MEMS (Micro Electromechanical Systems) Introduction - Sabanci University MEMS Course

09.02.
2016
SABANCI UNIVERSITY
Faculty of Engineering and Natural Sciences
Electronics Engineering
EL 404 Intro to MEMS / EE 626 MEMS
Spring-2016
Course Schedule
Introduction to Microelectromechanical Systems - 20521 - EE 404
-0
Associated Term: Spring 2015-2016
Instructors: Murat K. Yapc (P)
Office: G045 FENS,

Email: mkyapici@sabanciuniv.edu
Scheduled Meeting Times

Type Time
Days Where
Class
3:40 pm T
5:30 pm
Fac. of Engin.
and Nat. Sci.
L055
Class
12:40 pm
F
- 1:30 pm
Fac. of Engin.
and Nat. Sci.
L027
Date Range
Schedule
Type
Instructors
Feb 01, 2016 1st del

May 13, 2016
Murat K.
Yapc (P)
Feb 01, 2016 2nd del

May 13, 2016
Murat K.
Yapc (P)
Introduction to Microelectromechanical Systems - Recitation 20522 - EE 404R - 0
Scheduled Meeting Times

Type Time
Class
Murat Kaya Yapc, Ph.D.
Days Where
5:40 pm F
7:30 pm
Fac. of Engin.
and Nat. Sci.
G029
Date Range
Schedule
Type
Feb 01, 2016 1st del

May 13, 2016
Instructors
Murat K.
Yapc (P)
EE 404/626 Introduction to MEMS
Course Description
Overview of design, manufacture and packaging of microdevices, and nanotechnology.
Major subjects covered in the course include engineering physics and mechanics, scaling
laws for miniaturization, microfabrication techniques, material selection, microsystems
design methodologies, microsystems packaging design, and introduction of
nanotechnology and engineering.
Course Goals
1. To learn about electromechanical design and packaging of microdevices and systems.
2. To learn the basic design principles for MEMS and Microsystems.
3. To learn the basic principles of microfabrication techniques for microdevices and
microsystems, as well as integrated circuits.
4. To learn the basic principles involved in microsystems packaging.
5. To learn the basic principle of nanotechnology, and nanoscale engineering analysis.
09.02.2016
Student Learning Objectives

1. To be able to explain what MEMS and microsystems are.
2. To explain the working principles of many MEMS and microsystems in the marketplace.
3. To understand the relevant engineering science topics relating to MEMS and microsystems.
4. To be able to distinguish the design, manufacture and packaging techniques applicable
to microsystems from those for integrated circuits.
5. To become familiar with the materials, in particular, silicon and its compounds for MEMS.
6. To be able to explain the basic and relevant design principles of MEMS and microsystems.
7. To learn the scaling laws for miniaturization.
8. To be able to identify the optimal microfabrication and packaging techniques for micro
devices and systems.
9. To be able to handle mechanical systems engineering design of micro scale devices.
10. To learn the fundamentals of nanotechnology.
Grading Scheme:
Mid-Term:
30%
HW + Project:
40%
Final:
30%
Textbook:
Foundation of MEMS, 2nd edition, by Chang Liu, Pearson, Essex,
England, 2012. (ISBN-10: 0273752243, ISBN-13: 9780273752240)
MEMS & Microsystems Design, Manufacture, and Nanoscale Engineering,
2nd edition, by Tai-Ran Hsu, John Wiley & Sons, Inc., Hoboken, NJ. 2008
(ISBN 978-0-470-08301-7)
References:
Fundamentals of Microfabrications: The Science of Miniaturization, Marc
J.Madou, Taylor & Francis, Inc., 2002 (ISBN 9780849308260
Micromachined Transducers Sourcebook, G. Kovacs, McGraw-Hill, 1998.
Microchip Fabrication, 3rd ed., Peter van Zant, McGraw-Hill, 1997.
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Instruction Schedule
1. Introduction History and Future Trends of MEMS
2. Introduction to Microfabrication
3. Introduction to Micromachining
4. Review of electromechanical concepts
5. Introduction to sensors and actuators
6. Electrostatic sensors and actuators
7. Thermal sensors and actuators
8. Piezoresistive sensors
9. Piezoelectric sensors and actuators
10. Magnetic actuators and sensors
11. Bulk micromachining
12. Surface micromachining
13. Process Design SPM Probe Array, Nanofabrication
14. Polymer MEMS, Microfluidics Applications
15. MEMS layout introduction
MEMS (Micro Electromechanical Systems)

Microfabrication and Nanotechnology
History and Future Trends
09.02.2016
Outline
What is MEMS?
Technical terms
The past and the future a rapidly developing field

Pioneer work
Growth in the 1990s
MEMS in the 21st century
Intrinsic characteristics and issues of MEMS
Get Scales Right

Units often encountered
Microscale: 1 m (micron/micrometer) = 10-6 m = 10-3 mm
Nanoscale: 1 nm (nanometer) = 10-9 m = 10-6 mm = 10-3
m = 10
Human hair:
75~100m
SWCNT: several
nm in diameter
DNA strand:
~10nm
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Technical Terms
Nanotechnology
Control of matter on the atomic and molecular scale, generally 100 nanometers or
smaller, and the fabrication of devices or materials that lie within that size range.
What is MEMS ?
Feature size: 1~100s microns
The dimension of a structure/device which is most critical to its property

or performance (e.g. diameter of your hair)
Feature size is not the size of the entire device.
Fabrication involving
Micromachining processes
Microfabrication processes
A combination of
Will be explained in detail,

soon
Micro sensors, actuators and other functional micro structures

What is a sensor, actuator ?
Micro sensors (mechanical, thermal, chemical electrical)
Detect a change in its environment in one form of energy and provide a corresponding
output, usually an electrical signal.
Micro actuators (other domain mechanical)
Converts energy (electrical, hydraulic fluid pressure, pneumatic pressure) into motion
Work in multi-energy domains, not just electrical

Fuzzy boundary
10
09.02.2016
History evolution of MEMS

Circuit Boards
The Integrated Circuit

11
The development history of MEMS

Initially evolving from IC field
Both the materials and fabrication processes are readily available.
Silicon, silicon oxide, silicon nitride, polysilicon, metal
Microfabrication technology
Mass production capability and integration with IC
Resonant gate transistor (1967, Harvey Nathanson, Westinghouse)

Gate
Drain
Gate
Source
Drain
Source
d
Conventional MOS transistor

IDS=f(VGS, VDS)
Resonant gate MOS transistor

IDS=f(d,VGS, VDS)
Harvey C. Nathanson (born October 22, 1936) is an American

electrical engineer who invented the first MEMS (micro-electromechanical systems) device of the type now found in consumer
products ranging from cellular phones to digital projectors.
Then scientists all around started

investigating new small, tiny
devices which they called MEMS
12
09.02.2016

Small, Tiny Devices
Famous Example: Tiny Gears made at Sandia National Labs.
Multiple Gear Speed Reduction Unit
Six-gear Train
Spring Device
Rotary Motor
Linear rack
13

How Small ?
Spider Mite on a Mirror Assembly
Mite approaching a
Gear mechanism
14
09.02.2016
Different Sub-fields of MEMS

RF (radio frequency) MEMS
Passive components in integrated wireless systems

Integrated capacitors, inductors, switches, resonators
Miniaturized antenna and antenna arrays
BioMEMS
Interacting with micro-scale biological entities
Micro needles, probes, surgical tools, implantable micro electrodes and sensors
Micro total analysis systems (TAS)
Microfluidics
Micro pumps, valves, channels, reservoirs
MOEMS (micro-opto-electro-mechanical systems)
Optical fiber network, digital light processing, optical sensor

Micro mirrors/mirror arrays
Other micro optical components (e.g. binary lens)
Much more: power-MEMS
15
MEMS and NEMS

MEMS
Feature size (not device size) ranging from a few to several hundred microns
Macroscopic theory is still valid.
NEMS (Nano Electromechanical Systems)

Feature size (not device size) usually 10s of nanometers
Macroscopic theory may not be valid all the time (e.g. nanoscale flows).
Use similar fabrication methods (top-down) at smaller scale
Metal nanowire
Nanoscale beam structures
Nanopore detection for single

amino acid chains
16
09.02.2016
What is Nanotechnology ?
Nanotechnology
Science and engineering to build nanoscale structures and
devices using bottom-up fabrication method.
Control the assembly atoms and molecules based on physical,
chemical and biological phenomena and processes.
MEMS can help nanotechnology research

Serving as an interface between nano and macro worlds.
Atomic force microscope probes for nano imaging and manipulation
Tweezers to handle nano objects
17
Outline
What is MEMS?
Technical terms
The past and the future a rapidly developing field

Pioneer work
Growth in the 1990s
MEMS for the 21st century
Intrinsic characteristics and issues of MEMS
18
09.02.2016
Evolution trend in MEMS

Initially evolved from IC field and grew rapidly
Fully-functional integrated
smart microsystems
MEMS in real sense
A long way to go
New applications
Grand challenge
New design,
fabrication
and material
Mid-level
Micro sensors and actuators
as individual components in
larger systems
Needs intensive development
and examples of commercial
success
Low hanging fruits
Functional 3D
micromechanical
structures
Minimum requirement on
materials, processes and
equipment
Everyone can do MEMS
19
Typical MEMS Application and Commercialization Overview

Micro sensors
Acceleration sensors for automobile air bag control

Gyroscopes for automobile driving control
Pressure sensors for blood, tire, etc.
Many others underdevelopment
Micro actuators
Micromachined ink jet head (HP and others, 1978-)

Digital light processing (TI)
Micropumps and valves
Many others underdevelopment
3D micro structures
Micro inductors and capacitors
Scanning probes
Microfluidic channel networks
Combination of the above three

20
10
09.02.2016
Ink Jet Printing Head

Ink jet printing head (Hewlett Packard, 1978)
Arrays of micromachined nozzles

Eject tiny ink droplets by heating and expanding liquid
The ink-ejection nozzles can be made extremely small and
densely populated which allows high resolution printing
To eject a droplet from each chamber, a pulse of current is passed through the
heating element causing a rapid vaporization of the ink in the chamber and
forming a bubble, which causes a large pressure increase, propelling a droplet of
ink onto the paper (hence Canon's trade name of Bubble Jet).
21
Micro Accelerometer and Gyroscope
ADI IMEMS accelerometer
ADI IMEMS gyroscope
Small volume and weight

Monolithically integrated with signal processing integrated circuits
22
11
09.02.2016
Computer games Wii, Playstation
Joysticks- Contain Integrated Accelerometers

Sensing your motion
23
24
Display
Digital Mirror Device
Texas Instruments
www.dlp.com
12
09.02.2016
Wireless Communication
Wireless infrastructure: bluetooth, wireless voice/data network

Applications: wireless internet, smart building, smart highway, wireless sensor network,
smart toys,
A low cost, high performance, small volume, power efficient front end is key to hardware
success.
MEMS sensors will make cell phones and computers smarter and much more fun to use.
25
Wireless Communication
MEMS tunable capacitors, inductors, switches, resonators and antennas enable

integrated wireless communication systems with lower power/cost and higher
performance.
26
13
09.02.2016
Data Storage
MEMS technology has made the hard drive

recording/reading heads move faster and more precisely.
Coarse movement: servo motor
Fine movement: MEMS actuator
27
Data Storage With Ultra-high Density
Record
Read
IBM millipede data storage device

28
14
09.02.2016
Micro Air Vehicle and Dynamic Fly Control
Smart skins for dynamic fly control

Micro sensors, actuators, power sources for MAVs
29
Micro Optical Systems
Electro-optics
Optical and electrical conversion
30
15
09.02.2016
Micro Optical Systems
Lucent LambdaRouter
High-speed, low-loss,
electrostatically
controlled optical
switch arrays
Positioning of each
mirror is continuous
http://www.lucent.com/pressroom/lambd
a.html
31
Microfluidics
Cell manipulation and sorting

for medical diagnosis (Caltech)
Portable blood analysis

(www.I-stat.com)
DNA testing
(Affymetrix)
32
16
09.02.2016
Major Benefits of Microfluidic Systems in Biomedical Applications
Small dimension enable new experiments very difficult

or impossible before.
Small dead volumes reduce the cost.
Enable portable instruments
Low cost fabrication leading to disposable devices and
home use.
Integration makes the experiment much easier
33
Biomedical Applications
Retina prosthesis
Roboroach (Tokyo U.)
Neuron probe (U. Michigan)
Needles without pain
34
17
09.02.2016
Some Nanotechnology Applications

Atomic Force Microscope
Allows you to image surfaces
Can be used as a printer
35
MEMS/Nanotechnology for the 21th Century

Research becomes interdisciplinary; field rapidly expanding to many different expertise.
Reaching the ultimate goal: Small, low cost, smart devices finding unprecedented
applications
Military: smart ammunition and high-tech soldier uniform
Biology: cell sorting and manipulation, DNA/protein analysis
Chemistry: micro chemical systems
Medicine: micro surgical tools, smart drug delivery (e.g. for the cure of diabetes)
Homeland defense: distributed environmental sensors with wireless communication
Gaming and toys: smart gadgets
Digital or intelligent housing
36
18
09.02.2016
Summary
Early MEMS: IC-derived devices
MEMS in 1990
Interdisciplinary applications covering many and growing

number of areas rapidly
Successful formula
High performance/cost ratio compared with conventional devices

New market/starving market (ink jet printer, communications,
bio-analysis)
MEMS in next ten years
New materials, designs and fabrication processes (deeper)

Fully functional smart microsystems
Continue branching into new areas (wider)
Biology, chemical engineering, nano-engineering
Accelerated speed to commercialization
37
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09.02.

Office: G045 FENS,

Scheduled Meeting Times

Feb 01, 2016 1st del

Feb 01, 2016 2nd del

Introduction to Microelectromechanical Systems - Recitation 20522 - EE 404R - 0

Scheduled Meeting Times

Murat Kaya Yapc, Ph.D.

Feb 01, 2016 1st del

EE 404/626 Introduction to MEMS

Murat Kaya Yapc, Ph.D.

EE 404/626 Introduction to MEMS

Student Learning Objectives

EE 404/626 Introduction to MEMS

Murat Kaya Yapc, Ph.D.

EE 404/626 Introduction to MEMS

Murat Kaya Yapc, Ph.D.

EE 404/626 Introduction to MEMS