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Test Method
a,*
Department of Macromolecular Science, Fudan University, Handan Road, Shanghai 200433, Peoples Republic of China
Received 12 April 2001; accepted 20 June 2001
Abstract
In this study, a new test method for evaluating the crack resistance of epoxy resins under thermal shock is proposed.
A series of epoxy resins of varying toughness are tested by this method. We also study influence of geometry and
dimensions of molds on the experimental results. It is shown that crack resistance of epoxy resins under thermal shock
can be evaluated by this method. Our study also suggests that this method can be performed conveniently in laboratories
and factories so that it can be widely applied in many fields to evaluate the crack resistance of epoxy resins. 2001
Elsevier Science Ltd. All rights reserved.
Keywords: Crack resistance; Epoxy resins; Thermal shock
1. Introduction
Epoxy resins are widely used in coating, adhesive,
insulating, flooring, laminating and casting applications
because of their excellent mechanical and thermal
properties such as high strength, elastic modulus and
glass transition temperature [1]. However, they show low
resistance to crack initiation and propagation under thermal shock. Therefore, it is necessary to perform crack
resistance test under thermal shock of epoxy resins
before they are used.
Although many thermal shock tests have been
employed to evaluate the crack resistance of metallic and
ceramic materials [24], few investigations have been
focused on thermosetting resins. In some methods [5,6],
an embedded steel ring bonded by a strain gauge was
used to evaluate the internal stress of epoxy resins, but
it is not a direct way to evaluate the crack resistance of
materials under thermal shock by measuring their
internal stresses. Crack resistance testing of epoxy resins
0142-9418/02/$ - see front matter 2001 Elsevier Science Ltd. All rights reserved.
PII: S 0 1 4 2 - 9 4 1 8 ( 0 1 ) 0 0 0 6 9 - 1
196
Fig. 1. Molds for crack resistance test under thermal shock. (a) Hexagon inner core. (b) Hexagram inner core. (c) Outer frame. (d)
Photo of assembly of hexagram inner core and outer frame.
(1)
Where
a
E
T
197
Fig. 3.
198
As demonstrated by the experimental results, the thermal shock test method proposed by us is suitable for
evaluating crack resistance of epoxy resins and other
thermosetting resins. This kind of method can be
manipulated conveniently and needs no special equipment. Although there are some problems in this method,
for example, the number of thermal shock cycles of
CTBN toughened epoxy resins is 24 (equal to 5 days)
so that the testing process is too long, this method are
still practicable in many fields and these problems could
be overcome by selecting suitable size and geometry of
molds. In the next study, we will continue improving this
test method for further and wider applications.
Cycle
Hexagon
0
1
2
3
4
20%
60%
60%
80%
100%
Failure Percent
Hexagram
0%
0%
0%
0%
0%
5. Conclusions
References
[1] J.C. Salamone, et al., Concise Polymeric Materials Encyclopedia, CRC Press, Boca Raton, FL, 1999.
[2] A. Weronski, T. Hejwowski, Thermal Fatigue of Metals,
Marcel Dekker, New York, 1991.
[3] L.V. Kravchuk, G.A. Schneider, G.E. Petzow, Thermal
Shock and Thermal Fatigue Behavior of Advanced Ceramics, Kluwer, Dordrecht, 1993.
[4] S. Ishihara, T. Goshima, K. Nomura, T. Yoshimoto, Crack
propagation behavior of cermets and cemented carbides
under repeated thermal shocks by the improved quench
test, J. Mater. Sci. 34 (1999) 629636.
[5] M. Shimbo, M. Ochi, T. Inamura, M. Inoue, Internal stress
of epoxide resin modified with spiro ortho-ester type resin,
J. Mater. Sci. 20 (1985) 29652972.
[6] M. Shimbo, M. Ochi, Y. Shigeta, Shrinkage and internal
stress during curing of epoxide resins, J. Appl. Polym. Sci.
26 (1981) 22652277.
199