EE/MSE6322 Semiconductor Processing Technology FALL 2008, Walter Hu, UTD

THE UNIVERSITY OF TEXAS AT DALLAS

ERIK JONSSON SCHOOL OF ENGINEERING & COMPUTER SCIENCE

EE/MSE 6322: Semiconductor Processing Technology (3 semester hours)

Class Info: Friday 12:30 p.m. - 3:15 p.m., ECSN 2.110
Instructor: Professor Wenchuang (Walter) Hu
Telephone: (972) 883-6329
Email: walter.hu@utdallas.edu
Website: WebCT
Office Hours: By appointment at NSERL 2.710
Textbook: “Silicon VLSI Technology” Plummer, J., M. Deal, P. Griffin. Prentice Hall, 2000.
ISBN: 0-13-085037-3, available in on-campus bookstore
Reference book: “Introduction to Microelectronic Fabrication”, Richard C. Jaeger, Prentice Hall, 2002.
ISBN: 0-201-44494-1

Course Outline:
Modern techniques for the manufacture of semiconductor devices and circuits. Techniques for both silicon
and compound semiconductor processing are studied as well as an introduction to the design of
experiments. Topics include: wafer growth, oxidation, diffusion, ion implantation, lithography, etch and
deposition.

Course grading:
30% Regularly Assigned Homework
30% Midterm Exam
40% Comprehensive Final Exam

Course rules and regulation:

1. NO eating, drinking, or smoking in classroom. NO laptop computer use in classroom.
2. Students who miss the Midterm Exam or Final Exam without a valid excuse will receive a score of zero.
Students with a valid excuse for missing the Test or Final Exam MUST make arrangements beforehand or
receive a score of zero.

Homework:
Homework will be assigned on Fridays after the class and is due in the week. Each student must turn in
individual work. All assigned work will be collected at the beginning of the class. Late homework
assignments will not be accepted, unless arrangements were made beforehand.
EE/MSE6322 Semiconductor Processing Technology FALL 2008, Walter Hu, UTD

Tentative Schedule

Lecture Topic Reading Homework**

8/22 Overview of the state-of-the-art CH 1-2 Hw1
Movie: Silicon Run
8/29 Modern semiconductor processing CH 3 Hw2
Process Scaling and integration issues
9/05 Crystal growth CH 4-5 Hw3
Material and cleanroom
9/12 Lithography I CH 6 Hw4
Lithography II
9/19 Oxidation I CH 7 Hw5
Oxidation II
9/26 Diffusion I CH 8 Hw6
Diffusion II
10/03 Ion Implantation I Hw7
Ion Implantation II
10/10 Midterm Exam in Class CH 9
Film Deposition I
10/17 Exam Solution CH 10 Hw8
Film Deposition II
10/24 Etching CH 11 Hw9
Etching
10/31 Back-End Hw10
Back-End
11/7 Visit Texas Instrument IC Facility – DMOS6

11/14 Process Integration I - CMOS Hand-outs Paper Report

11/21 Process Integration II - BJT Hand-outs
12/05 *Future Trends and Nanoelectronics Hand-outs
Class overview, exams review, and Q&As
TBD Final Exam

* Optional based on the progress of the previous lectures

** Homework is due one week later in class