CBF HARNESS-MODULA 2
CBF HARNESS
IPR-SHIELD ENGINE
IPR-SHILED SMPS
MEC-GUIDE STAKE ASSY
PBA MAIN-MAIN
PBA MAIN-MAIN
ELA M/MEDIO AUD-SPEAKER
WASHER-E.T
CBF HARNESS-THERMISTOR
SCREW-MACHINE
SCREW-TAPTITE
SCREW-TAPTITE
*
*
3809-001161
JC39-00043A
JC39-00193A
JC39-00174A
JC39-00175A
JC39-40022A
JC70-00200A
JC70-00263A
JC75-00087A
JC92-01308B
JC92-01308D
JC96-01607A
*
JC39-00045A
6001-000568
6003-000221
6003-000264
1
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
2
1
11
X
X
O
O
O
O
O
O
O
O
O
O
O
O
X
O
O
O
O
Samsung Electronics
Remark
SF-530
SF-531P
INLET
SF-530
SF-531P
5-5
5-3 Engine Assembly
S-1
15
14
1-2
13-1
1-1
13-2
S-1
21
13
5
S-1
21-1
S-1
12
S-10
21-3
20
18
21-2
S-6
19
S-1
17-2
17
17-3
17-4
17-1
7
3
S-1
22-3
22-1
22-2
Frame Lawer Ass'y
16
6
22
11
10
Bushing-Shaft
5-6
Samsung Electronics
Engine Assembly Parts List

No.
0
1
1-1
1-2
2
3
5
6
7
8
9
10
11
12
13
13-1
13-2
14
15
16
17
17-1
17-2
17-3
17-4
18
19
20
21
21-1
21-2
21-3
22
22-1
22-2
22-3
S7
S10
S11
Description
ELA HOU-ENGINE ASSY
MEC-CAM PICK UP
PMO-CAM_PICKUP
PMO-SHAFT_PICKUP
CBF HARNESS-EARTH (TX MOTOR)
SOLENOID-(APOLLO)
SMPS-HVPS
SPRING-CLUTCH
SPRING-KNOCK UP
PBA MAIN-HOOK 2
PBA MAIN-ENGINE
PMO-GEAR_FEED
PMO-CLUTCH_FEED
PMO-CAP_PAD
MEA RACK-TR ASSY
PPR-SPACER DR
MEC-TRANSFER ROLLER
PMO-GEAR_TRANSFER
PCT-INSULATOR ENG BD
PMO-DUMMY SIDE
MEC-HOLDER PAD
SPRING-PAD
PMO-HOLDER PAD
PMO-HOLDER PAD LARGE
RPR-PAD FRICTION
MEC-TERMINAL
MEC-SIDE PAD(L)
MEC-SIDE PAD(R)
MEC-KNOCKUP ASSY
IPR-BAR_KNOCKUP
PMO-PLATE-KNOCKUP
PMO-CAM-KNOCKUP
MEC-GEAR PICK UP
SPRING-PICK UP GEAR
PMO-GEAR_PICKUP,1
PMO-GEAR_PICKUP,2
SCREW-TAPTITE
SCREW-TAPTITE
SCREW-TAPTITE
Samsung Electronics
SEC.Code
Qty
SA
*
JC75-00072A
*
*
JB39-00017A
JC33-00002A
JC44-00017A
JC61-00012A
JC61-00023A
JC92-01378A
JC92-01320A
JC72-00115A
JC72-00116A
JC72-00124A
*
*
JC75-00035A
JC72-00179A
*
*
JC75-00156A
JC61-00054A
JC72-00535A
JC72-00536A
*
JC75-00049A
JC75-00050B
JC75-00051B
JC75-00053A
*
*
*
JC75-00056A
*
*
*
6003-000196
6003-000266
6003-000119
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
5
1
1
1
1
1
1
1
1
1
1
7
2
17
X
O
X
X
O
O
O
O
O
O
O
O
O
O
X
X
O
O
X
X
O
O
O
O
X
O
O
O
O
X
X
X
O
X
X
X
O
O
O
Remark
5-7
5-4 Frame Lower Assembly
29
29-4
29-1
Transfer Roller
29-3
29-2
S-1
1
30-3
30-1
12
30
30-2
S-1
23
24
21
35
9
S-1
S-6
34-1
34-2
34
S-1
S-6
S-1
16
14
S-1
20
31
5
3
18
S-2
19
37
36
S-2
11
6
3
15
13
33
18
10
43
41
26
S-1
25
17
2
38
26
39
40
27-1
42
27-2
27
25
28-3
28-4
28-3
28-5
28-1
28
28-2
S-2
S-2
32
5-8
Samsung Electronics
Frame Lower Assembly Parts List

No.
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
23
24
25
26
27
27-1
27-2
28
28-1
28-2
28-3
28-4
28-5
29
29-1
29-2
29-3
29-4
30
30-1
30-2
30-3
31
32
33
34
34-1
34-2
35
36
37
38
39
40
41
42
43
S6
S7
S11
Description
ELA HOU-FRAME LOWER
ELA HOU-FRAME LOWER
ELA HOU-FRAME LOWER
CBF HARNESS-OPE GND
CBF HARNESS-FUSER
SPRING-P/R (APOLLO)
SPRING-GUIDE DEVE
BEARING-PRESSURE R
IPR-SAW_PLATE
IPR-EARTH_TRANS
IPR-GROUND_GUIDE
IPR-GROUND_HVPS
IPR-GROUND_FUSER
IPR-GUIDE-TR
IPR-PLATE-TERMINAL
IPR-GROUND DRIVE
PMO-BUSHING_TERMINAL
PMO-ACTUATOR_EXIT
PMO-GUIDE_INPUT
PCT-FILM SAW
PMO-HOLDER PR
PMO-HOLDER EXIT
PMO-FRAME LOWER
PMO-COVER PTL
PMO-CAP PLTE G/DEV R
PMO-CAP PLTE G/DEV L
PMO-STOPPER EXIT
RMO-RUBBER_FOOT
MEC-ROLLER FEED
RPR-ROLLER FEED
MEC-SHAFT FEED
MEC-HOLDER FEED
SPRING-ACT, FEED
PMO-HOLDER_FEED
PMO-BUSHING_FEED
PMO-ACTUATOR_EMPTY
PMO-ACTUATOR_FEED
MEC-HOLDER TR L
SPRING-TR(300)
IPR-PLATE_TR
PMO-HOLDER TR
PMO-BUSHING_TR(L)
MEC-HOLDER TR R
SPRING-TR(300)
PMO-HOLDER TR
PMO-BUSHING_TR(R)
MEC-ROLLER_PR 1210
PBA MAIN-SENSOR
ELA HOU-MOTOR GND
ELA HOU-OPEN SENSOR
CBF HARNESS-COVER
IPR-BRKT-SENSOR
ELA HOU-PTL ASSY
ELA HOU-FUSER 110V
ELA HOU-FUSER 220V(531P)
PMO-BUSHING SHAFT
GEAR-FU_IN 47
PMO-HUB GEAR
GEAR-FU_OUT 47
PMO-GEAR_83/35
IPR-BRACKET FUSER DRV
FAN-DC
SCREW-TAPTITE
SCREW-TAPTITE
SCREW-TAPTITE
Samsung Electronics
SEC.Code
JC96-02094B
JC96-02094A
JC96-02094C
*
JC39-00061A
*
*
*
*
*
*
*
*
*
*
*
*
JC72-00130A
*
*
JC72-00531A
JC72-00532A
JC72-00533A
JC72-00534A
JC72-41135A
JC72-41173A
*
*
JC75-00054A
*
*
JC75-00055A
*
*
*
*
JC72-00119A
JC75-00106C
*
*
JC72-00100C
JC72-00102A
JC75-00107C
*
JC72-00100C
JC72-00101A
JC75-00130A
JC92-01197A
JC96-01579A
JC96-01584A
JC39-00041A
*
JC96-02312A
JC81-00439A
JC81-00440A
JG72-40849A
JC66-00306A
JC72-00676A
*
JC72-00154A
*
3103-001085
6003-000152
6003-000196
6003-000119
Qty
1
1
1
1
1
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
2
2
1
1
1
1
2
2
1
2
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
17
SA
O
O
O
X
O
X
X
X
X
X
X
X
X
X
X
X
X
O
X
X
O
O
O
O
O
O
X
X
O
X
X
O
X
X
X
X
O
O
X
X
O
O
O
X
O
O
O
O
O
O
O
X
O
O
O
O
O
O
X
O
X
O
O
O
O
Remark
110V
220V
for China
110V
220V
5-9
5-5 Fuser Assembly
S
7
S
13
12
20
16
11
15
14-2
4
18
17
10
14-1
S
14
8
S
21
22
5-10
19
6
Samsung Electronics
Fuser Assembly Parts List

No.
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
14-1
14-2
15
16
17
18
19
20
21
22
S
S
Description
SEC.Code
Qty
SA
Remark
ELA HOU-FUSER 110V

ELA HOU-FUSER 220V(531P)
THERMISTOR-NTC
THERMOSTAT
LAMP-HALOGEN
LAMP-HALOGEN
PMO-FUSER_UPPER
PMO-BUSHING H/R L
PMO-BUSHING H/R R
PMO-COVER_THERMOSTAT
NPR-ROLLER HEAT
IPR-ELECTRODE_PLATE
IPR-GROUND_FU
IPR-PIN ROLLER EXIT
IPR-ELECTRODE WIRE1
IPR-ELECTRODE WIRE,S
MEA ETC-SHAFT EXIT
PMO-SHAFT_EXIT(Z15)
RMO-RUBBER_EXIT
PMO-ROLLER_IDLE EXIT
SPRING-EXIT
PMO-GEAR_EXIT_DRV16
PMO-GEAR_EXIT_IDLE
GEAR-FUSER 1210
LABEL(R)-CAU_HOT_FU
SPRING-CLAW
PMO-GUIDE CLAW
SCREW-TAPTITE
SCREW-TAPTITE
JC81-00439A
JC81-00440A
1404-001188
4712-000001
4713-001120
4713-001121
*
JC72-00530A
JC72-00529A
*
JC71-00012B
*
*
*
*
*
*
JC72-00150A
*
JC72-00567A
JC61-00017A
*
*
JC66-00037B
*
*
*
6003-000119
6003-000196
1
1
1
1
1
1
1
1
1
1
1
1
1
4
1
1
1
1
4
4
4
1
1
1
1
5
5
5
1
O
O
O
O
O
O
X
O
O
X
O
X
X
X
X
X
X
O
X
O
O
X
X
O
X
X
X
O
O
110V
220V
Samsung Electronics
110V
220V
5-11
5-6 Plate-Upper Unit Assembly
7
S
3
S
6
6-1
S
6-2
4
6-3
4-2
4-3
4-1
6
4-2
6-1
2
S-1
6-2
8
5-12
6-3
Samsung Electronics
Plate-Upper Unit Assembly Parts List

No.
0
1
2
3
4
4-1
4-2
4-3
6
6-1
6-2
6-3
7
8
S5
S10
S10
Description
MEC-PLATE UPPER
IPR-UPPER-PLATE
IPR-PLATE SPRING DEV
ELA UNIT-FUSE DEVE
MEA ETC-ROLLER PICK UP
PMO-HOUSING_PICKUP
PMO-IDLE_PICKUP
RMO-ROLLER_PICKUP
MEA ETC-IDLE FEED
PMO-HOLDER_PICKUP
SPRING-FEED
PMO-HOLDER_IDLE,FEED
CABLE CLAMP
ICT-ROLLER IDEL FEED
SCREW-TAPTITE
SCREW-TAPTITE
SCREW-TAPTITE
Samsung Electronics
SEC.Code
Qty
SA
JC75-00057A
*
JC70-10223A
*
*
JC72-00109A
*
JC73-00018A
*
*
*
*
6502-000130
*
*
6003-000266
6003-000266
1
1
2
1
1
1
2
1
2
1
1
1
1
1
2
1
2
O
X
O
X
X
O
X
X
X
X
X
X
O
X
X
O
O
Remark
5-13
5-7 OPE Unit

0
12
11
10
14
7
13
8 3
4
16
15
17
OPE Unit Parts List

No.
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Description
ELA HOU-OPE ASSY
SCREW-TAPTITE
MPR-COVER ADRESS
PMO-KEY COPY
PMO-KET STOP
LABEL(P)-ONE TOUCH
PMO-KEY OT
PMO-KEY FUNCTION
PMO-KEY START
PMO-OPE COVER
PMO-KEY TEL
PMO-KEY SAVE
PCT-LCD WINDOW
PMO-KEY FOWARD
PMO-KEY MODE(B)
RMO-TEL
RMO-ONE TOUCH
PBA MAIN-OPE
SEC.Code
Qty
SA
*
6003-000119
JG74-10543A
JB72-00102A
JB72-00108A
*
JC72-00275A
*
*
Refer to Info.
JC72-00667A
JC72-00668A
JC72-00672A
JC72-00886A
JC72-41320A
JC73-00072A
JC73-00073A
JC81-00456A
1
6
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
X
O
O
O
O
X
O
X
X
O
O
O
O
O
O
O
O
O
Remark
Refer to the Appendix information
5-14
Samsung Electronics
5-8 Scan Upper Assembly

0
10
12
4
1
5
2
13
S
15
S
3
14
11
Scan Upper Assembly Parts List

No.
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Description
ELA HOU-SCAN UPPER
MEC-PINCH
RPR-SPONGE ADF
MPR-TAPE ADF
CBF HARNESS-SCAN GND
SPRING-SENSOR
SPRING-COIL ADF
PMO-SCAN UPPER
PMO-LEVER SENSOR DOC
PMO-LEVER SENSOR
ICT-SHAFT PINCH
PMO-HOLDER RUBBER
PMO-ROLL PINCH
PMO-SUPPORT ADF
RPR-RUBBER ADF
MEC-BRUSH ANTISTATIC
Samsung Electronics
SEC.Code
Qty
SA
JC81-00457A
JG75-10015A
*
*
JC39-00101A
*
JC61-00040A
JC72-00671A
JC72-00823A
JC72-41322A
JF70-40521B
JG72-40044A
JG72-40663A
JG72-41083A
JC73-00032A
JG75-10004A
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
O
O
X
X
O
X
O
O
O
O
O
O
O
O
O
O
Remark
5-15
5-9 Front Assembly

S
1-2
1-5
1-1
1-3
1-4
25
24
5
21
4
29
32 30 32 30
2
32
10
28
26
11
28
S3
18
27
31
22
9 15
23
S
27
28
31
3
19
S3
16
8
17
18
20
Bushing White
6
7
14
5-16
33
Samsung Electronics
Front Assembly Parts List

No.
0
1
1-1
1-2
1-3
1-4
1-5
2
3
4
5
6
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
S1
S3
S4
S7
S11
S11
Description
SEC.Code
Qty
SA
ELA HOU-FRONT ASSY

ELA HOU-FRONT ASSY
MEA ETC-GUIDE PAPER
PMO-GUIDE PAPER
PMO-GUIDE DOC L
PMO-GUIDE DOC R
GEAR-PINION
IPR-WASHER SPRING CU
CONTACT IMAGE SENSOR
CONTACT IMAGE SENSOR
MOTOR STEP-SCAN
MEC-ROLLER WHITE
CBF HARNESS-SCAN/CIS(200)
CBF HARNESS-SCAN/CIS(300)
CBF HARNESS-MAIN/SCAN
CBF HARNESS-SCAN GND
SPRING-LOCKER R
SPRING-LOCKER L
GEAR- 39/20
GEAR- IDLE 30
IPR-BRKT MOTOR
NPR-GROUND CIS
PMO-OPEN LOCKER L
PMO-OPEN LOCKER R
PMO-BRKT SCAN BD
PMO-OPEN BUTTON
PMO-COVER MOTOR
PMO-COVER FRONT
PMO-DUMMY CIS L SF-530
PMO-DUMMY CIS L
PMO-DUMMY CIS R SF-530
PMO-DUMMY CIS R
PMO-STOPPER EXIT
MEC-ROLLER DRIVE
MEA ETC-ROLLER ADF
SPECIAL SCREW
LOCKER-TX
GEAR-IDLE25
PMO-SHAFT EXIT
PMO-GEAR TRANS(B4)
PMO-BUSHING TX(B4)
RING-C
SPRING CIS
SCREW-MACHINE
SCREW-TAPPING
SCREW-TAPPING
SCREW-TAPTITE
SCREW-TAPTITE
SCREW-TAPTITE
JC81-01483A
JC81-00458A
*
*
*
*
JG66-40003A
JF70-10616A
0609-001127
0609-001125
JC31-00011A
JC75-00126A
JC39-00049A
JC39-00136A
JC39-00192A
JC39-00101A
JC61-00027A
JC61-00028A
JC66-00304A
JC66-00305A
*
*
*
*
JC72-00222A
JC72-00273A
JC72-00670A
JC72-00673A
JC72-00880A
JC72-00495A
JC72-00881A
JC72-00496A
*
JC75-00123A
*
JG60-10001A
JG64-30001A
JG66-40036A
JG72-40042A
JG72-40741A
JG72-40744A
6044-000159
JG61-70533A
6001-000131
6002-000175
6002-001078
6003-000196
6003-000119
6003-000119
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1
1
2
2
3
1
2
9
3
2
2
2
1
2
2
6
O
O
X
X
X
X
O
O
O
O
O
O
O
O
O
O
O
O
O
O
X
X
X
X
O
O
O
O
O
O
O
O
X
O
X
O
O
O
O
O
O
O
O
O
O
O
O
O
O
Samsung Electronics
Remark
SF-530
SF-531P
SF-530
SF-531P
SF-530
SF-531P
SF-530
SF-531P
SF-530
SF-531P
5-17
5-10 RX Drive Unit Assembly
7
S7
6
1
5
S7
S-7
3
S-7
S-7
RX Drive Assembly Parts List

No.
0
1
2
3
4
5
6
7
S-7
5-18
Description
ELA HOU-RX DRIVE
MOTOR-STEP
PMO-GEAR_71/28
PMO-GEAR_73/22
PMO-GEAR_132/19
IPR-BRKT_MOTOR
IPR-BRKT_GEAR
CBF-HARNESS_MOTOR
SCREW-MACHINE
SEC.Code
Qty
SA
JC96-01755A
JC31-00005A
*
*
*
*
JC70-00129A
JC39-00110A
6001-000131
1
1
1
1
1
1
1
1
5
O
O
X
X
X
X
O
O
O
Remark
YELLOW
Samsung Electronics
Samsung Electronics
Not e.
CI S
LC D
USB
CENTRONI CS
CI S I NTERFACE
PART
TX MOTOR
DRI VER
U A RT
UNI CON
( USB I C)
-. SF-531P : Printer Funct ion with Fax
-. SF-530 : Fax Funct io n Only
TX
MOTOR
SCAN B oar d
- Key Sc an
- LCD Dr i v e
MI COM
OPE
DO C
SE N SO R
HOST
( P C)
* Note
MEMORY I / F
UART* 2
PVC
DMAC
CACHE( 6K)
I/O I/F
I TU
P1284
GEU
ARM7T
KS32C65100
MAI N
33600 bps
MODEM
( 8MB)
DRAM
( 2MB)
F LASH
MEMORY
Audi o Par t
Bac k - up Par t
RT C
Tx : Rx
600/ / 600
TRANSFORMER
Tx : Rx
600/ / 600
TRANSFORMER
H VPS
B D
LI U
SM P S
E N G IN E
- 5V
+24V
+5V
PAR T
DETECTI ON
PHONE
EXTER NAL
PA RT
SEPER ATI NG
MODEM &
EXT_PHONE
T HV
D EV
SU PPL Y
O PC G N D
MHV
O P C _F U S E
FA N
O L E N OI D E
M OT OR
E X IT
SEN SO R
EXTERNAL
PHONE
HANDSET
LI NE
POWER
CORD
6. Block Diagram
6-1
Contents
CONTENTS
1. Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
1-1
1-2
1-3
1-4
Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

Precautions on Disassembly and Reassembly . . . . . . . . . . . . . . . . . . . .1-1
ESD Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-2
Tools for Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-3
2. Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
3. Disassembly and Reassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
3-10
3-11
3-12
3-13
3-14
3-15
3-16
3-17
3-18
3-19
3-20
3-21
3-22
3-23
3-24
3-25
3-26
3-27
3-28
3-29
3-30
3-31
3-32
3-33
3-34
3-34
3-36
3-37
3-38
3-39
3-40
3-41
Samsung Electronics
General Precautions on Disassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

Cradle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2
White Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2
OPE Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-3
ADF Rubber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-5
OPE Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6
Lever Sensor Doc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6
Lever Sensor Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6
Scan Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-7
Scan Motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-7
ADF Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8
CIS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8
Rear Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-9
Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-9
Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-10
LSU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-10
Transfer Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11
Engine Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11
Pick-up Roller Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-12
Knock-up Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-13
Cap-pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-13
Holder-pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-14
Motor Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-14
Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-15
Gear Pick-up Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-15
Solenoid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-16
HVPS Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-16
Hook Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-17
Fuser Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-17
Thermostat . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-18
Halogen Lamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-18
Pressure Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-19
Actuator-Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-19
Shield Engine Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20
SMPS Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20
Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-21
LIU Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-21
Main Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22
Sensor Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22
Actuator Empty/Feeder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-23
Roller Feeder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-24
Contents
4. Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
4-1
4-2
4-3
4-4
4-5
4-6
Preventative Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

Tech Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
4-2-1 System Data List in TECH MODE . . . . . . . . . . . . . . . . . . . . . . . . . .4-2
4-2-2 Tech Mode Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3
4-2-3 Maintenance Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4
4-2-4 Printout Report . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-6
4-2-5 Engine Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-6
4-2-6 Maintenance List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-7
Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-8
4-3-1 Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-8
Print Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-10
Note for replacing Main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-10
Troubleshooting Flow Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-11
5. Exploded Views and Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

5-1
5-2
5-3
5-4
5-5
5-6
5-7
5-8
5-9
5-10
Main Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-2

Shield Engine Unit Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-4
Engine Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-6
Frame Lower Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-8
Fuser Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-10
Plate-Upper Unit Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-12
OPE Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-14
Scan Upper Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-15
Front Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-16
RX Drive Unit Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-18
6. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1

7. Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1
Samsung Electronics
SAMSUNG FACSIMILE
SF-530/531P
(For New Control PBA)
APPENDIX
Manual
SAMSUNG FACSIMILE
CONTENTS
1.
2. Block Diagram
4. Schematic diagram
ELECTRONICS
This service manual is also provided on the web,

the ITSELF system Samsung Electronics Co., Ltd.
http://itself.sec.samsung.co.kr
Samsung Electronics Co.,Ltd. November 2002

Printed in Korea.
VERSION NO. : 1.00
CODE : JC-0083A
Samsung Electronics
TX
MOTOR
CIS
SCAN Board
- Key Scan
UART
CIS INTERFACE
PART
TX MOTOR
DRIVER
Image Processor
USB
- LCD/LED Drive
UART*2
PVC
DMAC
CACHE(4K)
I/O I/F
ITU
P1284
GEU
ARM7TDMI
S3Q46Q0X
MEMORY I/F
LCD
PAPER SENSOR
COVER OPEN SW
THERMISTOR
USB CABLE
MA IN
MICOM
OPE
DOC
SENSOR
HOST
( P C)
CENTRONICS
CABLE
33.6Kbps
MODEM
74HC273
GPIO
AFE
EXTERNAL
(8MB)
SDRAM
(1MB)
FLASH
MEMORY
Audio Part
RESET
(BACK-UP)
SMPS
Tx : Rx
600/ / 600
TRANSFORMER
Tx : Rx
600/ / 600
TRANSFORMER
L IU
HVPS
board
ENGINE
+5V
-5V
24V
+24VS
T HV
D EV
SU PPL Y
PART
DETECTI ON
PHONE
EXTERNAL
PA RT
SEPER ATI NG
MODEM &
EXT_PHONE
O PC G N D
MHV
O PC _F U SE
FA N
O L EN OI D E
RXM O T O R
EXIT
SENSOR
EXTERNAL
PHONE
HANDSET
LI NE
POWER
CORD
1. Block Diagram
1-1
VC C
OPE_RXD
OPE_RST
OPE_TXD
CN1
1 2 3 4 5
CN 3
1 2 3 4 5 6 7
1 2 3 4
CN 2
1 2 3 4 5 6 7
OPE
CIS
1 2 3 4
+24V
CIS_ LED
CIS_ CL
CIS_ SI
LCD_ E
LCD_D0
LCD_D1
LCD_D2
LCD_D3
LCD_D4
LCD_D5
LCD_D6
LCD_D7
SCAN
M OT OR
GND
5
4
3
2
1
+5V
GND
CIS SIG
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SCNMOT_ B
SCNMOT_B
SCNMOT_ A
SCNMOT_A
LCD
GND5
VC C
VO
LCD_RW
LCD_RS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CN 4
SCAN BD
1 2
6 7
10
11 12 13 14 15 16 17 18
CN 1
24 V
24 V
+5V
SMOT_A
SMOT_NB
SMOT_NA
DGND
SMOT_B
OPE_RX
5 8 7
DGND
DGND
nOPE_ RESET
OPE_TXD
CIS_ LED
4 3 6
+5V
CIS_ SI
CIS_ SIG
CIS_ CLK
2 1
1 0 9 12 11 14 13 16 1 5 18 17
_STBIN
PPD(0)
2
3
PPD(1)
PPD(2)
PPD(3)
PPD(4)
PPD(5)
PPD(6)
PPD(7)
PCINTE RFACE
8
9
11
12
SELECT
14
16
5V2
18
GND
1
30
GND
CN3
19
20
35
_SLCTIN
36
18
33
NC
36
21
22
+5V
SE NSOR BD
_FEED
DGND
23
_PEMPTY
14
17
32
NC
35
_LREADY
25
26
_HSYNC
+5V
DGND
_LD_ON
VDO
4
5
MO TOR
LSU
2
3 LD D IOD E
4
5
6
CLUTCH
2
1
FAN
1
2
+24VS
CN7
DEV_FUSE
_NEW_DEVE
6
5
_EGMOT_A1
EGMOT_PHA
ENGINE
10
9
_EGMOT_B1
DGND
12
+5V
11
EGMOT_PHB
14
+24VS
+24VS
13
16
15
GND2 4
GND2 4
28
24 V
1
2
LSU_CLK
1
2
3 POL YGO N
24
CN15
27
COVE R
SWIT CH
PMOTOR
16
31
33
3
4
5
15
30
_FAULT
32
GND 24
13
_INIT
31
1
2
12
18
19
GND
19
SP K
14
GND
16
SPKOUT
AGND
9
10
11
CN2
13
_AUTOFD
6
7
8
10
BUSY
13
MAIN
PER ROR
12
CN20
+24VS
_ACK
10
11
CN16
18
17
CN18
+24VS
THERM_A
TH ERMISTO R
1
2
THERM_B
CN7
3
4
+5V
PT L
CN14
PTL
CN21
5
6
7
8
+24VS
CN1
HVPS
GND2 4
2
3
4
2
3
4
THV_PWM
_THV_EA
THV_READ
5
6
7
10
CN8
BIAS_PWM
+5V
13
CN13
1
8
9
DGND
11
12
5
6
7
MHV_PWM
8
9
6 7
14
15
9 10 11 12 1 3 14
16
H OOK
Samsung Electronics
RC V2
MIC 2
RC V1
HOOK2
HOOK2_ NC
HOOK2_NO
HOOK1
HOOK1_NO
HOOK1_NC
1
2
3
4
5
6
7
8
9
10
11
12
9 10 11 12 1 3 14
CN3
CN1
CN2
LIU
_EXIT
+5V
DGND
+5V
DGND
1
2
3
4
5
6
7
SMPS
CN 503
-5V
DGND
+24V
GND24
+24V
GND24
+24V
GND24
9
10
11
12
13
14
15
AC LINE
16
MODEM_TXA1
AGND
MODEM_TXA2
CML1
MODEM_RX
nEXT_ PHONE
nDP
CML2
REM OTE
+5V
nHOOK1
nRING
DGND
1 2
MIC1
1
2
3
4
5
6
7
8
9
10
11
12
FUSER _ON
+5V
1
2
3
4
5
6
7
8
LINE_ 2
LINE_ 3
LINE_ 4
LINE_ 5
M J1
LINE_ 6
EXT_3
EXT_4
M J2
EXT_5
2-1
Electrical Parts List
3. Main PBA Electrical Parts Lists

3-1. SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
JC92-01430B
Qty
DESCRIPTION
PBA MAIN-MAIN PBA
SF-530/VE,SEUK,UK,MAIN BD,-,-,-,-,-
0401-000116
D3
DIODE-SWITCHING
MMSD914T1,100V,200mA,SOD-123,TP
0401-000116
D7
DIODE-SWITCHING
0401-000116
D9
DIODE-SWITCHING
0404-000112
D20
DIODE-SCHOTTKY
RB420D,25V,100mA,SOT-23,TP
0407-000101
D11
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D12
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D13
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D14
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D18
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D19
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000122
D1
DIODE-ARRAY
KDS226,80V,300mA,C2-3,SOT-23,TP
0407-000122
D2
DIODE-ARRAY
KDS226,80V,300mA,C2-3,SOT-23,TP
0501-000010
Q22
TR-SMALL SIGNAL
KSC1008,NPN,800mW,TO-92,TP,120-240
0501-000279
Q14
TR-SMALL SIGNAL
KSA1182-Y,PNP,150mW,SOT-23,TP,
0501-000338
Q12
TR-SMALL SIGNAL
2SC2812,NPN,200mW,SOT-23,TP,20
0501-000338
Q15
TR-SMALL SIGNAL
0501-000338
Q17
TR-SMALL SIGNAL
0501-000338
Q18
TR-SMALL SIGNAL
0501-000338
Q19
TR-SMALL SIGNAL
0501-000338
Q20
TR-SMALL SIGNAL
0501-000338
Q21
TR-SMALL SIGNAL
0501-000338
Q23
TR-SMALL SIGNAL
0501-000457
Q13
TR-SMALL SIGNAL
MMBT2222A,NPN,350MW,SOT-23,TP,35-300
0502-000245
Q16
TR-POWER
KSB1151-Y,PNP,1.3W,TO-126,-,16
0801-000477
U102
IC-CMOS LOGIC
74HCT273,D FLIP-FLOP,SOP,20P,3
0801-001090
U1
IC-CMOS LOGIC
74HC14,SCHIMITT INVERTER,SOP,1
0801-001090
U50
IC-CMOS LOGIC
0801-001090
U51
IC-CMOS LOGIC
0803-001393
U100
IC-TTL
7407,BUFFER/DRIVER,SOP,14P,150
1001-000170
U95
IC-ANALOG SWITCH
MC14051BD,SPDT CMOS,SOP,16P,15
1001-000171
U80
IC-ANALOG SWITCH
1003-001122
U96
IC-MOTOR DRIVER
TEA3718SFP,SOP,20P,300MIL,SING
1003-001122
U97
IC-MOTOR DRIVER
1006-001224
U98
IC-LINE TRANSCEIVER
74LVX161284,TSSOP,48P,240MIL,TRIPLE,TP,
1105-001464
U92
IC-DRAM
K4S641632F,4MX16BIT,TSOP(II),54P,400MIL,
1107-001302
U94
IC-FLASH MEMORY
29W800,1MX8/512KX16BIT,TSOP,48P,724MIL
1201-000105
U137
IC-AUDIO AMP
34119,SOP,8P,150MIL,SINGLE,-,P
1201-000167
U13
IC-OP AMP
358,SOP,8P,150MIL,DUAL,100V/mV
1201-000167
U77
IC-OP AMP
1202-000164
U91
IC-VOLTAGE COMP.
393,SOP,8P,150MIL,DUAL,36V,CMO
3-1
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
Qty
DESCRIPTION
1203-001455
U84
IC-POSI.FIXED REG.
1117,DPAK,3P,265MIL,PLASTIC,3.
1203-001455
U85
IC-POSI.FIXED REG.
1203-002220
U86
IC-POSI.ADJUST REG.
LD1117,DPAK,3P,240MIL,PLASTIC,1.25/15V,12W,
1203-002233
U88
IC-RESET
XC61F,SOT-23,3P,-,PLASTIC,0.7/10V,150MW,-,-,-,TP
1205-001771
U87
IC-CLOCK GENERATOR FS781BZB,SOP,8P,150MIL,PLASTIC,5.5V,37mW,0to+70C
1205-001896
U89
IC-MODEM FM336R6719-12,QFP,100P,-,PLASTIC,3.6V,250mW,0to+70C,TR,
2001-000015
R174
R-CARBON(S)
0.5OHM,5%,1/2W,AA,TP,2.4X6.4MM
2001-000015
R175
R-CARBON(S)
0.5OHM,5%,1/2W,AA,TP,2.4X6.4MM
2001-001140
R192
R-CARBON(S)
39OHM,5%,1/2W,AA,TP,2.4X6.4MM
2007-000033
R214
R-CHIP
0OHM,5%,1/8W,DA,TP,3216
2007-000052
R194
R-CHIP
10Kohm,1%,1/16W,DA,TP,1608
2007-000052
R195
R-CHIP
10Kohm,1%,1/16W,DA,TP,1608
2007-000070
R118
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R130
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R131
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R132
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R139
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R142
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R145
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R215
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R216
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R217
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R218
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R219
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R220
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R226
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R227
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R230
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R241
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R84
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000074
R205
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R207
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R208
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R209
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R210
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R222
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R223
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R231
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R73
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000077
R191
R-CHIP
470ohm,5%,1/16W,DA,TP,1608
2007-000077
R237
R-CHIP
470ohm,5%,1/16W,DA,TP,1608
2007-000077
R238
R-CHIP
470ohm,5%,1/16W,DA,TP,1608
2007-000078
R165
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
3-2
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
Qty
DESCRIPTION
2007-000078
R166
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R167
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R168
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R169
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R170
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R236
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000082
R83
R-CHIP
3.3Kohm,5%,1/16W,DA,TP,1608
2007-000083
R143
R-CHIP
3Kohm,5%,1/16W,DA,TP,1608
2007-000083
R79
R-CHIP
3Kohm,5%,1/16W,DA,TP,1608
2007-000084
R155
R-CHIP
4.7Kohm,5%,1/16W,DA,TP,1608
2007-000084
R156
R-CHIP
4.7Kohm,5%,1/16W,DA,TP,1608
2007-000084
R235
R-CHIP
4.7Kohm,5%,1/16W,DA,TP,1608
2007-000086
R180
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R181
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R182
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R183
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R234
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000090
R100
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R101
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R102
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R103
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R104
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R105
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R106
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R107
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R110
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R111
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R112
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R113
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R114
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R162
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R163
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R2
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R228
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R72
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R93
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R97
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R99
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000092
R172
R-CHIP
15Kohm,5%,1/16W,DA,TP,1608
2007-000093
R151
R-CHIP
20Kohm,5%,1/16W,DA,TP,1608
2007-000094
R136
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
2007-000094
R80
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
2007-000094
R81
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
3-3
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
Qty
DESCRIPTION
2007-000094
R82
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
2007-000098
R176
R-CHIP
56Kohm,5%,1/16W,DA,TP,1608
2007-000098
R177
R-CHIP
56Kohm,5%,1/16W,DA,TP,1608
2007-000102
R171
R-CHIP
100Kohm,5%,1/16W,DA,TP,1608
2007-000102
R98
R-CHIP
100Kohm,5%,1/16W,DA,TP,1608
2007-000103
R152
R-CHIP
120Kohm,5%,1/16W,DA,TP,1608
2007-000104
R232
R-CHIP
150Kohm,5%,1/16W,DA,TP,1608
2007-000106
R233
R-CHIP
220Kohm,5%,1/16W,DA,TP,1608
2007-000106
R87
R-CHIP
220Kohm,5%,1/16W,DA,TP,1608
2007-000106
R88
R-CHIP
220Kohm,5%,1/16W,DA,TP,1608
2007-000107
R164
R-CHIP
470Kohm,5%,1/16W,DA,TP,1608
2007-000109
R199
R-CHIP
1Mohm,5%,1/16W,DA,TP,1608
2007-000109
R200
R-CHIP
1Mohm,5%,1/16W,DA,TP,1608
2007-000113
R74
R-CHIP
33ohm,5%,1/16W,DA,TP,1608
2007-000113
R75
R-CHIP
33ohm,5%,1/16W,DA,TP,1608
2007-000116
R86
R-CHIP
120ohm,5%,1/16W,DA,TP,1608
2007-000122
R179
R-CHIP
1.2Kohm,5%,1/16W,DA,TP,1608
2007-000123
R76
R-CHIP
1.5Kohm,5%,1/16W,DA,TP,1608
2007-000123
R77
R-CHIP
1.5Kohm,5%,1/16W,DA,TP,1608
2007-000123
R78
R-CHIP
1.5Kohm,5%,1/16W,DA,TP,1608
2007-000124
R212
R-CHIP
2.2Kohm,5%,1/16W,DA,TP,1608
2007-000126
R196
R-CHIP
4.3Kohm,5%,1/16W,DA,TP,1608
2007-000131
R173
R-CHIP
91Kohm,5%,1/16W,DA,TP,1608
2007-000132
R90
R-CHIP
180Kohm,5%,1/16W,DA,TP,1608
2007-000132
R91
R-CHIP
180Kohm,5%,1/16W,DA,TP,1608
2007-000134
R178
R-CHIP
33Kohm,5%,1/16W,DA,TP,1608
2007-000136
R153
R-CHIP
300Kohm,5%,1/16W,DA,TP,1608
2007-000136
R201
R-CHIP
300Kohm,5%,1/16W,DA,TP,1608
2007-000368
R89
R-CHIP
130Kohm,5%,1/16W,DA,TP,1608
2007-000402
R129
R-CHIP
150ohm,5%,1/16W,DA,TP,1608
2007-000472
R140
R-CHIP
1KOHM,5%,1/8W,DA,TP,3216
2007-000472
R190
R-CHIP
1KOHM,5%,1/8W,DA,TP,3216
2007-000539
R149
R-CHIP
200ohm,5%,1/16W,DA,TP,1608
2007-000669
R193
R-CHIP
2Kohm,1%,1/16W,DA,TP,1608
2007-000729
R150
R-CHIP
300ohm,5%,1/16W,DA,TP,1608
2007-000939
R154
R-CHIP
47Kohm,1%,1/16W,DA,TP,1608
2007-000965
R185
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R186
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R187
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R188
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R224
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R229
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-001044
R85
R-CHIP
56ohm,5%,1/16W,DA,TP,1608
3-4
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
Qty
DESCRIPTION
2007-001073
R184
R-CHIP
6.8KOHM,5%,1/8W,DA,TP,3216
2007-001134
R204
R-CHIP
68ohm,5%,1/16W,DA,TP,1608
2011-000660
RA3
R-NETWORK
1Kohm,5%,63mW,L,CHIP,8P,TP
2011-001011
RA1
R-NETWORK
2011-001093
RA4
R-NETWORK
100ohm,5%,1/16W,L,CHIP,8P,TP
2011-001094
RA5
R-NETWORK
39ohm,5%,63mW,L,CHIP,8P,TP
2011-001094
RA6
R-NETWORK
2011-001334
U81
RC-NETWORK
1K/5.1K/39ohm,10%,150pF,-,6V,28P
2203-000189
C439
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C44
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C440
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C441
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C443
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C444
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C445
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C446
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C447
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C448
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C449
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C450
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C451
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C452
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C453
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C454
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C455
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C456
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C457
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C458
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C459
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C460
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C461
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C462
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C463
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C464
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C465
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C466
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C467
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C468
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C469
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C471
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C472
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C473
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C474
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
3-5
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
Qty
DESCRIPTION
2203-000189
C475
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C476
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C477
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C479
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C480
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C481
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C482
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C483
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C484
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C485
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C486
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C487
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C488
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C489
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C490
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C491
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C492
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C493
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C494
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C495
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C496
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C497
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C498
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C499
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C500
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C501
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C502
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C503
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C504
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C505
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C506
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C507
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C508
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C510
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C511
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C514
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C515
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C516
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C517
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C518
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C519
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C520
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C521
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
3-6
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
Qty
DESCRIPTION
2203-000189
C522
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C523
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C524
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C527
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C528
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C529
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C530
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C531
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C532
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C533
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C534
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C547
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C548
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C549
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C550
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C552
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C553
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000206
C345
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C346
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C347
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C349
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C350
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C351
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C352
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C353
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C354
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000236
C539
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C540
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C541
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C542
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C551
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000257
C406
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C407
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C408
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C409
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C410
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C411
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C412
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C413
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C414
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C415
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C416
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C417
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
3-7
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO.
Qty
DESCRIPTION
2203-000257
C418
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C419
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000384
C355
C-CERAMIC,CHIP
0.015NF,5%,50V,C0G,TP,1608
2203-000384
C356
C-CERAMIC,CHIP
0.015NF,5%,50V,C0G,TP,1608
2203-000440
C325
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C369
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C370
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C371
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C372
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C373
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C374
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C375
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C376
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C377
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C378
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C379
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C380
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C381
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C382
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C383
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C384
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C385
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C386
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C387
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C388
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C389
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C390
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C391
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C392
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C393
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
U104
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000626
C426
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C427
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C428
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C432
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C433
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000681
C363
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000681
C364
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000681
C365
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000681
C366
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000783
C430
C-CERAMIC,CHIP
0.33NF,5%,50V,C0G,TP,1608
2203-000783
C431
C-CERAMIC,CHIP
0.33NF,5%,50V,C0G,TP,1608
2203-000815
C403
C-CERAMIC,CHIP
0.033NF,5%,50V,C0G,TP,1608
3-8
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
2203-000815
C404
C-CERAMIC,CHIP
0.033NF,5%,50V,C0G,TP,1608
2203-000815
C405
C-CERAMIC,CHIP
0.033NF,5%,50V,C0G,TP,1608
2203-000998
C368
C-CERAMIC,CHIP
0.047NF,5%,50V,C0G,TP,1608
2203-001222
C357
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C358
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C359
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C360
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C361
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C362
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001408
C544
C-CERAMIC,CHIP
0.27nF,5%,50V,NP0,TP,1608
2203-001656
C367
C-CERAMIC,CHIP
0.47nF,5%,50V,NP0,TP,1608
2203-005065
C545
C-CERAMIC,CHIP
1000nF,+80-20%,10V,Y5V,TP,1608
2203-005065
C546
C-CERAMIC,CHIP
1000nF,+80-20%,10V,Y5V,TP,1608
2401-000042
C332
C-AL
100uF,20%,16V,GP,TP,6.3x7,5
2401-000042
C335
C-AL
100uF,20%,16V,GP,TP,6.3x7,5
2401-000207
C339
C-AL
100uF,20%,50V,WT,TP,8x12,5
2401-000414
C327
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000414
C329
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000414
C330
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000414
C543
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000802
C328
C-AL
220uF,20%,16V,GP,TP,10x9mm,5mm
2401-001197
C337
C-AL
33uF,20%,50V,GP,TP,6.3x7,-
2401-001197
C338
C-AL
33uF,20%,50V,GP,TP,6.3x7,-
2401-002420
C344
C-AL
470uF,20%,16V,GP,TP,10x12,5mm
2404-000284
C341
C-TA,CHIP
10uF,20%,16V,-,TP,3528,-
2404-000284
C342
C-TA,CHIP
10uF,20%,16V,-,TP,3528,-
2404-000284
C343
C-TA,CHIP
10uF,20%,16V,-,TP,3528,-
2409-001020
C331
C-EDL
1F,5.5V,5V,-,BK,20.5x5,5
2703-000125
BD3
INDUCTOR-SMD
10uH,10%,1.25x2x1.25mm
2703-000125
BD4
INDUCTOR-SMD
10uH,10%,1.25x2x1.25mm
2801-001375
OSC3
CRYSTAL-UNIT
10MHz,20ppm,28-AAA,16pF,45ohm,BK
2801-003376
OSC2
CRYSTAL-UNIT
0.032768MHz,20ppm,28-AAY,12.5p
2801-003960
OSC4
CRYSTAL-UNIT
28.224MHz,50ppm,28-AAA,18pF,35ohm,BK
2804-001374
OSC1
OSCILLATOR-CLOCK
28.74448MHz,100ppm,10TTL&CMOS(30pF),ST,5V,30mA
3301-000317
B2
CORE-FERRITE BEAD
AB,2x1.25x0.9mm,-,-
3301-000317
B3
CORE-FERRITE BEAD
AB,2x1.25x0.9mm,-,-
3301-000317
L1
CORE-FERRITE BEAD
AB,2x1.25x0.9mm,-,-
3301-000344
BD1
CORE-FERRITE BEAD
AA,-,3.5x0.6x6.5mm,-,-,Mn-Zn,-
3301-000344
BD2
CORE-FERRITE BEAD
AA,-,3.5x0.6x6.5mm,-,-,Mn-Zn,-
3702-000118
CN2
CONNECTOR-RIBBON
36P,FEMALE,ANGLE,AU
3708-001224
CN13
CONNECTOR-FPC/FFC/PIC
3711-000470
CN15
CONNECTOR-HEADER
BOX,4P,1R,2MM,STRAIGHT,SN,BRN
3711-000524
CN8
CONNECTOR-HEADER
BOX,9P,1R,2MM,STRAIGHT,SN,BRN
14P,1mm,STRAIGHT,SN
3-9
SF-530 (JC92-01430B)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
3711-002000
CN16
CONNECTOR-HEADER
BOX,18P,2R,2mm,STRAIGHT,SN
3711-003340
CN14
CONNECTOR-HEADER
3711-003408
CN20
CONNECTOR-HEADER
3711-003408
CN21
CONNECTOR-HEADER
3711-003968
CN18
CONNECTOR-HEADER
BOX,3P,1R,2.5mm,STRAIGHT,SN
3711-003969
CN7
CONNECTOR-HEADER
BOX,2P,1R,2.5mm,STRAIGHT,SN
3711-003981
CN3
CONNECTOR-HEADER
JB02-90502A
SUB ETC-AUX PAPER(A5) MJC-640V,WHT,A5,-
JB68-00073A
LABEL(R)-BAR CODE
JC13-00021A
IC ASIC-CHORUS2 S3C46Q0X,SF-531P,208P,+1.8V,+3.3V,-,LQFP,-,-,PLASTIC,-
JC41-00159A
PCB-MAIN
SF-530/VE,FR4,4 L,-,1.6T,131MM * 141MM ,-,2,-,
JC68-00573A
LABEL(R)-BARCODE
ML-4500,PET,T0.05,10mm,20mm,-,WHT,-,-,-
3-10
U82
SF-3000,PY,38X6.5,T0.1,WHT
3-2. SF-531P (JC92-01430A)

SEC CODE
LOCATION NO. Qty
JC92-01430A
DESCRIPTION
PBA MAIN-MAIN
SF-530/VE,SEUK,UK,MAIN BD,-,-,-,-,-
0401-000116
D3
DIODE-SWITCHING
0401-000116
D7
DIODE-SWITCHING
0401-000116
D9
DIODE-SWITCHING
0404-000112
D20
DIODE-SCHOTTKY
RB420D,25V,100mA,SOT-23,TP
0407-000101
D11
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D12
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D13
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D14
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D18
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000101
D19
DIODE-ARRAY
DA204K,20V,100mA,C2-3,SOT-23,T
0407-000122
D1
DIODE-ARRAY
KDS226,80V,300mA,C2-3,SOT-23,TP
0407-000122
D2
DIODE-ARRAY
KDS226,80V,300mA,C2-3,SOT-23,TP
0501-000010
Q22
TR-SMALL SIGNAL
KSC1008,NPN,800mW,TO-92,TP,120-240
0501-000279
Q14
TR-SMALL SIGNAL
KSA1182-Y,PNP,150mW,SOT-23,TP,
0501-000338
Q12
TR-SMALL SIGNAL
0501-000338
Q15
TR-SMALL SIGNAL
0501-000338
Q17
TR-SMALL SIGNAL
0501-000338
Q18
TR-SMALL SIGNAL
0501-000338
Q19
TR-SMALL SIGNAL
0501-000338
Q20
TR-SMALL SIGNAL
0501-000338
Q21
TR-SMALL SIGNAL
0501-000338
Q23
TR-SMALL SIGNAL
0501-000457
Q13
TR-SMALL SIGNAL
MMBT2222A,NPN,350MW,SOT-23,TP,35-300
0502-000245
Q16
TR-POWER
KSB1151-Y,PNP,1.3W,TO-126,-,16
0801-000477
U102
IC-CMOS LOGIC
74HCT273,D FLIP-FLOP,SOP,20P,3
0801-001090
U1
IC-CMOS LOGIC
0801-001090
U50
IC-CMOS LOGIC
0801-001090
U51
IC-CMOS LOGIC
0803-001393
U100
IC-TTL
7407,BUFFER/DRIVER,SOP,14P,150
1001-000170
U95
IC-ANALOG SWITCH
1001-000171
U80
IC-ANALOG SWITCH
1003-001122
U96
IC-MOTOR DRIVER
1003-001122
U97
IC-MOTOR DRIVER
1006-001224
U98
IC-LINE TRANSCEIVER74LVX161284,TSSOP,48P,240MIL,TRIPLE,TP,
1105-001464
U92
IC-DRAM
K4S641632F,4MX16BIT,TSOP(II),54P,400MIL,
1107-001302
U94
IC-FLASH MEMORY
29W800,1MX8/512KX16BIT,TSOP,48P,724MIL,
1201-000105
U137
IC-AUDIO AMP
34119,SOP,8P,150MIL,SINGLE,-,P
1201-000167
U13
IC-OP AMP
1201-000167
U77
IC-OP AMP
1202-000164
U91
IC-VOLTAGE COMP.
393,SOP,8P,150MIL,DUAL,36V,CMO
1203-001455
U84
IC-POSI.FIXED REG.
1203-001455
U85
IC-POSI.FIXED REG.
3-11
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
1203-002220
U86
IC-POSI.ADJUST REG. LD1117,DPAK,3P,240MIL,PLASTIC,1.25/15V,12W,
1203-002233
U88
IC-RESET
1205-001771
U87
IC-CLOCK GENERATOR FS781BZB,SOP,8P,150MIL,PLASTIC,5.5V,37mW,0to+
1205-001896
U89
IC-MODEM
FM336R6719-12,QFP,100P,-,PLASTIC,3.6V,250mW,
2001-000015
R174
R-CARBON(S)
0.5OHM,5%,1/2W,AA,TP,2.4X6.4MM
2001-000015
R175
R-CARBON(S)
0.5OHM,5%,1/2W,AA,TP,2.4X6.4MM
2001-001140
R192
R-CARBON(S)
39OHM,5%,1/2W,AA,TP,2.4X6.4MM
XC61F,SOT-23,3P,-,PLASTIC,0.7/10V,150MW,-,-,-,TP
2007-000033
R214
R-CHIP
0OHM,5%,1/8W,DA,TP,3216
2007-000052
R194
R-CHIP
10Kohm,1%,1/16W,DA,TP,1608
2007-000052
R195
R-CHIP
10Kohm,1%,1/16W,DA,TP,1608
2007-000070
R118
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R130
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R131
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R132
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R139
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R142
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R145
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R215
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R216
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R217
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R218
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R219
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R220
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R226
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R227
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R230
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R241
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000070
R84
R-CHIP
0ohm,5%,1/16W,DA,TP,1608
2007-000074
R205
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R207
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R208
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R209
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R210
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R222
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R223
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R231
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000074
R73
R-CHIP
100ohm,5%,1/16W,DA,TP,1608
2007-000077
R191
R-CHIP
470ohm,5%,1/16W,DA,TP,1608
2007-000077
R237
R-CHIP
470ohm,5%,1/16W,DA,TP,1608
2007-000077
R238
R-CHIP
470ohm,5%,1/16W,DA,TP,1608
2007-000078
R165
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R166
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R167
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
3-12
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
2007-000078
R168
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R169
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R170
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000078
R236
R-CHIP
1Kohm,5%,1/16W,DA,TP,1608
2007-000082
R83
R-CHIP
3.3Kohm,5%,1/16W,DA,TP,1608
2007-000083
R143
R-CHIP
3Kohm,5%,1/16W,DA,TP,1608
2007-000083
R79
R-CHIP
3Kohm,5%,1/16W,DA,TP,1608
2007-000084
R155
R-CHIP
4.7Kohm,5%,1/16W,DA,TP,1608
2007-000084
R156
R-CHIP
4.7Kohm,5%,1/16W,DA,TP,1608
2007-000084
R235
R-CHIP
4.7Kohm,5%,1/16W,DA,TP,1608
2007-000086
R180
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R181
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R182
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R183
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000086
R234
R-CHIP
5.6Kohm,5%,1/16W,DA,TP,1608
2007-000090
R100
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R101
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R102
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R103
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R104
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R105
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R106
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R107
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R110
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R111
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R112
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R113
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R114
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R162
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R163
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R2
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R228
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R72
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R93
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R97
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000090
R99
R-CHIP
10KOHM,5%,1/16W,DA,TP,1608
2007-000092
R172
R-CHIP
15Kohm,5%,1/16W,DA,TP,1608
2007-000093
R151
R-CHIP
20Kohm,5%,1/16W,DA,TP,1608
2007-000094
R136
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
2007-000094
R80
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
2007-000094
R81
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
2007-000094
R82
R-CHIP
22Kohm,5%,1/16W,DA,TP,1608
2007-000098
R176
R-CHIP
56Kohm,5%,1/16W,DA,TP,1608
3-13
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
2007-000098
R177
R-CHIP
56Kohm,5%,1/16W,DA,TP,1608
2007-000102
R171
R-CHIP
100Kohm,5%,1/16W,DA,TP,1608
2007-000102
R98
R-CHIP
100Kohm,5%,1/16W,DA,TP,1608
2007-000103
R152
R-CHIP
120Kohm,5%,1/16W,DA,TP,1608
2007-000104
R232
R-CHIP
150Kohm,5%,1/16W,DA,TP,1608
2007-000106
R233
R-CHIP
220Kohm,5%,1/16W,DA,TP,1608
2007-000106
R87
R-CHIP
220Kohm,5%,1/16W,DA,TP,1608
2007-000106
R88
R-CHIP
220Kohm,5%,1/16W,DA,TP,1608
2007-000107
R164
R-CHIP
470Kohm,5%,1/16W,DA,TP,1608
2007-000109
R199
R-CHIP
1Mohm,5%,1/16W,DA,TP,1608
2007-000109
R200
R-CHIP
1Mohm,5%,1/16W,DA,TP,1608
2007-000113
R74
R-CHIP
33ohm,5%,1/16W,DA,TP,1608
2007-000113
R75
R-CHIP
33ohm,5%,1/16W,DA,TP,1608
2007-000116
R86
R-CHIP
120ohm,5%,1/16W,DA,TP,1608
2007-000122
R179
R-CHIP
1.2Kohm,5%,1/16W,DA,TP,1608
2007-000123
R76
R-CHIP
1.5Kohm,5%,1/16W,DA,TP,1608
2007-000123
R77
R-CHIP
1.5Kohm,5%,1/16W,DA,TP,1608
2007-000123
R78
R-CHIP
1.5Kohm,5%,1/16W,DA,TP,1608
2007-000124
R212
R-CHIP
2.2Kohm,5%,1/16W,DA,TP,1608
2007-000126
R196
R-CHIP
4.3Kohm,5%,1/16W,DA,TP,1608
2007-000131
R173
R-CHIP
91Kohm,5%,1/16W,DA,TP,1608
2007-000132
R90
R-CHIP
180Kohm,5%,1/16W,DA,TP,1608
2007-000132
R91
R-CHIP
180Kohm,5%,1/16W,DA,TP,1608
2007-000134
R178
R-CHIP
33Kohm,5%,1/16W,DA,TP,1608
2007-000136
R153
R-CHIP
300Kohm,5%,1/16W,DA,TP,1608
2007-000136
R201
R-CHIP
300Kohm,5%,1/16W,DA,TP,1608
2007-000368
R89
R-CHIP
130Kohm,5%,1/16W,DA,TP,1608
2007-000402
R129
R-CHIP
150ohm,5%,1/16W,DA,TP,1608
2007-000472
R140
R-CHIP
1KOHM,5%,1/8W,DA,TP,3216
2007-000472
R190
R-CHIP
1KOHM,5%,1/8W,DA,TP,3216
2007-000539
R149
R-CHIP
200ohm,5%,1/16W,DA,TP,1608
2007-000539
R204
R-CHIP
200ohm,5%,1/16W,DA,TP,1608
2007-000669
R193
R-CHIP
2Kohm,1%,1/16W,DA,TP,1608
2007-000729
R150
R-CHIP
300ohm,5%,1/16W,DA,TP,1608
2007-000939
R154
R-CHIP
47Kohm,1%,1/16W,DA,TP,1608
2007-000965
R185
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R186
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R187
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R188
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R224
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-000965
R229
R-CHIP
5.1Kohm,5%,1/16W,DA,TP,1608
2007-001044
R85
R-CHIP
56ohm,5%,1/16W,DA,TP,1608
2007-001073
R184
R-CHIP
6.8KOHM,5%,1/8W,DA,TP,3216
3-14
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
2011-000660
RA3
R-NETWORK
2011-001011
RA1
R-NETWORK
2011-001093
RA4
R-NETWORK
100ohm,5%,1/16W,L,CHIP,8P,TP
2011-001094
RA5
R-NETWORK
2011-001094
RA6
R-NETWORK
2011-001334
U81
RC-NETWORK
1K/5.1K/39ohm,10%,150pF,-,6V,28P
2203-000189
C439
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C44
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C440
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C441
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C443
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C444
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C445
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C446
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C447
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C448
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C449
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C450
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C451
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C452
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C453
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C454
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C455
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C456
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C457
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C458
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C459
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C460
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C461
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C462
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C463
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C464
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C465
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C466
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C467
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C468
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C469
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C471
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C472
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C473
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C474
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C475
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C476
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
3-15
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
2203-000189
C477
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C479
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C480
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C481
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C482
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C483
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C484
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C485
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C486
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C487
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C488
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C489
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C490
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C491
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C492
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C493
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C494
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C495
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C496
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C497
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C498
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C499
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C500
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C501
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C502
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C503
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C504
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C505
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C506
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C507
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C508
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C510
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C511
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C514
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C515
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C516
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C517
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C518
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C519
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C520
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C521
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C522
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C523
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
3-16
SF-531P (JC92-01430A)SF-531P (JC92-01430A)

SEC CODE
LOCATION NO. Qty
DESCRIPTION
2203-000189
C524
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C527
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C528
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C529
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C530
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C531
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C532
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C533
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C534
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C547
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C548
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C549
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C550
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C552
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000189
C553
C-CERAMIC,CHIP
100nF,+80-20%,25V,Y5V,TP,1608,
2203-000206
C345
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C346
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C347
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C349
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C350
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C351
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C352
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C353
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000206
C354
C-CERAMIC,CHIP
100nF,10%,50V,X7R,TP,2012
2203-000236
C539
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C540
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C541
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C542
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000236
C551
C-CERAMIC,CHIP
0.1NF,5%,50V,C0G,TP,1608
2203-000257
C406
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C407
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C408
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C409
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C410
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C411
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C412
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C413
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C414
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C415
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C416
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C417
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C418
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
2203-000257
C419
C-CERAMIC,CHIP
10nF,10%,50V,X7R,TP,1608
3-17
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
2203-000384
C355
C-CERAMIC,CHIP
0.015NF,5%,50V,C0G,TP,1608
2203-000384
C356
C-CERAMIC,CHIP
0.015NF,5%,50V,C0G,TP,1608
2203-000440
C325
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C369
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C370
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C371
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C372
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C373
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C374
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C375
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C376
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C377
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C378
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C379
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C380
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C381
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C382
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C383
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C384
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C385
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C386
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C387
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C388
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C389
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C390
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C391
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C392
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
C393
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000440
U104
C-CERAMIC,CHIP
1nF,10%,50V,X7R,TP,1608,-
2203-000626
C426
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C427
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C428
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C432
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000626
C433
C-CERAMIC,CHIP
0.022NF,5%,50V,C0G,TP,1608
2203-000681
C363
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000681
C364
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000681
C365
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000681
C366
C-CERAMIC,CHIP
0.027NF,5%,50V,C0G,TP,1608
2203-000783
C430
C-CERAMIC,CHIP
0.33NF,5%,50V,C0G,TP,1608
2203-000783
C431
C-CERAMIC,CHIP
0.33NF,5%,50V,C0G,TP,1608
2203-000815
C403
C-CERAMIC,CHIP
0.033NF,5%,50V,C0G,TP,1608
2203-000815
C404
C-CERAMIC,CHIP
0.033NF,5%,50V,C0G,TP,1608
2203-000815
C405
C-CERAMIC,CHIP
0.033NF,5%,50V,C0G,TP,1608
3-18
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
2203-000998
C368
C-CERAMIC,CHIP
0.047NF,5%,50V,C0G,TP,1608
2203-001222
C357
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C358
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C359
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C360
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C361
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001222
C362
C-CERAMIC,CHIP
820pF,10%,50V,X7R,TP,1608,-
2203-001408
C544
C-CERAMIC,CHIP
0.27nF,5%,50V,NP0,TP,1608
2203-001656
C367
C-CERAMIC,CHIP
0.47nF,5%,50V,NP0,TP,1608
2203-005065
C545
C-CERAMIC,CHIP
1000nF,+80-20%,10V,Y5V,TP,1608
2203-005065
C546
C-CERAMIC,CHIP
1000nF,+80-20%,10V,Y5V,TP,1608
2401-000042
C332
C-AL
100uF,20%,16V,GP,TP,6.3x7,5
2401-000042
C335
C-AL
100uF,20%,16V,GP,TP,6.3x7,5
2401-000207
C339
C-AL
100uF,20%,50V,WT,TP,8x12,5
2401-000414
C327
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000414
C329
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000414
C330
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000414
C543
C-AL
10uF,20%,16V,GP,TP,4x7,5
2401-000802
C328
C-AL
220uF,20%,16V,GP,TP,10x9mm,5mm
2401-001197
C337
C-AL
33uF,20%,50V,GP,TP,6.3x7,-
2401-001197
C338
C-AL
33uF,20%,50V,GP,TP,6.3x7,-
2401-002420
C344
C-AL
470uF,20%,16V,GP,TP,10x12,5mm
2404-000284
C341
C-TA,CHIP
10uF,20%,16V,-,TP,3528,-
2404-000284
C342
C-TA,CHIP
10uF,20%,16V,-,TP,3528,-
2404-000284
C343
C-TA,CHIP
10uF,20%,16V,-,TP,3528,-
2409-001020
C331
C-EDL
1F,5.5V,5V,-,BK,20.5x5,5
2703-000125
BD3
INDUCTOR-SMD
10uH,10%,1.25x2x1.25mm
2703-000125
BD4
INDUCTOR-SMD
10uH,10%,1.25x2x1.25mm
2801-001375
OSC3
CRYSTAL-UNIT
10MHz,20ppm,28-AAA,16pF,45ohm,BK
2801-003376
OSC2
CRYSTAL-UNIT
0.032768MHz,20ppm,28-AAY,12.5p
2801-003960
OSC4
CRYSTAL-UNIT
28.224MHz,50ppm,28-AAA,18pF,35ohm,BK
2804-001374
OSC1
OSCILLATOR-CLOCK 28.74448MHz,100ppm,10TTL&CMOS(30pF)
3301-000317
B2
CORE-FERRITE BEAD AB,2x1.25x0.9mm,-,-
3301-000317
B3
3301-000317
L1
3301-000344
BD1
CORE-FERRITE BEAD AA,-,3.5x0.6x6.5mm,-,-,Mn-Zn,-
3301-000344
BD2
CORE-FERRITE BEAD AA,-,3.5x0.6x6.5mm,-,-,Mn-Zn,-
3702-000118
CN2
CONNECTOR-RIBBON 36P,FEMALE,ANGLE,AU
3708-001224
CN13
CONNECTOR-FPC/FFC/PIC 14P,1mm,STRAIGHT,SN
3711-000470
CN15
CONNECTOR-HEADERBOX,4P,1R,2MM,STRAIGHT,SN,BRN
3711-000524
CN8
CONNECTOR-HEADERBOX,9P,1R,2MM,STRAIGHT,SN,BRN
3711-002000
CN16
CONNECTOR-HEADERBOX,18P,2R,2mm,STRAIGHT,SN
3711-003340
CN14
3-19
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
3711-003408
CN20
3711-003408
CN21
3711-003968
CN18
CONNECTOR-HEADERBOX,3P,1R,2.5mm,STRAIGHT,SN
3711-003969
CN7
CONNECTOR-HEADERBOX,2P,1R,2.5mm,STRAIGHT,SN
3711-003981
CN3
3722-001101
CN19
JACK-USB
SUB ETC-AUX PAPER(A5) MJC-640V,WHT,A5,-
LABEL(R)-BAR CODE SF-3000,PY,38X6.5,T0.1,WHT
IC ASIC-CHORUS2
S3C46Q0X,SF-531P,208P,+1.8V,+3.3V,
JC41-00159A
PCB-MAIN
SF-530/VE,FR4,4 L,-,1.6T,131MM * 141MM ,
JC68-00573A
LABEL(R)-BARCODE
ML-4500,PET,T0.05,10mm,20mm,-,WHT,-,-,-
JB02-90502A
JB68-00073A
JC13-00021A
3-20
U82
4P/1C B,8.38MM,AU,IVR,#22-28
SF-531P (JC92-01430A)
SEC CODE
LOCATION NO. Qty
DESCRIPTION
3-21
Schematic Diagrams
4. Schematic Diagrams(1/7)
Samsung Electronics
4-1
Schematic Diagrams
Schematic Diagrams(2/7)
4-2
Samsung Electronics
Schematic Diagrams
Samsung Electronics
4-3
Schematic Diagrams
4-4
Samsung Electronics
Schematic Diagrams
Samsung Electronics
4-5
Schematic Diagrams
4-6
Samsung Electronics
Schematic Diagrams
Samsung Electronics
4-7
Repair Manual
SAMSUNG FACSIMILE
SF-530/531P
CONTENTS
1. Block Diagram
3. Circuit Description
4. Schematic Diagrams
Electronics
- This Service Manual is a property of Samsung Electronics Co.,Ltd.

Any unauthorized use of Manual can be punished under applicable
International and/or domestic law. -
SAMSUNG
This manual is made and
described centering around
circuit diagram
and circuit description needed
in the repair center
in the form of appendix.
Samsung Electronics Digital Printing

CS Group
Copyright (c) 2001. 10
Samsung Electronics
- This Document can not be used without Samsung's authorization -
Not e.
CI S
LCD
USB
CENTRONI CS
CI S I NTERFACE
PART
TX MOTOR
DRI VER
U A RT
UNI CON
( U S B I C)
-. SF-531P : Printer Funct ion with Fax
-. SF-530 : Fax F unct io n Only
TX
MOTOR
SCAN Boar d
- Key Sc an
- LCD Dr ive
MI COM
OPE
DOC
SE N SO R
HOST
( P C)
* Note
MEMORY I / F
UART*2
PVC
DMAC
CACHE( 6K)
I/OI/F
I TU
P1284
GEU
ARM7T
KS32C65100
MAI N
33600 bps
MODEM
( 8 MB )
DRAM
( 2 MB )
F L ASH
MEMORY
Audi o Par t
Back- up Par t
RTC
Tx: Rx
600/ / 600
TRANSFORMER
Tx: Rx
600/ / 600
TRANSFORMER
HVPS
B'D
LI U
SM P S
E N GIN E
- 5V
+24V
+5V
PART
DETECTI ON
PHONE
EXTERNAL
PART
SEPERATI NG
MODEM &
EXT_PHONE
THV
D EV
SU PPL Y
OPC GN D
MHV
O PC _F U SE
FA N
O L E N OI D E
MOT OR
E X IT
SEN SOR
EXTERNAL
PHONE
HANDSET
LI NE
POWER
CORD
1
BLOCK DIAGRAM
1. Block Diagram
Repair Manual
1-1
CONNECTION DIAGRAM
SCAN
MOTOR
1
2
3
4
5
6
LCD
5
4
3
2
1
CN1
GND5
+5V
OPE_ TXD
OPE_ RST
OPE RXD
1
2
3
4
5
6
7
200 DPI
CIS_SIG
GND
+5V
CIS_SI
CIS_CLK
CIS_LED
+24V
CN2
3 4 5
300 DPI
1 CIS_SIG
2 GND
3 +5V
4 GND
5 GND
6 START PULSE
7 GND
8 CIS MAIN CLOCK
9 LED B
10 LED G
11 LED R
12 V LED
CN4
SCAN B D
1 2
CN1
6 7 8 9 10 11 12 13 14 15 16 1 7 18
18 +24V
17 +24V
16 SCNMOT A
15 +5V
14 SCNMOT * B
13 SCNMOT * A
12 SCNMOT B
9 GND5
11 GND
10 OPE RXD
8 OPE TXD
6 GND5
7 OPE RST
4 CI S SIG
5 +5V
1 CI S CLK
2 CI S SI
OPE
+24
+24
SCNMOT_A
SCNMOT_*A
SCNMOT_B
SCNMOT_*B
CN3
3 CI S LCD
1 GND5
2 +5 V
3 V0
4 L CD_ RS
5 L CD_ RW
6 L CD_ F
7 L ED_ 0
8 L ED_ 1
9 L ED_ 2
1 0 L ED_3
1 1 L ED_4
1 2 L ED_5
1 3 L ED_6
1 4 L ED_7
CIS
2 1 4 3 6 5 8 7 1 0 9 12 11 14 13 16 15 18 17
CN1 6
IEEE1284 I/F
(36PIN)
HOST
CN1 2
1 SPKOUT
2 AGND
CN2
1
2
3
4
5
+ 24 VS
GND2 4
PMOTOR
/ LREADY
EXTCLK
6
7
8
9
10
11
/ USYNC
+ 5V
CND 5
/ LD_ ON
VD0
/ APC_SH
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SLUTCH
FAN
PTL
DEV_FUSE
/ NEW_DEVE
/ EGMOT_ A0
/ EGMOT_ A1
EGMOT_ PHA
/ EGMOT_ B0
/ EGMOT_ B1
GND 5
+ 5V
EGMOT_ PHA
+ 24 VS
+ 24 VS
GND2 4
GND2 4
( PC)
USB PORT
(4PIN)
CN19
M AIN Bd
1
2
3
4
SENSOR
B D
COVER
SWIT CH
THER- MI STOR
CN1
H VPS
+5V
/ PEMPTY
/ FE ED
GND5
CN15- 1
1 + 2 4V
2 + 2 4VS
CN1 8
1 THERM_A
2 THERM_B
CN7
1
2
3
4
5
6
7
8
9
+ 2 4VS1
GND2 4
THVPWM
/ THV_ EA
THVREAD
MHVPW M
B I ASPWM
+5V
GND5
CN9
CN8 - 1
CN1 4
CN1 3- 1
Heat Lamp
(Fuser)
MODEM TXA1
MODEM TXA2
AGND
NC
MODEM RX
/ EXT PHONE
CM L1
REMOTE
CML2
/ DP
/ HOOK1
+5V
G ND5
/ RI NG
MI C1
RCV3
MI C2
RCV1
HOOK2
HOOK2 _NC
HOOK2 _NO
LSU
LD DIODE
CN7
ENGINE
B d
SMPS
CN5 03
HOT
Neutral
AC LINE
CN3
CN2
POLYGO N
MOT OR
1 + 2 4VS
2 FUSER_ON
3 +5V
4 / EXI T
5 +5V
6 GND5
7 +5V
8 GND5
9 - 5V
1 0 GND 5
1 1 2 4V
1 2 GND 2 4
1 3 2 4V
1 4 GND2 4
1 5 2 4V
1 6 GN D2 4
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HOOK Bd
1
2
3
4
5
6
7
SPK
CN1
LIU Bd
1
2
3
4
5
L I NE_ 2
L I NE_ 3
L I NR_ 4
L I NR_ 5
L I NR_ 6
6 EXT_ 3
7 EXT_ 4
8 EXT_ 5
1 0 HOOK1
1 1 HOOK1_ NO
1 2 HOOK1_ NC
MJ1
MJ1
Repair Manual
Samsung Electronics
2-1
CIRCUIT DESCRIPTION
3. Circuit Description
3-1 Main PBA

3-1-1 Summary
The main circuit that consists of CPU, MFP controller including various I/O device drivers, system memory, scanner, printer, motor driver, PC I/F, and FAX transceiver controls the whole system. The entire structure of the main circuit is as follows:
ADDR
DATA
CNTR
I/O Ports
Controller
PLL & Clock

Save
Scan Image &

Scan Motor
Controller
Bus Router
Ink Head
Controller
Interrupt
Controller
CPU
(ARM7TDMI)
LBUS
I/D Cache
(2-KB)
A/D
Converter
DMA
Controller
Derasterizer
Parallel
Port
Interface
Carrier Motor
Control
Video Data
Controller
Position &
Fire Control
UART/
Serial I/O
Paper Motor
Control
LSU
Control
Real Time
Clock
PWM &
Gen. Timer
Watch Dog
Timer
System Manager
System Bus Controller
Bus Interface
Bus Arbitration
ROM/SRAM/DRAM Controller
Repair Manual
Samsung Electronics
3-1
CIRCUIT DESCRIPTION
3-1-2 Circuit Operation

CLOCK
1) System Clock
Device
Oscillator
Frequency
9.500132 MHz
KS32C65100 RISC PROCESSOR: drives PLL internally and uses 37.17 MHz.
2) Video Clock
Device
Frequency
Oscillator
28.7448 MHz
3) USB Clock
Device
Frequency
Oscillator
48 MHz%
3-2
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
KS32C65100 MICROPROCESSOR
1) KS32C65100 MICROPROCESSOR PIN & INTERFACE
Signal
Pin No.
I/O Type
Description
OSCI
184
I7
KS32C65100 master clock input.
OSCO
185
O7
KS32C65100 master clock output.
PLL_FILTER
183
I5
PLL filter
nRESET
182
I4
Not reset. nRESET is the global reset input for the

KS32C65100. For a system reset, nRESET must be held to
low level for at least 65 machine cycles.
nSLCTIN/GIP[16]
152
I1
Not select information. This input signal is used by parallel

port interface to request 'on-line' status information.
nSTROBE
151
I1
Not strobe. The nSTROBE input indicates when valid data is

on parallel port data bus, PPD[7:0]
nAUTOFD/GIP[17]
154
I1
Not auto feed. The nAUTOFD input indicates whether data

on the parallel port data bus, PPD[7:0], is an auto feed
command. Otherwise, the bus signals are interpreted as data
only.
nINIT/GIP[15]
153
I1
Not initialization. The nINIT input signal initializes the parallel

port's input control.
nACK
159
I1
Not parallel port acknowledge. The nACK output signal is

issued whenever a transfer on the parallel port data bus is
completed.
BUSY
158
O1
Parallel port busy. The BUSY output signal indicates that the
KS32C65100 parallel port is currently busy.
SELECT
156
O1
Parallel port select. The SELECT output signal indicates

whether the device connected to the KS32C65100 parallel
port is 'on-line' or 'off-line'.
O1
Parallel port paper error. PERROR output indicates that a

problem exists with the paper in the ink-jet printer. It could
indicate that the printer has a paper jam or that the printer
is out of paper.
Not fault. The nFAULT output indicates that an error
condition exists with the printer. This signal can be used to
indicate that the printer is out of ink or to inform the user
that the printer is not turned on.
PERROR
157
nFAULT
155
O1
PPD[7:0]
142~149
I/O2
SAVRT
I6
Top reference voltage for IP ADC
SAIN
I6
Analog input for IP ADC
SAVRB
I6
Bottom reference voltage for IP ADC
arallel port data bus. This 8-bit, tri-state bus is used to

exchange data between the KS32C65100 and an external
host(peripheral).
Repair Manual
Samsung Electronics
3-3
CIRCUIT DESCRIPTION
Signal
Pin No.
I/O Type
CIS_CLK
O1
CIS shift clock
CIS_SI
O1
CIS latch signal
PHA_IA0
164
O1
Line feed motor phase signal A
PHA_IA1
165
O1
Line feed motor phase signal AZ
PHB_IB0
167
O1
Line feed motor phase signal B
PHB_IB1
168
O1
Line feed motor phase signal BZ
LF_PH0/GOPA[21]
163
O1
Line feed motor control signal 0
LF_PH1/GOPA[22]
166
O1
Line feed motor control signal 1
CR_PHA/GOPA[23]
110
O1
Direction control line for phase A
CR_PHB/GOPA[24]
113
O1
Direction control line for phase B
CRIA0/GOPA[25]
109
O1
Current control line 0 for phase A
CRIA1/GOPA[26]
111
O1
Current control line 1 for phase A
CRIB0/GOPA[27]
112
O1
Current control line 0 for phase B
CRIB1/GOPA[28]
114
O1
Current control line 1 for phase B
CHX/GIP[8]
116
I3
Encode sensor
CHY/GIP[9]
117
I3
Encode sensor
ADDR[21:0]
77~80,
82~88,
90~100
O5
Address bus. The 22bit address bus, ADDR[21:0], covers

the full 4M half-words address range of each ROM/SRAM,
DRAM, and external I/O bank
DATA[15:0]
59~66,
68~75
I/O3
nRAS[1:0]
52,53
O1
Not row address strobe for DRAM. The KS32C65100

supports up to two DRAM banks. One nRAS output is
provided for each bank.
nCAS[1:0]
54,55
O1
Not column address strobe for DRAM. The two nCAS

outputs indicate the byte selections whenever a DRAM bank
is accessed.
nOE
56
O1
Not output enable. Whenever a memory access occurs, the

nOE output controls the output enable port of the specific
memory device.
nWE
57
O6
Not write enable. Whenever a memory access occurs, the

nWE output controls the write enable port of the specific
memory device.
16~24,
26~29
O1
Gate control line for print head.
31~38,
40~47
I/O1
Drain control line for print head.
nPHGA[13:1]/
GOPB[12:0]
PHOE[16:1]/
GIOP[26:11]
3-4
Description
External bi-directional 16-bit data bus.
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
Signal
Pin No.
I/O Type
RXD0/GIP[0]
194
I1
Receive data input for the UART0. RXD0 is the UART0

channel's input signal for receiving serial data.
RXD1/GIP[1]
192
I1

RXD2/GIP[2]
190
I1

I3
External interrupt request input nEINT0.
nEINT1/GIP[4]
I3
nEINT2/GIP[5]
10
I3
nXDREQ/GIP[6]
199
I3
External DMA request.
TXD0/GOPA[0]
193
O1
Transmit data output for the UART0. TXD0 is the UART0

channel's output for transmitting serial data.
TXD1/GOPA[1]
191
O1

TXD2/GOPA[2]
189
O1

nXDACK/GOPA[5]
200
O1
External DMA acknowledge. This active low output signal is

generated whenever a DMA transfer is completed.
TONEOUT/GOPA[3]
188
O1
Tone generator output.
nWDTO/GOPA[4]
187
P3
Reset out by watch dog timer.
nIOWR/GOPA[10]
161
O1
External output write strobe
nIORD/GOPA[9]
162
O1
External output read strobe
CLKOUT/GOPA[6]
180
O1
Clock for external chip
14
O1
External memory chip select 2.
TCK
132
I2
JTAG TCK interface in MDS mode.
TMS
135
I2
JTAG TMS interface in MDS mode.
TDI
133
I2
JTAG TDI interface in MDS mode.
nTRST
136
I2
JTAG nTRST interface in MDS mode.
TDO
134
O1
JTAG TDO interface in MDS mode.
137~140,
173~179
I/O4
TEST0
169
I2
Test 0 pin. At normal operation this pin must be connected

to GND.
TEST1
170
I2

to GND.
TEST2
171
I2

to GND.
nEINT0/GIP[3]
nECS2/GOPA[8]
GIOP[10:0]
Description
General I/O port.
Repair Manual
Samsung Electronics
3-5
CIRCUIT DESCRIPTION
Signal
I/O Type
Description
12,13
O1
Not external chip select. Three I/O banks are provided for
external memory-mapped I/O operations. Each I/O bank
contains up to 4M half-word. The nECS signals indicate that
an external I/O bank is selected.
nRCS[2]
51
O2
nRCS[1]/GOPA[7]
50
O1
nRCS[0]
49
O1
102
O1
Scan motor control/Bi-phase
105
O1
Scan motor control/Bi-phase
103, 104,
106, 107
O1
Scan motor bi-current/uni-phase
118~120
O1
PWM out signal
VDO2/GOPA[29]
121
O4
Video out from PIFC
VDO1/GOPA[14]
LSU_CLK/
122
O5
Video out from LSU control
123
O1
Clock for LSU motor
nECS[1:0]
SC_CONPHA/
GOPA[19]
SC_CONPHB/
GOPA[20]
SC_CUR[3:0]
PWMO[2:0]/
GOPA[13:11]
GOPA[15]
nHSYNC1/GIP[10]
Not ROM/SRAM chip select. The KS32C65100 can access

up to three external ROM/SRAM banks. nRCS[0]
corresponds to ROM/SRAM bank 0, nRCS[1] to bank 1, and
nRCS[2] to bank 2. By controlling the nRCS signals, CPU
addresses can be mapped into the physical memory banks.
125
I1
HSYNC1
nLREADY/GIP[11]
126
I1
LSU ready
nHSYNC2/GIP[12]
127
I1
HSYNC2
VDI/GIP[13]
128
I2
Video data input from RET
VCLK/GIP[14]
129
I2
External video clock
nEXTWAIT/GIP[7]
130
I3
External wait
RTCXIN
202
I7
RTC oscillator clock input.
RTCXOUT
203
O7
RTC oscillator clock output.
196~198
O1
CIS LED signals
205
I5
Top reference voltage for general ADC
GAIN[2:0]
206~208
I5
Analog inputs for general ADC
RTC_VDD
201
SLED[2:0]/
GOPA[18:16]
GAVRT
Signal
VDD_PLL
SAVDD
Pin No.
186
RTC VDD.
I/O Type
Description
PLL power (3.3V).
Analog power for scan ADC and general ADC (3.3V).
SAVSS
Scan ADC ground.
GAVSS
204
15, 30, 81,
115, 131,
160
48, 67, 89,
141, 195
3VDD
5VDD
VSS
3-6
Pin No.
11, 25, 39,

58, 76, 101,
108, 124,
150, 172,
181
General ADC ground

3.3V internal power.
Externally connected to the 3.3V regulator.
5V I/O power.
Externally connected to the VCC board plane.
System ground.
Externally connected to the ground board plane.
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
3-1-3 PROGRAM ROM (FLASH MEMORY)

1) DEVICE
TYPE No.
CAPACITY
AM29F800B
2 Mbit (512K * 16bit * 2)
2) PROGRAMMING
BEFORE ASSY
AFTER ASSY
EPROM PROGRAMMER or PROGRAMMING at the factory

DOWNLOAD from PC
3-1-4 DRAM CONTROL

1) DEVICE
TYPE NO.
CAPACITY
K4E641611D-TC50(EDO Type)
64 Mbit (4M * 16bit)
2) OPERATING PRINCIPLE
DRAM can either read or write. The data can be stored in the DRAM only when the power is on. It stores data white the
CPU processes data. The address to read and write the data is specified by RAS SIGNAL and CAS SIGNAL.
DRAMWE*SIGNAL is activated when writing data and DRAMOE*SIGNAL, when reading.
3-1-5 USB (Universal Serial Bus)

SAMSUNGS UNICON is used as the interface IC and 48MHz clock is used.
When the data is received through the USB port, USBIRQ SIGNAL is activated to send interrupt to CPU, then it directly
sends the data to DRAM by USB_CS SIGNAL through D(0;7).
3-1-6 Modem and TX-and RX Related Circuits

MODEM
The Conexant FM336 modem is a V.34 half-duplex modem that supports Group 3 facsimile send and receive speeds
up to 33600 bps using the V.34 half-duplex mode. Using a V.34 technique to optimize modem configuration for line conditions, the modem connects at the optimal selected data rate that the channel can support from 33600 bps to 2400 bps.
The modem can operate over the public switched telephone network (PSTN) through a line terminator provided by a Data
Access rrangement (DAA). The modem satisfies the requirements specified inITU-T recommendations V.34, V.17, V.29,
V.27 ter, V.23, V.21, and meets the binary signal ingrequirements of V.8 and T.30. Internal HDLC support eliminates the
need for an external serial input/output (SIO) device in the DTE for products incorporating error detection and T.30 protocol. The modem can perform HDLC framing per T.30 at all data speeds. CRC generation/checking along with zero insertion/deletion enhances DLC/HDLC frame operations. An FSK flag pattern detector facilitates FSK detection during high
speed reception.The modem features a programmable DTMF transmitter/receiver and three programmable tone detectors
which operate in the tone mode.
The modem offers lower power consumption and small size to allow the design of compact system enclosures for use in
industrial, office, and home environments.The modem is available in a 100-pin PQFP package.
Repair Manual
Samsung Electronics
3-7
CIRCUIT DESCRIPTION
FM336 FEATURES
2-wire half
- duplex fax modem modes with send and receive data rates up to 33600 bps.
- V.34, V.17, V.29, V.27 ter, and V.21 channel 2
- Short train option in V.17 and V.27 ter
2-wire full
- duplex data modem modes
- V.21, V.23 (75 bps TX/1200 bps RX or 1200 bps TX/ 75 bps RX)
PSTN session starting
- V.8 signaling
HDLC support at all speeds
- Flag generation, 0 bit stuffing, ITU CRC
- 16 or CRC
- 32 calculation and generation
- Flag detection, 0 bit deletion, ITU CRC
- 16 or CRC
- 32 check sum error detection
- FSK flag pattern detection during high speed receiving
Tone modes and features
- Programmable single or dual tone generation
- DTMF receive
- Tone detection with three programmable tone detectors
Serial synchronous data
Parallel synchronous data
Automatic Rate Adaptation (ARA) in V.34 Half-Duplex
TTL and CMOS compatible DTE interface
- ITU-T V.24 (EIA/TIA-232-E) (data/control)
- Microprocessor bus (data/configuration/control)
Receive dynamic range: 0 dBm to 43 dBm for V.17, V.33, V.29, V.27terand V.21, 9 dBm to 43 dBm for V.34 half-duplex
Programmable RLSD turn-on and turn-off thresholds
Programmable transmit level: 0 to -15 dBm
Adjustable speaker output to monitor received signal
DMA support interrupt lines
Two 16-byte FIFO data buffers for burst data transfer with extension up to 255 bytes
NRZI encoding/decoding
Diagnostic capability
+3.3V operation with +5V tolerant inputs
+5V analog signal interface
Typical power consumption:- Sleep mode: 20 mW
- Normal mode: 250 mWa
100-pin PQFP package
3-8
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
Signaling Rates, and Data Rates

Configuration
V.34 33600 TCM
V.34 31200 TCM
V.34 28800 TCM
V.34 26400 TCM
V.34 24000 TCM
V.34 21600 TCM
V.34 19200 TCM
V.34 16800 TCM
V.34 14400 TCM
V.34 12000 TCM
V.34 9600 TCM
V.34 7200 TCM
V.34 4800 TCM
V.34 2400 TCM
Modulation1
Carrier Frequency
(Hz) 0.01%
Data Rate (bps)

0.01%
Symbol Rate
(Symbols/Sec.)
Bits/Symbol Data
Bits/Symbol TCM
Constellation
Points
TCM
TCM
TCM
TCM
TCM
TCM
TCM
TCM
TCM
TCM
TCM
TCM
TCM
TCM
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
33600
31200
28800
26400
24000
21600
19200
16800
14400
12000
9600
7200
4800
2400
3429 only
3200 min
3000 min
2800 min
2800 min
2400 min
2400 to 3429
2400 to 3429
2400 to 3429
2400 to 3429
2400 to 3429
2400 to 3429
2400 to 3429
2400 only
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
V.23 1200/75
FSK
1700/420
1200/75
1200
V.21
FSK
1080/1750
Up to300
300
V.17 14400 TCM

V.17 12000 TCM
V.17 9600 TCM
V.17 7200 TCM
TCM
TCM
TCM
TCM
1800
1800
1800
1800
14400
12000
9600
7200
2400
2400
2400
2400
6
5
4
3
1
1
1
1
128
64
32
16
V.29 9600
V.29 7200
V.29 4800
QAM
QAM
QAM
1700
1700
1700
9600
7200
4800
2400
2400
2400
4
3
2
0
0
0
16
8
4
V.27 ter 4800

V.27 ter 2400
DPSK
DPSK
1800
1800
4800
2400
1600
1200
3
2
0
0
8
4
FSK
1750
300
300
V.21 Channel 2
Notes:
1. Modulation legend: TCM:Trellis-Coded Modulation
QAM:
FSK:Frequency Shift Keying
DPSK:
2. Adaptive; established during handshake:
Carrier Frequency (Hz)
Symbol Rate (Baud)
V.34 Low Carrier
2400
1600
2800
1680
3000
1800
3200
1829
3429
1959
Quadrature Amplitude Modulation

Differential Phase Shift Keying
V.34 High Carrier

1800
1867
2000
1920
1959
Repair Manual
Samsung Electronics
3-9
CIRCUIT DESCRIPTION
Modem Functions Interface Signals
/RTS
XTLI
/CTS
XTL0
TXD
OR
TDCLK
CLKIN
Oscillator
XTCLK
V.24
Interface
Crystal
/RLSD
RXD
RIN
/RDCLK
TXA1
/DTR
TXA2
/DSR**
OH
/RI*
telephone
line
TIP
Line
Interface
RING
RINGD
/TALK
FM336
Modem
/RD
Host
Processor
/WR
EYEXY
/CS
EYESYNC
D[7:0]
EYECLK
Optional
Eye Pattern
Generator
RS[4:0]
IRQ
/RESET
TXRQ*
SPKR
RXRQ**
Speaker
Amplifier
+5V
+3.3V
AGND
Power Supply
DGND
* Selectable; TXRQ output replaces /RI output.

** Selectable; RXRQ output replaces /DSR output.
1176DG F2-1
3-10
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
FM336 Pin Signals

Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
Signal Label
RESERVED
RS2
RS3
RS4
/CS
/WR
/RD
/RDCLK
/RLSD
TDCLK
TXD
/CTS
VDD1
RESERVED
RESERVED
VSS
NC
/RESET
SR4OUT
NC
SR4IN
CLK_OUT
EYESYNC
EYECLK
MAVSS
MAVDD
SPKR
TXA2
TXA1
VREF
VC
RIN
MAVSS
/POR
RESERVED
RESERVED
/TALK
VDD
RESERVED
RESERVED
NC
M_CNTRL_SIN
M_CLKIN
M_TXSIN
M_SCK
M_RXOUT
M_STROBE
RESERVED
OH
VDD
I/O Type 1
IA
IA
IA
IA
IA
IA
OA
OA
OA
IA
OA
PWR
GND
OA
OA
IA
OA
OA
OA
GND
PWR
O(DF)
O(DD)
O(DD)
MI
MI
I(DA)
AGND
IA
O(DD)
PWR
IA
IA
IA
IA
IA
IA
O(DD)
PWR
Interface 3
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
DTE Serial Interface
NC
Modem Interconnect
Modem Interconnect
NC
Modem Interconnect
Modem Interconnect
Diagnostic Signal
Diagnostic Signal
Telephone Line Interface
Modem Interconnect
Modem Interconnect
Te lephone Line Interface
Modem Interconnect
NC
Modem Interconnect
Modem Interconnect
Modem Interconnect
Modem Interconnect
Modem Interconnect
Modem Interconnect
-
Pin
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
Signal Label
RESERVED
VSUB
VSS
NC
NC
Sleep
VDD1
RESERVED
RESERVED
NC
SR1IO
VCORE
VDD1
XTCLK
VSS
RESERVED
RXD
/DTR
VDD1
IA_SLEEP
VGG
YCLK
XCLK
EYEXY
/DSR
/RI
RINGD
/RTS
IRQ
VSS
GPO0
RESERVED
RESERVED
VDD1
XTALI/CLKIN
XTALO
D0
D1
D2
D3
D4
VDD1
D5
D6
D7
RS0
RS1
PLL_VDD
VSS
PLL_GND
I/O Type 1
GND
GND
MI
PWR
MI
PWR
PWR
IA
GND
OA
IA
PWR
MI
PWR
OA
OA
OA
OA
OA
IA
IA
OA
GND
MI
PWR
I
O
IA/OB
IA/OB
IA/OB
IA/OB
IA/OB
PWR
IA/OB
IA/OB
IA/OB
IA/OB
IA/OB
PWR
GND
GND
Interface 3
NC
NC
Modem Interconnect
NC
Modem Interconnect
Modem Interconnect
Overhead Signal
Overhead Signal
Diagnostic Signal
Te lephone Line Interface
HOST Interface
Modem Interconnect
Overhead Signal
Overhead Signal
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
HOST Interface
-
Notes:
1.
I/O types:
MI = Modem interconnect.
IA, IB = Digital input.
OA, OB = Digital output.
I(DA) = Analog input.
O(DD), O(DF) = Analog output.
2.
NC = No external connection required.
RESERVED = No external connection allowed.
3.
Interface Legend:
HOST = Modem Control Unit (Host)
DTE = Data Terminal Equipment
Repair Manual
Samsung Electronics
3-11
CIRCUIT DESCRIPTION
FM336 Signals Definitions

Label
I/O Type
TXA1, TXA2
O(DD)
RIN
O(DA)
RINGD
IA
/TALK
O(DD)
OH
O(DD)
/RI
OA
Signal Name/Description
TELEPHONE LINE INTERFACE/AUXILIARY
Transmit Analog 1 and 2. The TXA1 and TXA2 outputs are differential outputs 180 degrees out of phase
with each other. Each output can drive a 300 load.
Receive Analog. RIN is a single-ended receive data input from the telephone line interface or an optional
external hybrid circuit.
Ring Detect. The RINGD input is monitored for pulses in the range of 15 Hz to 68 Hz. The frequency
detection range may be changed by the host in DSP RAM. The circuit driving RINGD should be a 4N35
optoisolator or equivalent. The circuit driving RINGD should not respond to momentary bursts of ringing
less than 125 ms in duration, or less than 40 VRMS (15 Hz to 68 Hz) across TIP and RING. Detected ring
signals are reflected on the /RI output signal as well as the RI bit.
Relay B Control. The /TALK open collector output can directly drive a +5V reed relay coil with a minimum
resistance of 360 ohms (13.9 mA max. @ 5.0V) and a must-operate voltage no greater than 4.0 VDC. A
clamp diode, such as a 1N4148, should be installed across the relay coil. An external transistor can be
used to drive heavier loads (electro-mechanical relays). /TALK is controlled by host setting/resetting of the
RB bit.
In a typical application, /TALK is connected to the normally closed Tal k/Data relay (/TALK). In this case,
/TALK active opens the relay to disconnect the handset from the telephone line.
Relay A Control. The OH open collector output can directly drive a +5V reed relay coil with a minimum
resistance of 360 ohms (13.9 mA max. @ 5.0V) and a must-operate voltage no greater than 4.0 VDC. A
clamp diode, such as a 1N4148, should be installed across the relay coil. An external transistor can be
used to drive heavier loads (electro-mechanical relays). OH is controlled by host setting/resetting of the RA
bit.
In a typical application, OH is connected to the normally open Off-Hook relay (OHRC). In this case, OH
active closes the relay to connect the modem to the telephone line.
Alternatively, in a typical application, OH is connected to the normally open Caller ID relay (CALLID). When
the modem detects a Calling Number Delivery (CND) message, the OH output is asserted to close the
CALLID relay in order to AC couple the CND information to the modem RIN input (without closing the offhook relay and allowing loop current flow which would indicate an off-hook condition).
Ring Indicator. /RI output follows the ringing signal present on the line with a low level (0 V) during the ON
time, and a high level (+3.3 V) during the OFF time coincident with the ringing signal. The RI status bit
reflects the state of the /RI output.
DIAGNOSTIC SIGNALS
EYEXY
OA
EYECLK
OA
EYESYNC
OA
SPKR
O(DF)
Three signals provide the timing and data necessary to create an oscilloscope quadrature eye pattern. The
eye pattern is a display of received baseband constellation. By observing this constellation, common line
disturbances can usually be identified.
Serial Eye Pattern X/Y Output. EYEXY is a serial output containing two 11-bit diagnostic words (EYEX
and EYEY) for display on the oscilloscope X axis (EYEX) and Y axis (EYEY). EYEX is the first word clocked
out; EYEY follows. Each word has 8-bits of significance. EYEXY is clocked by the rising edge of EYECLK.
This serial digital data must be converted to parallel digital form by a serial-to-parallel converter, and then to
analog form by two digital-to-analog (D/A) converters.
Serial Eye Pattern Clock. EYECLK is a 336 kHz output clock for use by the serial-to-parallel converters.
The low-to-high transitions of RDCLK coincide with the low-to-high transitions of EYECLK. EYECLK,
therefore, can be used as a receiver multiplexer clock.
Serial Eye Pattern Strobe. EYESYNC is a strobe for loading the D/A converters.
SPEAKER INTERFACE
3-12
Speaker Analog Output. The SPKR output reflects the received analog input signal. The SPKR on/off and
three levels of attenuation are controlled by bits in DSP RAM. When the speaker is turned off, the SPKR
output is clamped to the voltage at the VC pin. The SPKR output can drive an impedance as low as 300
ohms. In a typical application, the SPKR output is an input to an external LM386 audio power amplifier.
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
FM336 Signals Definitions (Contd)

Label
I/O Type
VC
MI
VREF
MI
/POR
/RESET
CLK_OUT
SR4OUT
SR4IN
SR1IO
M_CNTRL_SIN
M_CLKIN
M_TXSIN
M_SCK
M_RXOUT
M_STROBE
SLEEP
IA_SLEEP
GPO0
IA
OA
MI
OA
IA
OA
IA
IA
IA
IA
IA
IA
MI
MI
MI
/RDCLK
OA
/RLSD
OA
TDCLK
OA
TXD
IA
REFERENCE SIGNALS AND MODEM INTERCONNECT
Low Voltage Reference. Connect to analog ground through 10 F (polarized, + terminal to VC)
and 0.1 F (ceramic) in parallel.
High Voltage Reference. Connect to VC through 10 F (polarized, + terminal to VREF) and 0.1 F
(ceramic) in parallel.
Power-On-Reset. Connects to /RESET.
Reset. Connects to /POR.
IA Clock. Connect to M_CLKIN.
SR4OUT. Connect to M_TXSIN.
SR4IN. Connect to M_RXOUT.
SR1IO. Connect to M_CNTRL_SIN.
M_CNTRL_SIN. Connect to SR1IO.
M_CLKIN. Connect to CLK_OUT.
M_TXSIN. Connect to SR4OUT.
M_SCK. Connect to EYECLK.
M_RXOUT. Connect to SR4IN.
M_STROBE. Connect to EYESYNC.
SLEEP. Connect to IA_SLEEP.
IA_SLEEP. Connect to SLEEP
GPO0. Connect to /RDCLK.
DTE SERIAL INTERFACE

Receive Data Clock. The modem outputs a synchronous Receive Data Clock (/RDCLK) for USRT
timing. The /RDCLK frequency is the data rate (0.01%) with a duty cycle of 50 1%. The /RDCLK
low-to-high transitions coincide with the center of the received data bits.
Received Line Signal Detector. For V.17, V.33, V.29, and V.27 ter; RLSD goes active at the end
of the training sequence. If energy is above the turn-on threshold and training is not detected, the
/RLSD off-to-on response time is 816 baud times for V.17/V.33, V.29, and V.27 ter long train; 492
baud times for V.17/V.33; and 486 baud times for V.27 ter short train. The /RLSD on-to-off time is
40 5 ms for V.17/V.33, 35 5 ms for V.29 or 11.6 5 ms for V.27 ter. The /RLSD on-to-off time
ensures that all valid data bits have appeared on RXD.
The /RLSD programmable threshold levels default to 43dBm for off-to-on and to 48dBm for onto-off. A minimum hysteresis of 2 dBm exists between the actual off-to-on and on-to-off transition
levels. The threshold level and hysteresis are measured with an unmodulated 2100 Hz tone applied
to the Receiver Analog (RXA) input.
Note: Performance may be degraded when the received signal level is less than 43dBm.
Data Clock. The modem outputs a synchronous Data Clock (DCLK) for USRT timing. The DCLK
frequency is the data rate (0.01%) with a duty cycle of 50 1%. The DCLK low-to-high transitions
coincide with the center of the data bits. Transmit Data (TXD) must be stable during the one
microsecond period immediately preceding the rising edge of DCLK and following the rising edge of
DCLK.
Transmit Data. The modem obtains serial data to be transmitted from the local DTE on the
Transmit Data (TXD) input in serial data mode (TPDM bit = 0), or from the interface memory
Transmit Data Register (TBUFFER) in parallel data mode (TPDM bit = 1).
Repair Manual
Samsung Electronics
3-13
CIRCUIT DESCRIPTION

Label
I/O Type
/CTS
OA
XTCLK
IA
RXD
OA
/DTR
IA
/DSR
OA
/RTS
IA
/CS
IA
/WR
IA
Clear To Send. /CTS active indicates to the local DTE that the modem will transmit any data
present on TXD. /CTS response times from an active condition of /RTS are shown in Tabl e 1-3.
External Transmit Clock. In synchronous communication, an external transmit data clock can be
connected to the modem XTCLK input. The clock supplied at XTCLK must exhibit the same
characteristics as TDCLK. The XTCLK input is then reflected at the TDCLK output.
Received Data. The modem presents received serial data to the local DTE on the Received Data
(RXD) output and to the interface memory Receive Data Register (DBUFFER) in parallel data
mode.
Data Terminal Ready. In V.8 and V.34 configuration, activating /DTR initiates the handshake
sequence. The DATA bit must be set to complete the handshake.
In V.21 or V.23 configuration, activating /DTR causes the modem to enter the data state provided
that the DATA bit is a 1. If in answer mode, the modem immediately sends answer tone. During the
data mode, deactivating /DTR causes the transmitter and receiver to turn off and return to the idle
state.
The /DTR input and the /DTR control bit are logically ORed.
Data Set Ready. DSR ON indicates that the modem is in the data transfer state. DSR OFF
indicates that the DTE is to disregard all signals appearing on the interchange circuits except Ring
Indicator (/RI). /DSR is OFF when the modem is in a test mode (local analog or remote digital
loopback). The /DSR status bit reflects the state of the /DSR output.
Request to Send. The active low /RTS input allows the modem to transmit data present at TXD in
the serial data mode (TPDM bit = 0), or in DBUFFER in the parallel data mode (TPDM bit = 1),
when /CTS becomes active.
The /RTS hardware control input is logically ORed with the /RTSP bit by the modem to form the
resultant control signal.
HOST INTERFACE
Chip Select. The active low /CS input selects and enables the modem DSP for parallel data
transfer between the DSP and the host over the microprocessor bus.
Write. Writing is controlled by the host pulsing /WR input low during the microprocessor bus access
cycle. The write timing is:
Parameter
CS Setup Time
RSi Setup Time
Control Hold Time
Write Data Setup Time
Write Data Hold Time
Symbol
TCS
TRS
THC
TWDS
TDHW
Min.
0
10
10
20
10
Max.
Units
ns
ns
ns
ns
ns
Note:
/RD
IA
A read or write operation following a write operation must be delayed by at least 4 XCLK
cycles.
Read Enable. Reading is controlled by the host pulsing /RD input low during the microprocessor
bus access cycle. The read timing is:
Parameter
CS Setup Time
RSi Setup Time
Data Access Time
Data Hold Time
Control Hold Time
Symbol
TCS
TRS
TDA
TDHR
THC
Min.
0
10
10
10
Max.
45
Units
ns
ns
ns
ns
ns
Notes:
1. /CS and /RD must not both be continuously active.
A read or write operation following a read operation must be delayed by at least 2 XCLK cycle.
3-14
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Samsung Electronics
CIRCUIT DESCRIPTION

Label
I/O Type
IRQ
OA
D0-D7
IA/OB
RS0-RS4
IA/OB
VDD1
VSS
VGG
MAVSS
MAVDD
VDD
VSUB
XCLK
PWR
DGND
PWR
AGND
PWR
PWR
GND
OA
YCLK
OA
Interrupt Request. Interrupt request outputs may be connected to the host processor interrupt
request input in order to interrupt host program execution for immediate modem service. The IRQ
output can be enabled in DSP interface memory to indicate immediate change of conditions in the
modem. The use of IRQ is optional depending upon modem application.
The IRQ output structure is an open-drain field-effect-transistor (FET). The IRQ output can be wireORed with other IRQ lines in the application system. Any of these sources can drive the host
interrupt input low, and the host interrupt servicing process normally continues until all interrupt
requests have been serviced (all IRQ lines have returned high).
Because of the open-drain structure of IRQ#, an external pull-up resistor to +3.3V is required at
some point on the IRQ line. The resistor value should be small enough to pull the IRQ line high
when all IRQ drivers are off (it must overcome the leakage currents). The resistor value should be
large enough to limit the driver sink current to a level acceptable to each driver. If only the modem
IRQ# output is used, a resistor value of 5.6K ohms, 20%, 0.25 W, is sufficient.
Data Lines. Eight bi-directional data lines (D0D7)provide parallel transfer of data between the
host and the modem. The most significant bit is D7. Data direction is controlled by the Read Enable
(READ#-2) and Write Enable (WRITE#-R/W#) signals.
During a read cycle, data from the DSP interface memory register is gated onto the data bus via
three-state drivers in the DSP. These drivers force the data lines high for a one bit, or low for a zero
bit. When not read, the three-state drivers assume their high-impedance (off) state.
During a write cycle, data from the data bus is copied into the selected DSP interface memory
register, with high and low bus levels representing one and zero bit states, respectively.
Register Select Lines. Five active high Register Select inputs (RS0RS4) address interface
memory registers within the DSP when /CS is low. These lines are typically connected to address
lines A0-A4.
When selected by /CS low, the DSP decodes RS0 through RS4 to address one of 32 8-bit internal
interface memory registers (00-1F). The most significant address bit is RS4 while the least
significant address bit is RS0. The selected register can be read from, or written into, via the 8-bit
parallel data bus (D0D7).
OVERHEAD SIGNALS
Label
XTALI/CLKIN
3.3V Supply Voltage for DSP Digital Circuits.

Digital ground.
5V Supply Voltage for DSP Digital Circuits.
Analog ground.
5V Supply Voltage for IA Analog Circuits.
5V Supply Voltage for IA Digital Circuits.
Connect to analog ground.
XCLK Output. Output clock at 63.5045 MHz, which runs during normal operational mode and
turned off during Sleep Mode.
YCLK. Output clock at 28.224 MHz, which runs during normal operational mode and turned off
during Sleep Mode..
I/O Type
I/O
Crystal In/Clock In. Connect to an external 28.224 MHz crystal circuit or an external 28.224 MHz
oscillator circuit.
Label
XTALO/NC
I/O
PWR
DGND
PWR
-
Oscillator
XTALI/CLKIN
XTALI
CLKIN
Crystal Out/NC. Connect to the external crystal circuit return or leave open.
Label
PLL_VDD
PLL_GND
VCORE
RESERVED
Crystal
Crystal
Oscillator
XTALO/NC
XTALO
NC
PLL Supply Voltage.
PLL Supply Voltage return.
3.3V Supply Voltage. Connect to VDD1.
Reserved pins are used for future development and should not be connected to any circuitry.
Repair Manual
Samsung Electronics
3-15
CIRCUIT DESCRIPTION
3-1-7 Scanner Part

CIS DRIVER, INPUT PROCESSOR
CIS contacl signal is consist of BLED, RLED, GLED, CIS_CLK CIS_SI. CIS driver power supply is +5v, LED driver power
supply is +5v also. As CIS input signal, minc-Vref values O, MAXC+Vref Values is about 1.2V.
SPECIFICATION
Readable width
Number of sensor elements
Resolution
Scanning speed
Light source
216mm
2552 dots(21~2572 dots available)
75 ms/line
7.5 ms/line
Color LEDs
Red (640 mm)
Green(525mm)
Blue(470mm)
1 analogue
18.0 X 12.2 X 231.0 mm (attachment)
Data output
Outward dimension(WXHXL)
PIN FUNCTION DESCRIPTION

No.
1
2
3
4
5
6
7
8
9
10
11
12
3-16
Signature
SIG
GND
VDD
GND
GND
SI
GND
CLK
LEDB
LEDG
LEDR
VLED
Name
signal output
Ground
Supply voltage
Ground
Ground
Start pulse
Ground
Clock
LED Ground (blue)
LED Ground (green)
LED Ground (red)
Supply voltage
Description
Video output signal
0V DC ; reference point
+5V DC supply (ref. to GND)
Start pulse
CIS main clock
LED POWER SUPPLY BLUE
LED POWER SUPPLY GREEN
LED POWER SUPPLY RED
LED POWER SUPPLY
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
ELECTRICAL CHARACTERISTICS (TA=25C)

Item
Power Supply
Input Voltage
Input Current
LED Current
Clock Frequency.
Clock Pulse L Duty
Setup Time
Hold Time
SIG Delay Time
Sampling Reriod
SYMBOL
VDD
VLED
VIH
VIL
IIH
IIH
ILEDr
ILEDg
ILEDb
CLK
MIN.
4.75
4.75
3.2
tsu
th
tpd 1
tpd 2
ts
TYP.
5.0
5.0
MAX.
5.25
5.25
UNIT
V
V
V
V
A.
mA.
mA.
mA.
mA.
MHz
%
ns
ns
ns
ns
ns
0.8
20
0.2
30
60
60
2
15
tw/2
tw/2
250
30
90
NOTE
SI & CLK
SI & CLK
REF.
REF.
REF.
tw/to
CIS Driver Clock Timing
to
CLK
tsu
tw
S1
th
tpd2
tpd1
SIG
ts
1st
2nd
Repair Manual
Samsung Electronics
3-17
CIRCUIT DESCRIPTION
CIS Block Diagram

VLED
LEDR
LEDG
LEDB
ROD LENS ARRAY
VDD
GND
1
20 21
SENSOR
SHIFT REGISER & ANALOG SWITCH
S1
CLK
OP AMP
SIG
2.5ms
ST
1.2ms
1.2ms
LED_R
OFF
ON
OFF
1.2ms
ON
LED_G
OFF
OFF
1.2ms
LED_B
ON
OFF
OFF
SIG O/P
B O/P
R O/P
G O/P
B O/P
R O/P
G O/P
7.5ms/line
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CIRCUIT DESCRIPTION
3-1-8 HOST INTERFACE:

Parallel Port Interface
PARALLEL PORT INTERFACE PART KS32C61100 has the Parallel Port Interface Part that enables Parallel Interface with
PC. This part is connected to PC through Centronics connector. It generates major control signals that are used to actuate parallel communication. It is comprised of/ERROR, PE, BUSY, /ACK, SLCT, /INIT, /SLCTIN, /AUTOFD and /STB. This
part and the PC data transmission method support the method specified in IEEE P1283 Parallel Port Standard
(http://www.fapo.com/ieee1284.html). In other words, it supports both compatibility mode (basic print data transmitting
method), the nibble mode (4bit data; supports data uploading to PC) and ECP (enhanced capabilities port: 8bits data - high
speed two-way data transmission with PC). Compatibility mode is generally referred to as the Centronics mode and this is
the protocol used by most PC to transmit data to the printer. ECP mode is an improved protocol for the communication
between PC and peripherals such as printer and scanner, and it provides high speed two-way data communication. ECP
mode provides two cycles in the two-way data transmission; data cycle and command cycle. The command cycle has two
formats; Run-Length Count and Channel Addressing. RLE (Run-Length Count) has high compression rate (64x) and it
allows real-time data compression that it is useful for the printer and scanner that need to transmit large raster image that
has a series of same data. Channel Addressing was designed to address multiple devices with single structure. For example, like this system, when the fax/printer/scanner have one structure, the parallel port can be used for other purposes while
the printer image is being processed.This system uses RLE for high speed data transmission. PC control signals and data
send/receive tasks such as PC data printing, high speed uploading of scanned data to PC, upload/download of the fax
data to send or receive and monitoring the system control signal and overall system from PC are all processed through
this part.
Repair Manual
Samsung Electronics
3-19
CIRCUIT DESCRIPTION
COMPATIBILITY HARDWARE HANDSHAKING TIMING
PPD( 7: 0)
DATA
BUSY
nSTROBE
nACK
ECP HARDWARE HANDSHAKING TIMING (FORWARD)
3 4
nSTROBE
BUSY
PPD( 7: 0)
BYTE0
nAUTOFD
DATA BYTE
BYTE1
COMMAND BYTE
1. The host places data on the data lines and indicates a data cycle by setting nAUTOFD
2. Host asserts nSTROBE low to indicate valid data
3. Peripheral acknowledges host by setting BUSY high
4. Host sets nSTROBE high. This is the edge that should be used to clock the data into the Peripheral
5. Peripheral sets BUSY low to indicate that it is ready for the next byte
6. The cycle repeats, but this time it is a command cycle because nAUTOFD is low
3-20
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
ECP HARDWARE HANDSHAKING TIMING (REVERSE)
1 2
5 6
nACK
nAUTOFD
PPD( 7: 0)
BUSY
BYTE1
BYTE0
DATA BYTE
COMMAND BYTE
nINI T
PE
1. The host request a reverse channel transfer by setting nINIT low

2. The peripheral signals that it is OK to proceed by setting PE low
3. The peripheral places data on the data lines and indicates a data cycle by setting BUSY high
4. Peripheral asserts nACK low to indicate valid data
5. Host acknowledges by setting nAUTOFD high
6. Peripheral sets nACK high. This is the edge that should be used to clock the data into the host
7. Host sets nAUTOFD low to indicate that it is ready for the next byte
8. The cycle repeats, but this time it is a command cycle because BUSY is low
Repair Manual
Samsung Electronics
3-21
CIRCUIT DESCRIPTION
USB INTERFACE
CS
RD
VVR
A0/ALE
D[7:0]/AD[7:0]
INTR
MODE[1:0]
RESET
Vcc
GND
Microcontroller Interface
Endpoint/Contol FIFOs
48 MHz
Oscillator
Status
Control
RX
Clock
TX
XIN
XOUT
CLKOUT
Generator
SIE
Media Access Controller[MAC]
Clock
Recovery
Physical Layer interface[PHY]
USB Event
Detect
V3.3
Trans ceiver
D+
D-
VReg
AGND
Upstream Port
Full-Speed USB Node Device

USB transceiver
3.3V signal voltage regulator
48 MHz oscillator circuit
Programmable clock generator
Serial Interface Engine consisting of Physical Layer In-terrace (PHY) and Media Access Controller (MAC), USB
Specification 1.0 compliant
Control/Status Register File
USB Function Controller with seven FIFO-based End-points :
- One bidirectional Control Endpoint 0 (8bytes)
- Three Transmit Endpoints (2*32 and 1*64 bytes)
- Three Receive Endpoints (2*32 and 1*64 bytes)
8-bit parallel interface with two selectable modes :
- non-multiplexed
- multiplexed (Inter compatible)
DMA support for parallel interface
MICROWIRE/PLUS Interface
28-pin SO package
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CIRCUIT DESCRIPTION
NON-MULTIPLEXED MODE INTERFACE BLOCK DIAGRAM
CS
DATA_IN
0x00
A0
DATA_IN
VVR
RD
DATA_OUT
DATA_OUT
D[7:0]
ADDRESS
ADDR
0x3F
REGISTERFILE
NON-MULTIPLEXED MODE BASIC TIMING DIAGRAM
cs
A0
RD
VVR
D[7:0]
input
out
vvrte Address
Read Data
out
Burst Read Data
Repair Manual
Samsung Electronics
3-23
CIRCUIT DESCRIPTION
3-2 OPE PBA

3-2-1 SUMMARY
OPE Board is separated functionally from the main board
and operated by the micom(HT48C5A) in the board. OPE
and the main use UART (universal asynchronous receiver/transmitter) channel to exchange information. OPE
reset can be controlled by the main.
OPE micom controls key-scanning and LCD and LED display, detects documents and senses SCAN position. If
there occurs an event in OPE (such as key touch and sensor level change), it sends specific codes to the main to
respond to the situation and the main analyzes these
codes and operates the system.
For example, it the main is to display messages in OPE,
the main transmits data through UART line to OPE
according to the designated format and OPE displays this
on LCD, LED. OPEs sensing is also transmitted to the
main through UART line and then the main drives neces-
sary operation.
OPE PBA consists of U1(MICOM, HT48C5A),LCD, key
matrix, LED indicators, SCAN position sensor and the
document detect sensor. Refer to OPE Schematic
Diagram and Wiring Diagram sections of this manual.
Display from the controller is received at U2 pin 47

(RX DATA).
LCD drive signals are sent from P1-x pin group, P14~P1-14 pins.
Machine status LED drive signals are sent from U2
LED0~LED4.
Document detect sensor output is received at U2 pin 1.
Scan position sensor output is received at U2 pin7
Scan
Position
Sensor
RESONATOR
7.37 MHz
11
Document
Detect
Sensor
MICOM
HT48C5A
LCD
16x 1Line
7
X
Y
Key Matrix
UART
Connector
Reset
LEDs
<OPE BLOCK DIAGRAM>
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CIRCUIT DESCRIPTION
3-3 LIU PBA

The LIU (Line Interface Unit) using the discrete method is comprised of the following.
(1) Tel_line Interface Circuit that connects the PSTN(exchange) and the system (Facsimile)
(2) Telephone circuit composed of dial/speech circuit.
3-3-1 Tel_Line interface Circuit

Tel_Line Interface is the path that connects the signals between PSTN(exchange) and the system (Facsimile) and it is comprised of Tel-Line Interface Circuit and Impedance Matching Trans Circuit.
(1) TEL_LINE Interface Circuit
(2) TRANS Circuit for IMPEDANCE MATCHING
3-3-2 Telephone Circuit (Ringer/Dial/Speech Circuit, etc)

The telephone circuit is comprised of ring detect circuit, dialer circuit, speech circuit, external hook detect circuit and recall
circuit.
(1) Ring Detect Circuit
(2) Dialling Circuit (including MF Dialling Signal Transmitting Circuit)
(3) Speech Circuit
(4) External Hook Detect Circuit
(5) Recall Circuit
Repair Manual
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3-25
CIRCUIT DESCRIPTION
3-3-3 Detailed Spec.

TEL_LINE INTERFACE CIRCUIT
1) TEL_LINE INTERFACE CIRCUIT
It is an interface that physically connects facsimile to the PSTN (public switching telephone network) through TIP and
RING as in fig. 1.
ARS 1-3 protects the system from voltage overload such as the surge coming through PSTN. ARS 2 and ARS 3 are
used as overload protection in common mode (between TIP/RING and FRAME GROUND). ARS 1 is used as overload protection in normal mode (between TIN and RING) and it uses ARRESTOR for 600V. However, arrestors rated
voltage differs from European and USA(400v).
CML (CONNECT MODEM to LINE) RELAY K1 is a switch designed to selectively connect the PSTN to system voice
communication path and fax communication path. In STAND_BY MODE and voice communication mode, it is connected to TEL PART and FAX PART while communicating and dialing.
CML Relay (K1): CML relay interfaces with T2(600:600) TRANS in communication mode.
DC Impedance: DC impedance is determined in the DC Feeding Unit. It represents DC characteristic of the computer connected through -48V DC power of the switch and lines. The DC characteristic of required by the communication standards of a number of countries is the DC resistance of 50~300 to the current range of 20mA~120mA.
(value varies depend on countries).
AC Impedance or Return Loss: AC impedance is determined by the peripheral circuits of T2 Transformer. It is the standard required for optimum signal transmission between computer and switch. When the AC impedance of the computer for AC signal transmission and the AC impedance of the switch matches, the signal can be transmitted without
loss. Therefore, communication standards specifies the AC impedance of the computer and it implies the return loss.
The communication standards of each country, considering the characteristic of their lines, requires 600 or the return
loss of 14dB and higher against the AC impedance of Complex and the AC signals of 300Hz~400Hz. The AC impedance of transformer changes depending on the load resistance, the core material, coil inductance and resistance, but
generally its characteristic against load resistance is considered.
K1
ARS2
TIP
to FAX
to TEL
ARS1
RING
ARS3
FG
<TEL_LINE INTERFACE CIRCUIT>
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Samsung Electronics
CIRCUIT DESCRIPTION
RINGER DIAL CIRCUIT

1) Ringer Circuit
The ring detect circuit detects the ring signal by sending the bell signal sent from PSTN to the primary photo coupler
(PC814). At this point, C(1uF/250V) is used to match the ring impedance and R is coupled directly in order to prevent
any damage to the photo coupler due to ring voltage.
2) Dialing Circuit
Dialing circuit is initiated only when the power is on and it is transmitted to line through the modem of main part (T2
trans)
3) External Hook Detect Circuit
In the discrete LIU method, the external hook detect circuit is designed to use both the photo coupler and current
detector in order to be used in all countries including the countries with low series resistance (Germany, Switzerland,
Belgium, Austria, etc.). To use photo coupler (PC814), you must carefully select the resister connected parallel (75)
to the photo coupler in order to satisfy the voltage drop standards of England and a few other countries. The diode
connected to the current detector pin (5/6) was used to detect the external hook all through when the line parity turns
over.
4) Recall Circuit
In the discrete LIU method, we used the recalling method using low cost photo coupler instead of using photo MOS
relay in order to initiate the recalling for handset hook off dialling after the power is turned on. In this case, the time
break recall was enabled by switching the power transistor of the telephone circuit using the secondary CPU control.
Repair Manual
Samsung Electronics
3-27
CIRCUIT DESCRIPTION
3-4 Engine PPA

3-4-1 Engine Configuration
3-4-1-1. Video Controller Board
Video Controller Board receives image data from the host computer and converts it into bitmap (binary) image or receives
bitmap image directly from the host computer and sends it to the engine controller board.
3-4-1-2. SMPS Board
It basically receives AC input and generates ripple-free DC level +5V and -5V +24V. Next, it supplies these voltages to each
unit appropriately.
It also supplies AC power to heat lamp of fixing unit.
3-4-1-3. HVPS Board

HVPS board generates high voltages of THV/MHV/Supply/Dev and supplies them to the developing unit to create images.
It is designed to realize optimum conditions for the images.
This board includes LSU interface unit and cover open sensing unit that it intercepts +24V voltage to the main motor, LSU,
fan, clutch and fixing unit when you open the front cover.
3-4-1-4. Developer
Using the digital picture process, developing unit generates visible images. It is comprised of charge roller, OPC drum,
developer roller, supply roller and toner.
3-4-1-5. LSU (Laser Scanning Unit)
This is controlled by engine controller. Using laser beam control, exposure of OPC drum and the rotational principle of polygon mirror, it forms electro-static latent image in the OPC drum with the video data received from engine. It is the core part
of LBP. OPC drum synchronizes with the feeding speed of the paper and rotates. When the laser beam inside LSU reaches at the end of polygon mirror, it generates /HSYNC signal and send it to engine. Then the engine detects /HSYNC signal and adjusts the lengthwise row of the image on the paper. After detecting /HSYNC and after set time period, it sends
the video data to LSU to adjust the left margin on the paper.
The one side of the polygon mirror is the one line scanned.
3-4-1-6. Transfer
Transcribing unit is comprised of PTL(pre-transfer lamp) and transcribing roller. PTL detects the beam of the OPC drum,
lowers the electric potential of the developing unit and lower the adhesiveness of toner to enhance transcription coefficient.
And the transcribing roller transfers the toner (constituting element of video image) on OPC drum to the paper.
3-4-1-7. Fixer
It is comprised of heat lamp, heat roller, pressure roller, thermistor and thermostat. It fixes the toner powder transferred to
the paper on the paper using pressure and high heat in order to finish the final printing job.
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CIRCUIT DESCRIPTION
3-4-2. Developing Process
3-4-2-1 Feeder
Engine operates this unit. Solenoid rotates the feed roller and feeds one paper. Then the paper is fed into the set and hits
the actuator of the feed sensor. At this point, the engine detects the signal and prepares to spray according to the image
data. If any problem happens to this feed sensor operation, the system displays paper jam error on the OP panel.
Also, feed sensor unit is closely related to the paper margin.
3-4-2-2. Electrifier
This unit electrifies consistent negative voltage to OPC. When the high negative voltage (-1550V) is allowed to charge roller,
the OPC drum surface will be consistently electrified with approximately +1300V. This is the first process in generating the
digital picture.
3-4-2-3. Exposer
After receiving bitmap image data from engine board, LSU turns the laser diode either on or off depending on whether the
digital data is present or absent in order to expose the OPC drum with the switched laser beam data. The difference
between the voltages generated at this point is presented above. In other words, the part exposed to the laser will have 50V and its relative electric potential will increase and form electrostatic latent image.
The part unexposed to the laser as it did not have the video data will consistently retain -800V. Eventually, the image will
form in the part electrified and rose to -50V(forms black dot) and the part retaining -800V will be white in order to make the
basic condition to form the video data.
LSU
2.Charging
3.Exposure
4.Development
C/R
7.Fixing
8.Exit
EXIT
SENSOR
OPC
S/R
D/R
1.Feeding
H/R
P/R
T/R
6.Transfer
PTL
FEED
SENSOR
5.Pre-Transfer
< Engine Operating Description >
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3-29
CIRCUIT DESCRIPTION
3-4-2-4. Developer Unit

On the surface where OPC drum and developer roller (rotate in opposite direction) meet, the toner that has negative electric characteristic moves to the exposed part (-50V) due to the electric potential difference, but it will not move to the unexposed part (-800V).
3-4-2-5. Transfer Unit
OPC
1.3 KV
T/R
GND
Toner on the OPC drum is transferred to paper by transfer unit. In other words, the toner on the OPC drum surface is inducted by the transfer roller electrified to approximately +1.3KV(600~2800V variable) to the paper.
At this point, the voltage (600~2800V variable) is determined by temperature and humidity.
The above process is called transfer.
3-30
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
Thermistor
Heat Lamp
Heat Roller
Paper
Toner
Pressure
Spring
Roller
3-4-2-6. Anchorage unit

The toner transferred on to the paper is at the electronically low state and it can be easily scattered. Considering this fact,
we used heat (180C) and pressure (4kg) to fix the toner on the paper permanently. Then the image formed will remain on
the paper permanently. Heat roller transfers the heat from the heat lamp inside to the paper. The surface of the heat roller
specially coated with Teflon repels toner melted by the heat from the surface.
The pressure roller on the bottom of the heat roller is made of silicon resin and its surface is also coated with Teflon. The
thermistor of the fixer unit detects the surface temperature of the heat roller and feeds this information back in order to retain
180C while printing and 135C, while on standby. The thermostat is used as the secondary safety device and it prevents
overheat by shutting the main power when the heat lamp
is overheated.
3-4-2-7. Exit
After the digital picture process is finished, the printed paper will come out of the set through the exit sensor. The signal
detected will be transferred to the engine and provide the position information. If the actuator and the sensor do not work
normally, the system will display Paper Jam 2 Error.
Repair Manual
Samsung Electronics
3-31
CIRCUIT DESCRIPTION
BIAS OUTPUT UNIT BLOCK DIAGRAM
REGULATION
CIRCUIT
TRANS
SWITCHING
CONTROL UNIT
OUTPUT
CIRCUIT
MHV-PWM
SWITCHING
CONTROL UNIT
DEV-EA
SWITCHING
CONTROL UNIT
SUPPLY-EA
TRANSFER OUTPUT UNIT BLOCK DIAGRAM
THVPWM
PWM
CONTROL UNIT
SWITCHING
CONTROL UNIT
REGULATION
CIRCUIT
TRANS
THV
FE E DBACK
THVEA
SWITCHING
CONTROL UNIT
TRANS
REGULATION
CIRCUIT
THVREAD
THV
ENVIRONMENT
RECOGNITION
CIRCUIT
3-32
FEED BACK
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
3-4-2-8. MHV (Electrification Output Enable)

Electrification Output Enable is the electrification output control signal 'PWM-LOW ACTIVE'.
When MHV-PWM LOW signal is received, Q401 turns on and the steady voltage will be accepted to the non-inverting terminal of OP-AMP 324. As the voltage higher than the inverting reference voltage of OP-AMP, which is set to R405 and
R406, OP-AMP output turns high.
This output sends IB to the TRANS auxiliary wire through current-restricting resistance Q402 via R408 and C403 and Q402
turns on. When the current is accepted to Q402, Ic increases to the current proportional to time through the T401 primary
coil, and when it reaches the Hfe limit of Q402, it will not retain the "on" state, but will turn to "off". As Q402 turns 'off', TRANS
N1 will have counter-electromotive force, discharge energy to the secondary unit, sends current to the load and outputs
MHV voltage through the high voltage output enable, which is comprised of Regulation circuit.
T401
24VS
MHV OUTPUT
C404
3K/471
18V
D402
4KV
MHV-PWM
U2 7407
Q402
D526
R405 220K
Q401 A708
24VS
R411 2.2K
R403 130K
R402
82K
R412 2K
R408
47K
+
R404
27K
C408
104
R409
390
C406
3K/471
R416
15M
R417
15M
KA324
C403
333
R406
2.2K
Repair Manual
Samsung Electronics
3-33
CIRCUIT DESCRIPTION
3-4-2-9. BIAS (supply/dev output unit)

BIAS voltage output is generated only when electrification voltage is set to output. In the circuit presented above, it organizes enough zener-diodes required to output dev/supply voltage from electrification output.
Supply voltage is output when the supply-ea signal is 'L'. When supply-ea is 'L', Q104 turns off and as Q105 does not turn
on, the electric potential of the output unit retains the electric potential of zener and thus -500V is output as the supply voltage.
In case supply-ea signal is 'H', both Q104 and Q105 will turn on and the electric potential of the output unit will not retain
the electric potential of zener and become GND level and thus the output voltage will become .
The output condition of developer voltage is the same as that of the supply voltage.
T401
24VS
C404
3K/471
MHV
OUTPUT
18V
D402
4KV
MHV-PWM
U2 7407
Q402
D526
R405 220K
Q401 A708
24VS
C406
3K/471
R416
15M
R411 2.2K
R403 130K
R404
27K
R402
82K
C408
104
R412 2K
R417
15M
R409
390
KA324
C403
333
R406
2.2K
R113
10K
24VS
Q107 A1413
R114
33K
R117 10K
DEV-EA
R408
47K
R118
33K
R116
2.2K
DEV
OUTPUT
C107
1K/101
ZD401 150V
ZD402 150V
R115 3.3K
ZD403 51V
Q106
C3198
R106
10K
24VS
Q105 A1413
R107
33K
R109 10K
SUPPLY-EA
R110
2.2K
SUPPLY
OUTPUT
R111
33K
C106
1K/101
ZD404 150V
ZD405 150V
R108 33K
ZD406 100V
R112
2K
3-34
Q104
C3198
ZD407 100V
Repair Manual
Samsung Electronics
CIRCUIT DESCRIPTION
3-4-2-10. THV(THV(+)/THV(-) Output Unit)

Transfer(+) output unit is the transfer output control signal 'PWM-LOW ACTIVE'.
When THV-PWM LOW signal is received, Q203 turns on and the steady voltage will be accepted to the non-inverting terminal of OP-AMP 324. As the voltage is higher than the inverting reference voltage of OP-AMP, OP-AMP output turns high.
The 24V power adjusts the electric potential to ZD201 and ZD202, sends IB to TRANS auxiliary wire through currentrestricting resistance R215 via R212 and C204, and eventually Q204 will turn on. When the current is accepted to Q402,
Ic increases to the current proportional to time through the T201 primary coil, and when it reaches the Hfe limit of Q204, it
will not retain the "on" state, but will turn to "off". As Q402 turns 'off', TRANS N1 will have counter-electromotive force, discharge energy to the secondary coil, sends current to the load and outputs THV voltage through the high voltage output
enable, which is comprised of Regulation circuit. The output voltage is determined by the DUTY width. Q203 switches
with PWM DUTY cycle to fluctuate the output by fluctuating the OP-AMP non-inverting end VREF electric potential, and
the maximum is output at 0% and the minimum, at 100%.Transfer(-) output unit is THV-EA 'L' enable.
When THV-EA is 'L', Q302 turns on and the VCE electric potential of Q302 will be formed and sends IB to TRANS auxiliary wire through R311, C305 and VR302 via current-restricting resistance R314, and eventually Q303 will turn on. When
the current is accepted to Q303, Q303's Ic increases to the current proportional to time through the T301 primary coil, and
when it reaches the Hfe limit of Q303, it will not retain the "on" state, but will turn to "off". As Q303 turns 'off', TRANS N1
will have counter-electromotive force, discharge energy to the secondary coil, send current to load and output THV(-) voltage through the high voltage output enable, which is comprised of Regulation circuit.
5V
18V
24VS
R201
10K
#7
TEV-PWM
U2
T201
KAB-007
U2
1
R206
100
R205
1.8K
D201
1N4148
5 +
VR201
50K
U1
R209
100KF
R207
2K
24VS
C205
2KV68pF
R208
30K
Q203
A708Y
6
C201
103
C202
121
R210
845KF
D202
1N4148
R211
1MF
R213
2.2K
Q204
D526
11 KA324
D205
4KV
C207
3KV470pF
R218
MGR1/2W100KF
R216
SBR306
R212
680K
#19
D204
4KV
+ C101
35V47UF
#17
C206
3KV470pF
C203
472
D203
1N4148
ZD201 ZD202
5.65V 705V
C204
333Z
R214
2.2K
R215
390
R217
SBR207
5V
18V
C7
104
ZD1
5.6V
#5
TEV-EA
18V
D301
1N4148
R3
1/2W560
R312
1W56
R309
202K
6
7
U2
7407
R307
33K
24VS
KAB-006
T301
Q301
A708Y
C306
2KV68pF
18V
D-GND
C4
103
#24
TEV-READ
R310
2.2K
R308
33K
+ 10
U1
_
KA324
R301
470K
R302
33K
R303
100KF
C302
102
R304
389KF
D302
1N4148
C303
103
R306
26.1KF
C307
3KW470pF
Q303
D526
D304
4KV
R313
1W56
D303
4KV
C308
3KV470pF
R315
SBR306
Q302
A708Y
VR302
2K
R311
100KF
C305
333Z
4
R314
1.7K
R305
10KF
VR301
5K
C304
500V103Z
C301
222
Repair Manual
Samsung Electronics
3-35
CIRCUIT DESCRIPTION
3-4-2-11. Environment Recognition

THV voltage recognizes changes in transfer roller environment and allows the voltage suitable for the environment in order
to realize optimum image output. The analog input is converted to digital output by the comparator that recognizes the environmental changes of the transfer roller. It is to allow the right transfer voltage to perform appropriate environmental
response considering the environment and the type of paper depending on this digital output by the programs that can be
input to the engine controller ROM.
For ML-5000 or ML-5200 series, this environment recognition setting is organized as follows: First, set the THV(+) standard voltage. Allow 200M load to transfer output, enable output and set the standard voltage 800V using VR201. Then
set 78 (CPU's recognition index value) as the standard using VR302. This standard value with CPU makes sure that the
current feedback is 4A when output voltage is 800V and load is
200M.If the load shows different resistance value when 800V is output, the current feedback will also be different and
thus the index value will also be different. according to the index value read by CPU, the transfer voltage output will differ
according to the preset transfer table.
The changes in transfer output required by each load is controlled by PWM-DUTY.
3-36
Repair Manual
Samsung Electronics
SCHEMATIC DIAGRAMS
4.Schematic Diagrams
4-1 Main Circuit Diagram (1/6)
APOLLO2(MAIN)
Repair Manual
Samsung Electronics
4-1
SCHEMATIC DIAGRAMS
APOLLO2(MAIN)
4-2
Repair Manual
Samsung Electronics
SCHEMATIC DIAGRAMS
APOLLO2(MAIN)
Repair Manual
Samsung Electronics
4-3
SCHEMATIC DIAGRAMS
APOLLO2(MAIN)
4-4
Repair Manual
Samsung Electronics
SCHEMATIC DIAGRAMS
APOLLO2(MAIN)
Repair Manual
Samsung Electronics
4-5
SCHEMATIC DIAGRAMS
APOLLO2(MAIN)
4-6
Repair Manual
Samsung Electronics
SCHEMATIC DIAGRAMS
4-7 LIU Circuit Diagram (1/2)
APOLLO2(LIU)
Repair Manual
Samsung Electronics
4-7
SCHEMATIC DIAGRAMS
4-8 LIU Circuit Diagram (2/2)
APOLLO2(LIU)
4-8
Repair Manual
Samsung Electronics
SCHEMATIC DIAGRAMS
4-9 OPE Circuit Diagram
U3
CD74HC14MX
10
11
V16
+5V
CN1
GILS-5P-S2T2-EF
+5V
+5V
+5V
+5V
+5V
U3
CD74HC14MX
1
2
12
13
C13
10uF
C14
100nF
V17
R10
200
R11
200
16V
R44
200
R45
200
R40
200
R42
200
R41
200
R43
200
R47
200
R46
200
4
GND5
+5V
+5V
C21
+5V
GND5
LED1
SLS-NNGR202TS
3
100nF
+5V
R2
22K
GND5
LED2
SLS-NNGR202TS
Q1
KSA1182-Y
R37
22K
P1
P1
+5V
R1
U3
CD74HC14MX 14
200
1
U3
CD74HC14MXR38
U3
CD74HC14MX
Q4
KSA1182-Y
C15
47pF
C1
100pF
R34
680
P1
P1
P1
P1
P1
P1
P1
P1
47
U3
CD74HC14MX
X1
38
11
V1
C17
10uF
C16
47pF
GND5
P1
35
48
12
V2
16V
13
V3
CSA7.37MTZ-TF01
GND5
P1
37
C12
100nF
P1
R35
10K
P1
200
10
30
31
32
10
33
11
18
12
17
13
16
14
15
+5V
C18
220pF
C19
220pF
C20
220pF
R39 22K
1
7
D_SCAN
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
19
GND5
_INT
RXD
TMR0
XTAL1
TMR1
XTAL2
LED0
NC1
LED1
NC2
LED2
LED3
NC4
LED4
LCD_RS
LED5
LCD_RW
LED6
LED7
LCD_E
D_DET
VDD
TXD
NC3
GND5
GND5
14
V4
GND5
_RESET
LCD_D0
NC5
LCD_D1
NC6
LCD_D2
NC7
LCD_D3
NC8
LCD_D4
KEY0
LCD_D5
KEY1
LCD_D6
KEY2
LCD_D7
KEY3
SENSOR
KEY4
D_DET
KEY5
D_SCAN
KEY6
VSS
KEY7
LED5
SLS-NNGR202TS
Q3
KSA1182-Y
Q5
KSA1182-Y
GND5
POWER
GND5
TONER
E-MAIL
36
20
21
3K
R15
34
6
3K
R49
3K
R48
3K
R50
3K
R51
GND5
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
5
4
3
46
45
44
43
39
40
41
42
V9
D2
MMSD914T1
D1
MMSD914T1
D4
MMSD914T1
D3
MMSD914T1
D5
MMSD914T1
D7
MMSD914T1
D6
MMSD914T1
V10
V11
V12
V13
SW1
SW4
SW7
SW10
OHD/
V-REQUEST
COPY/
REPRINT
SW13
SEARCH
/DELETE
SW19
SW16
+5V
V14
V15
22
R7
22K
APOLLO2 (OPE)
23
24
2SW2
SW5
1SW3
SW6
SW8
STOP
START/
SW11
SW14
E-MAIL
>
SW17
SW20
25
R6
22K
26
27
28
SW9
SW12
SW15
REPORT/
HELP
ADVANCED FAX
SW21
SW18
29
R5
22K
GND5
GND5
LED4
SLS-NNGR202TS
GND5
PAPER
Q2
KSA1182-Y
GND5
TOLL
U2
LED3
SLS-NNGR202TS
GND5
KA2-14P8-2.54DSA
HT48R50
GND5
TOLL
<
SW47
SETUPSW52
SW48
RCV-MODE/
CONTRAST SW53
RECALL
SW49
RESOLUTION
SW54
05
SW22
10
SW27
15
SW32
20
SW37
SW42
04
SW23
09
SW28
14
SW33
19
SW38
PAPERSW43
REDIAL
03
SW24
08
SW29
13
SW34
18
SW39
POWER
SW44
02
SW25
07
SW30
12
SW35
17
01
SW26
06
SW31
11
SW36
16
R4
22K
R36
22K
+5V
R8
22K
+5V
TONER
SW45
SW40
R9
22K
R19
300
R18
300
R22
300
R21
300
SW41
R3
22K
U4
KPI-L05
1
3
A
D_DET
D_SCAN
U5
ITR-9702/F2
C5
100nF
C6
100nF
Engineer:
Ho-Jin Park
Drawn by:
SAMSUNG ELECTRONICS
Ho-Jin Park
R&D CHK:
GND5
GND5
GND5
GND5
Size:
TITLE:
DOC CTRL CHK:

MFG ENGR CHK:
Changed by:
Son-Hyun
Date Changed:
Time Changed:
QA CHK:
APOLLO2 (OPE)
REV:
2.0
Drawing Number:
Page:
1
Repair Manual
Samsung Electronics
4-9
SCHEMATIC DIAGRAMS
4-10 Scan Circuit Diagram (200DPI)
APOLLO2(200DPI)
4-10
Repair Manual
Samsung Electronics
SCHEMATIC DIAGRAMS
4-11 Scan Circuit Diagram (300DPI)
APOLLO2(300DPI)
Repair Manual
Samsung Electronics
4-11
SCHEMATIC DIAGRAMS
4-12 HVPS Circuit Diagram (1/2)
5V
18V
T401
KAB-006
Q401
A708-Y
R403
110KF
R404
33K
12
13
MHV-PWM
3
24VS
R405
220KF
R411
2.2K
R422
5.6K
R407
240K
C402
103
R401
100
Q402
D526-Y
14
CN1-#6
R402
56KF
U2-B
7407
R412
2K
C408
104
C401
331
VR401
50K
R501
5.6K
BIAS-PWM
CN1-#7
OPC
C403
333
D403
1N4148
R410
1W 3
U2-A
7407
R508
86.6KF
R507
27K
R502
2.2K
R505
100KF
R506
86.6KF
R504
2K
R510
47K
C503
104
Q501
A708-Y
ZD401
1W 130V
10
C501
104
VR501
50K
R509
12KF
T501
T1167
Q502
D526-Y
D502
4KV
5
2
R514
MGR1/2W 15MF
R417
MGR1/2W 15MF
R516
MGR1/2W 50K
SUPPLY
C506
3KV 471
C505
2KV 680
ZD501
1W 200V
R515
MGR1/2W 6MF
R512
430
R511
47K
U1-C
KA324
C502
222
R416
MGR1/2W 15MF
R414
MGR1/2W 6MF
24VS
R503
100
C406
3KV 471
D402
4KV
18V
5V
C405
2KV 680
R409
430
R406
2.2KF
C504
333
D501
1N4148
MHV
R413
MGR1/2W 6MF
R408
47K
U1-D
KA324
D404
1N4148
R426
MGR1/2W 100KF
5
2
D401
4KV
C404
3KV 471
R520
MGR1/2W 9MF
R513
1W 3
DEV
R519
MGR1/2W 50K
R517
MGR1/2W 6MF
R518
MGR1/2W 9MF
CN1
GIL-S-9P-S2T2-EF
1
2
3
4
5
6
7
8
9
24VS
24V
5V
A-GND
THV-PWM
THV-EA
THV-READ
MHV-PWM
BIAS-PWM
D-GND
R3
100
Q1
B1151-Y
24VS
U3
KA7818
R4
R1
5.6K
R2
1K
Q2
C1008-Y
OUT
IN
1W 1K
18V
+
GND
C1
104
C2
104
C3
35V 47uF
DONGYANG INSTRUMENTS
DESIGNED
CHECKED
APPROVED
TITLE
DRW. NO
REF. NO
APOLLO2 (HVPS)
REV.
2.0
J.S.YOUN
SIZE A4
4-12
1 OF 2
Repair Manual
Samsung Electronics
http://getMANUAL.com
SCHEMATIC DIAGRAMS
4-13 HVPS Circuit Diagram (2/2)
T201
HVT-2A
24VS
5V
18V
1
C208
6KV 471
C206
6KV 471
7
D204
6KV
R201
10K
THV-PWM
R206
100
12
13
CN1-#3
11
U2-F
7407
10
R205
1K
U2-E
7407
Q203
A708-Y
U1-B
KA324
5
C201
103
R209
110KF
R207
2K
24VS
D201
1N4148
R208
30KF
C101
35V 47uF
VR201
50K
C202
500V
331
R210
1/2W
510KF
5
2
Q204
D526-Y
R213
2.2K
C205
6KV 101
C207
6KV 471
D207
6KV
C209
6KV 471
THV
R214
1.2K
D202
1N4148
D206
6KV
D205
6KV
R212
470K
C203
D203
472
1N4148
ZD201
5.6V
R215
430
R216
BR1/2W 30MJ
R218
MGR1/2W 100KF
C204
473
ZD202
7.5V
R217
BR1/2W 200MG
5V
R211
1MF
CN1-#8
18V
14
R309
2.2K
THV-EA
T301
KAB-006
Q301
A708-Y
C307
3KV 471
5
2
D304
4KV
CN1-#4
U2-C
7407
R315
BR1/2W 30MJ
R307
33K
C306
2KV 680
Q303
D526-Y
18V
D-GND
24VS
D303
4KV
C308
3KV 471
4
D301
1N4148
C4
104
R308
33K
R310
2.2K
THV-READ
1
U1-A
KA324
R302
33K
R303
100KF
R311
100KF
R306
26.1KF
R304
200KF
11
R316
1KF
CN1-#5
Q302
A708-Y
R314
3KF
VR302
5K
C305
333
C303
333
R317
2KF
R305
6.2KF
R301
470K
C302
102
D302
1N4148
VR301
10K
C304
500V 103
C301
222
DONGYANG INSTRUMENTS
TITLE
DESIGNED CHECKED APPROVED DRW. NO
APOLLO2 (HVPS)
REV.
REF. NO
3.0
SIZE A4
2 OF 2
J.S.YOUN
Repair Manual
Samsung Electronics
4-13

SF-530 531P 550 Apollo2 SF-530

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SF-530 531P 550 Apollo2 SF-530

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SAMSUNG FACSIMILE

Disassembly and Reassembly

This service manual is also provided on the web,

Samsung Electronics Co.,Ltd. May 2003

1-1 Safety Precautions

LASER STATEMENT (LASERTURVALLISUUS)

Class 1 laser product

INVISIBLE LASER RADIATION WHEN

Especially mind the safety on the part with this

REYONNEMENT LASER INVISIBLE EN CAS

ATTENZIONE RADIAZIONE LASER INVISIBLE IN CASO DI

PRECAUCION REDIACION LASER INVISIBLE CUANDO SE

Avoid exposure to invisible laser radiation when the

1-2 Precautions on Disassembly and Reassembly

7. When disassembling, assembling, also observe small

Please do the following before disassembling

Releasing Plastic Latches

1-3 ESD Precautions

3. Use only a grounded tip soldering iron to solder or desolder ESDs.

1-4 Tools for Troubleshooting

1 DVM(Digital Volt Meter)

Standard: Indicates more than 3 digits.

Standard: For general home use, small type.

Standard: For general home use, for medical service.

Standard: "-" type, "+" type (M3 long, M3 short,

7 Software(Driver) installation CD ROM

Mind your hands not to be touched when

370 X 356 X 195 mm

6.9 Kg (With accessories)

Power Save Mode

OFF, 15, 30, 60 Min

8ppm (PC Print & Fax Print)

600 x 600 DPI

Quick Scan Speed

200 x 200 DPI

300 x 300 DPI

(Std Mode : 365 mm)

600 x 600 DPI

Tone : US, UK, Korea

External Phone Transfer

33.6Kbps Fax Modem

Using CCitt #1 Chart

TEL, FAX, AUTO, ANS/FAX

USA, New Zealand,

Yes (Max 20 Min)

A4, Letter, Legal

Special Direct E-mail Send

Yes (Only Last PC Print)

3. Disassembly and Reassembly

Releasing Plastic Latches

Whenever servicing the machine, you must perform as follows:

1. Check to verify that documents are not stored in

Disassembly and Reassembly

1. Open the OPE cover.

3-3 White Roller

2. Push the bushing on the end of the Roller slightly

Disassembly and Reassembly

3-4 OPE Cover

4. Remove two screws securing bracket scan board,

5. Unplug two connectors and one wire from the scan

2. Remove two stoppers holding the front cover unit and

6. Lift the OPE cover.

3. Pull the bottom left end of the cover downward to