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D
D
D
D
LMV324 . . . D OR PW PACKAGE
(TOP VIEW)
1OUT
1IN
1IN+
VCC+
2IN+
2IN
2OUT
14
13
12
11
10
4OUT
4IN
4IN+
GND
3IN+
3IN
3OUT
description/ordering information
LMV358 . . . D OR PW PACKAGE
(TOP VIEW)
1OUT
1IN
1IN+
GND
VCC+
2OUT
2IN
2IN+
1IN+
GND
IN
VCC+
OUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ORDERING INFORMATION{
PACKAGE
TA
40C to 85C
Single
40C
40 C to 85C
85 C
Dual
SOT23-5 (DBV)
Quad
Q
40C to 125C
Single
40C
40 C to 125
125C
C
Dual
LMV321IDBVRQ1
Tube of 75
LMV358IDQ1
Reel of 2500
LMV358IDRQ1
Reel of 2000
LMV358IPWRQ1
Tube of 50
LMV324IDQ1
Reel of 2500
LMV324IDRQ1
TSSOP (PW)
Reel of 2000
LMV324IPWRQ1
V324IQ1
SOT23-5 (DBV)
Reel of 3000
LMV321QDBVRQ1
RCCB
Tube of 75
LMV358QDQ1
Reel of 2500
LMV358QDRQ1
Reel of 2000
LMV358QPWRQ1
Tube of 50
LMV324QDQ1
Reel of 2500
LMV324QDRQ1
Reel of 2000
LMV324QPWRQ1
SOIC (D)
SOIC (D)
SOIC (D)
TSSOP (PW)
40C to 125C
Quad
Q
TOP-SIDE
MARKING
Reel of 3000
TSSOP (PW)
40C to 85C
ORDERABLE
PART NUMBER
SOIC (D)
TSSOP (PW)
RC1B
358IQ1
358IQ1
LMV324IQ1
V358Q1
V358Q1
LMV324Q1
MV324Q1
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at http://www.ti.com.
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
IN
OUT
IN+
VBIAS1
VCC
VBIAS2
+
Output
VCC VCC
VBIAS3
+
IN
IN+
VBIAS4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Input voltage, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 5.5 V
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25C,
VCC 5.5 V (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, JA (see Notes 4 and 5): D (8-pin) package . . . . . . . . . . . . . . . . . . . . . . 97C/W
D (14-pin) package . . . . . . . . . . . . . . . . . . . . 86C/W
DBV (5-pin) package . . . . . . . . . . . . . . . . . . 206C/W
PW (8-pin) package . . . . . . . . . . . . . . . . . . . 149C/W
PW (14-pin) package . . . . . . . . . . . . . . . . . . 113C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) TA)/qJA. Selecting the maximum of 150C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
VIH
t rn on voltage
oltage level
le el
Amplifier turn-on
VIL
Amplifier turn
turn-off
off voltage level
TA
MIN
MAX
2.7
5.5
VCC = 2.7 V
1.7
VCC = 5 V
3.5
UNIT
V
V
VCC = 2.7 V
0.7
VCC = 5 V
1.5
I suffix
40
85
Q suffix
40
125
V
C
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
TEST CONDITIONS
MIN
TYP
MAX
1.7
UNIT
mV
mV/C
IIB
11
250
nA
IIO
50
nA
CMRR
VCM = 0 to 1.7 V
kSVR
VCC = 2.7 V to 5 V,
VICR
CMRR w 50 dB
Output swing
RL = 10 k to 1.35
1 35 V
VO = 1 V
High level
Low level
Supply
pp y current
B1
Unity-gain bandwidth
fm
Gm
Vn
In
63
dB
50
60
dB
0 to 1.7
0.2 to 1.9
VCC 100
VCC 10
60
180
80
170
140
340
260
680
LMV321
ICC
50
CL = 200 pF
mV
mA
m
MHz
Phase margin
60
deg
Gain margin
10
dB
f = 1 kHz
46
nV/Hz
f = 1 kHz
0.17
pA/Hz
TA
TEST CONDITIONS
MIN
25C
VIO
aV
IO
MAX
1.7
Full range
25C
25C
15
UNIT
mV
mV/C
250
IIB
IIO
CMRR
VCM = 0 to 4 V
25C
50
65
dB
kSVR
VCC = 2.7 V to 5 V, VO = 1 V,
VCM = 1 V
25C
50
60
dB
VICR
Common mode
Common-mode
input voltage range
CMMR w 50 dB
25C
0 to 4
0.2
0 2 to 4.2
42
VCC 40
Full range
500
25C
25C
VCC 300
Full range
VCC 400
Low
level
Full range
High
level
RL = 10 k to 2.5
25V
AVD
IOS
Output short-circuit
short circuit current
Low
level
RL = 2 k
Sourcing, VO = 0 V
25C
VCC 100
Full range
VCC 200
25C
ICC
Supply current
65
15
Full range
10
V/mV
60
10
160
130
25C
CL = 200 pF
mA
250
350
210
Full range
180
100
Full range
mV
280
25C
25C
300
VCC 10
Full range
25C
LMV321
nA
400
25C
25C
Sinking, VO = 5 V
120
nA
50
150
High
level
Output swing
Full range
RL = 2 k to 2.5
25V
TYP
440
615
410
Full range
A
mA
830
1160
B1
Unity-gain bandwidth
25C
MHz
fm
Phase margin
25C
60
deg
Gm
Gain margin
25C
10
dB
Vn
f = 1 kHz
25C
39
nV/Hz
In
f = 1 kHz
25C
0.21
pA/Hz
SR
Slew rate
25C
V/ms
Full range is 40C to 85C for I-level part, 40C to 125C for Q-level part.
TYPICAL CHARACTERISTICS
30
30
100
Phase
10
50
0
600
20
1
10
100
10
50
10
10
Frequency kHz
100
Figure 2
70
100
60
80
60
80
60
50
40
40
16 pF
30
20
100 pF
20
10
0
10
20
10
0
Gain
20
500 pF
1000 pF
VCC = 5 V
RL = 600 W
CL = 16 pF, 100 pF,
500 pF, 1000 pF
16 pF
100 pF
500 pF
1000 pF
100
1000
Frequency kHz
Phase
30
40
20
16 pF
500 pF
Gain
20
0
100 pF
20
10
40
60
10
16 pF
100 pF
VCC = 5 V
RL = 100 k
CL = 16 pF, 100 pF,
500 pF, 1000 pF
20
10
80
10000
100
1000 pF
1000
Frequency kHz
Figure 4
Figure 3
60
1000 pF
40
Gain dB
Phase
70
50
Gain dB
1000
Frequency kHz
Figure 1
50
10000
20
50
10000
1000
100
Phase
10
2 k
20
Gain dB
2 k
600
150
Gain
100 k
Gain dB
Gain
200
VCC = 5 V
RL = 100 k, 2 k, 600
150
100 k
20
40
200
VCC = 2.7 V
RL = 100 k, 2 k, 600
500 pF
40
60
80
10000
40
TYPICAL CHARACTERISTICS
STABILITY
vs
CAPACITIVE LOAD
160
85C
25C
40C
40
10000
2.5 V
_
130
100
Phase
20
70
Gain
40
10
VCC = 5 V
RL = 2 k
TA = 85C, 25C, 40C
20
10000
100
1000
Frequency kHz
VCC = 2.5 V
AV = +1
RL = 2 k
VO = 100 mVPP
10
2
1.5
1
0.5
0
Output Voltage V
2.5 V
_
VO
RL
CL
Capacitive Load nF
Capacitive Load pF
1.5
STABILITY
vs
CAPACITIVE LOAD
10000
2.5 V
100
LMV3xx
(25% Overshoot)
1.5
0.5
Figure 6
10000
10
2.0
CL
100
STABILITY
vs
CAPACITIVE LOAD
1000
RL
LMV3xx
(25% Overshoot)
Figure 5
VI
VO
+
2.5 V
1000
10
10
10
Capacitive Load pF
Gain dB
30
VI
1
0.5
0
Output Voltage V
VCC = 2.5 V
RL = 2 k
AV = 10
VO = 100 mVPP
1000
LMV3xx
(25% Overshoot)
100
134 k
+2.5 V
VCC = 2.5 V
AV = +1
RL = 1 M
VO = 100 mVPP
0.5
1.21 M
_
VI
VO
RL
CL
2.5 V
10
2.0
1.5
1.5
Figure 7
1
0.5
0
Output Voltage V
0.5
1.5
Figure 8
TYPICAL CHARACTERISTICS
STABILITY
vs
CAPACITIVE LOAD
SLEW RATE
vs
SUPPLY VOLTAGE
10000
1.500
RL = 100 k
1.400
LMV3xx
(25% Overshoot)
1.300
Slew Rate V/ s
Capacitive Load nF
VCC = 2.5 V
RL = 1 M
AV = 10
VO = 100 mVPP
1000
100
134 k
1.21 M
1.5
1.100
LMV3xx
1.000
PSLEW
0.900
0.700
VO
RL
CL
0.5
0.600
2.5 V
10
2.0
NSLEW
0.800
+2.5 V
VI
Gain
1.200
0.5
0.500
2.5
1.5
3.0
4.0
4.5
5.0
V CC Supply Voltage V
Output Voltage V
Figure 9
Figure 10
SUPPLY CURRENT
vs
SUPPLY VOLTAGE QUAD AMPLIFIER
INPUT CURRENT
vs
TEMPERATURE
700
10
VCC = 5 V
VI = VCC/2
600
20
TA = 85C
500
Input Current nA
Supply Current A
3.5
TA = 25C
400
300
TA = 40C
200
30
LMV3xx
40
50
100
0
0
60
40 30 20 10 0 10 20 30 40 50 60 70 80
TA C
Figure 12
Figure 11
TYPICAL CHARACTERISTICS
SOURCE CURRENT
vs
OUTPUT VOLTAGE
SOURCE CURRENT
vs
OUTPUT VOLTAGE
100
100
VCC = 2.7 V
VCC = 5 V
10
Sourcing Current mA
Sourcing Current mA
10
LMV3xx
1
0.1
0.1
0.01
0.01
0.001
0.001
LMV3xx
0.01
0.1
0.001
0.001
10
0.01
0.1
Figure 13
SINKING CURRENT
vs
OUTPUT VOLTAGE
100
100
VCC = 2.7 V
VCC = 5 V
10
Sinking Current mA
10
Sinking Current mA
10
Figure 14
SINKING CURRENT
vs
OUTPUT VOLTAGE
1
LMV3xx
0.1
LMV324
0.1
0.01
0.01
0.001
0.001
0.01
0.1
0.001
0.001
10
0.01
0.1
10
Figure 15
Figure 16
TYPICAL CHARACTERISTICS
SHORT-CIRCUIT CURRENT
vs
TEMPERATURE
SHORT-CIRCUIT CURRENT
vs
TEMPERATURE
300
120
100
240
Sourcing Current mA
Sinking Current mA
270
LMV3xx
VCC = 5 V
210
180
150
120
LMV3xx
VCC = 2.7 V
90
60
80
LMV3xx
VCC = 5 V
60
LMV3xx
VCC = 2.7 V
40
20
30
0
40 30 20 10 0
0
10 20 30 40 50 60 70 80 90
TA C
TA C
Figure 18
kSVR
vs
FREQUENCY
+kSVR
vs
FREQUENCY
90
VCC = 5 V
RL = 10 k
70
60
+k SVR dB
k SVR dB
70
LMV3xx
40
30
LMV3xx
50
40
30
20
20
10
10
1K
10K
100K
0
100
1M
1K
10K
Frequency Hz
Frequency Hz
Figure 19
10
VCC = 5 V
RL = 10 k
80
50
0
100
10 20 30 40 50 60 70 80 90
Figure 17
80
60
40 30 2010 0
Figure 20
100K
1M
TYPICAL CHARACTERISTICS
+kSVR
vs
FREQUENCY
kSVR
vs
FREQUENCY
80
80
VCC = 2.7 V
RL = 10 k
70
60
60
LMV3xx
LMV3xx
50
+k SVR dB
k SVR dB
VCC = 2.7 V
RL = 10 k
70
40
30
50
40
30
20
20
10
10
0
100
1K
10K
100K
0
100
1M
1K
Frequency Hz
Figure 21
Figure 22
70
1M
RL = 10 k
THD > 5%
AV = 3
RL = 10 k
60
50
100K
OUTPUT VOLTAGE
vs
FREQUENCY
10K
Frequency Hz
Negative Swing
40
30
20
Positive Swing
4
LMV3xx
VCC = 5 V
3
2
LMV3xx
VCC = 2.7 V
1
10
0
2.5
3.0
3.5
4.0
4.5
VCC Supply Voltage V
5.0
10
100
Frequency kHz
1000
10000
Figure 24
Figure 23
11
TYPICAL CHARACTERISTICS
CROSSTALK REJECTION
vs
FREQUENCY
110
100
LMV3xx
VCC = 5 V
140
Crosstalk Rejection dB
Impedance
90
VCC = 5 V
RL = 5 k
AV = 1
VO = 3 VPP
LMV3xx
VCC = 2.7 V
80
70
60
50
130
120
110
40
100
30
20
1
1000
2000
3000
90
100
4000
Frequency kHz
Figure 25
12
1K
10K
Frequency Hz
Figure 26
100K
TYPICAL CHARACTERISTICS
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
LMV3xx
LMV3xx
1 V/Div
1 V/Div
Input
VCC = 2.5 V
RL = 2 k
T = 25C
VCC = 2.5 V
RL = 2 k
TA = 85C
1 s/Div
1 s/Div
Figure 27
Figure 28
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
1 V/Div
LMV3xx
VCC = 2.5 V
RL = 2 k
TA = 40C
1 s/Div
Figure 29
13
TYPICAL CHARACTERISTICS
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
50 mV/Div
50 mV/Div
LMV3xx
VCC = 2.5 V
RL = 2 k
TA = 85C
VCC = 2.5 V
RL = 2 k
TA = 25C
1 s/Div
1 s/Div
Figure 30
Figure 31
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
50 mV/Div
Input
LMV3xx
VCC = 2.5 V
RL = 2 k
TA = 40C
1 s/Div
Figure 32
14
TYPICAL CHARACTERISTICS
INVERTING LARGE-SIGNAL
PULSE RESPONSE
INVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
1 V/Div
1 V/Div
LMV3xx
VCC = 2.5 V
RL = 2 k
TA = 25C
VCC = 2.5 V
RL = 2 k
TA = 85C
1 s/Div
1 s/Div
Figure 33
Figure 34
INVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
1 V/Div
LMV3xx
VCC = 2.5 V
RL = 2 k
TA = 40C
1 s/Div
Figure 35
15
TYPICAL CHARACTERISTICS
INVERTING SMALL-SIGNAL
PULSE RESPONSE
INVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
50 mV/Div
50 mV/Div
LMV3xx
VCC = 2.5 V
RL = 2 k
TA = 25C
VCC = 2.5 V
RL = 2 k
TA = 85C
1 s/Div
1 s/Div
Figure 36
Figure 37
INVERTING SMALL-SIGNAL
PULSE RESPONSE
50 mV/Div
Input
LMV3xx
VCC = 2.5 V
RL = 2 k
TA = 40C
1 s/Div
Figure 38
16
TYPICAL CHARACTERISTICS
INPUT CURRENT NOISE
vs
FREQUENCY
0.80
VCC = 5 V
0.45
Input Current Noise pA/ Hz
VCC = 2.7 V
0.60
0.40
0.20
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
10 Hz
100 Hz
1 kHz
0.00
10 kHz
10 Hz
Frequency
100 Hz
1 kHz
10 kHz
Frequency
Figure 39
Figure 40
180
160
140
120
100
80
VCC = 2.7 V
60
40
VCC = 5 V
20
10 Hz
100 Hz
1 kHz
10 kHz
Frequency
Figure 41
17
TYPICAL CHARACTERISTICS
THD + N
vs
FREQUENCY
THD + N
vs
FREQUENCY
THD %
1.000
10.000
VCC = 2.7 V
RL = 10 k
AV = 1
VO = 1 VPP
VCC = 2.7 V
RL = 10 k
AV = 10
VO = 1 VPP
1.000
THD %
10.000
LMV3xx
0.100
0.100
LMV3xx
0.010
0.010
0.001
0.001
10
100
1K
10K
10
100K
Frequency Hz
Figure 42
Figure 43
THD + N
vs
FREQUENCY
10.000
10K
100K
THD + N
vs
FREQUENCY
10.000
VCC = 5 V
RL = 10 k
AV = 1
VO = 1 VPP
VCC = 5 V
RL = 10 k
AV = 10
VO = 2.5 VPP
1.000
THD %
THD %
1.000
1K
100
Frequency Hz
0.100
0.100
0.010
0.010
LMV3xx
LMV3xx
0.001
0.001
10
18
100
1K
10K
10
100K
100
1K
Frequency Hz
Frequency Hz
Figure 44
Figure 45
10K
100K
www.ti.com
20-Oct-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV321QDBVRQ1
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324IDRG4Q1
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324IDRQ1
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324IPWRG4Q1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324IPWRQ1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324QDQ1
OBSOLETE
SOIC
14
LMV324QDRG4Q1
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324QDRQ1
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324QPWRG4Q1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV324QPWRQ1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV358IDRG4Q1
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV358IDRQ1
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV358IPWRG4Q1
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV358IPWRQ1
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TBD
Call TI
Call TI
LMV358QDQ1
OBSOLETE
SOIC
LMV358QDRG4Q1
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV358QDRQ1
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
Call TI
Samples
(Requires Login)
LMV321IDBVRQ1
TBD
(3)
Call TI
www.ti.com
Orderable Device
20-Oct-2011
Status
(1)
Pins
Package Qty
Eco Plan
(2)
TBD
Lead/
Ball Finish
Call TI
(3)
Samples
(Requires Login)
LMV358QPWQ1
OBSOLETE
TSSOP
PW
Call TI
LMV358QPWRG4Q1
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LMV358QPWRQ1
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV321-Q1, LMV324-Q1, LMV358-Q1 :
Addendum-Page 2
www.ti.com
20-Oct-2011
Addendum-Page 3
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