Weekly Monitoring Sheet. Plant Practice 2016.

University of the Philippines Diliman

Name: Romar Angelo Avila
Company: NXP Semiconductors
Inclusive Dates: July 18-23, 2016
Cabuyao Inc
Inclusive
Dates
July 18

July 19

Activity

Details, Progress and Comments

Glue Crack
Assessment

We went to the line in order to observe glue cracks in the capacitor

attach step of the manufacturing process. This problem started in the
previous week and was still unresolved. We viewed samples under the
microscope to see what they look like. In my research, I found that the
two main factors which cause this problem are heating and force applied
on the lead frame.
We attended a training session on sort, which was the first step of the 5s
framework (sort, set in order, sweep, standardize, sustain) used in NXP.
We were taught how to classify and store work tools depending on their
usage. Our team went to the plating area where we marked objects
which were either unnecessary, in need of repair, or could be stored
elsewhere in the company.

S1 Training and
Frontline Assessment
Meeting

After the S1 training, we went to a frontline assessment meeting in order

to discuss the defects found in production during the past few months.
The capacitor glue crack was brought up, as well as the inconsistent
glue, scratching and contamination of silicon dies, and misalignment in
attachment.

July 20-21

Technical Paper Writing

July 22-23

Glue Experiment

I was tasked to write a technical paper on silver epoxy glue and which
parameters affect its properties. This will be my final project for my
internship.
We were finally issued a laptop in order to complete our final project. I
spent my day doing research on my final project.
In order to assess two batches of glue from the supplier, my supervisor
ran an experiment in the line. I was tasked to make observations on the
occurrence of separation in the glue and make recommendations based

on what I saw.