Professional Documents
Culture Documents
MCTR1004
Spring 2016
Formula Sheets
Chapter -1 Mechanisms of Heat Transfer
Under steady conditions, conservation of energy: Q& = m
& C p T where m& = AV
dT
Fouriers law of heat conduction: Q& cond = kA
dx
T
For a plane wall: Q& cond = kA
L
&
Newtons law of cooling: Qconvection = hAs (Ts T )
Radiation: Q& emit. max = As Ts4 where = 5.67 10 8 W / m 2 .K 4
Q& = A (T 4 T 4 ) , Q&
rad s s surr absorbed = Q& , = , = =1 for black body
incident
MCTR1004 Page 1 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
T ( x) T cosh a( L x)
Adiabatic fin tip: = , a = hp / kAc , p is the perimeter, and
Tb T cosh aL
Ac is the cross-sectional area of the fin.
The rates of heat transfer for both cases are given to be
dT
Very long fin: Q& long fin = kAc x =0 = hpkAc (Tb T )
dx
dT
Adiabatic fin tip: Q& insulated tip = kAc x =0 = hpkAc (Tb T ) tanh aL
dx
Corrected length: L c = L + Ac / p
Fin efficiency:
Actual heat transfer rate from the fin
fin =
Ideal heat transfer rate from the fin if the entire fin were at the base temperatur e
1 tanh aL
fin long fin = & fin adiabatic =
aL aL
T T 1
Q& fin = finQ& fin.max = fin hAfin (Tb T ) = b & R fin =
R fin fin hAfin
Fin effectiveness:
Heat transfer rate from the fin of base area Ab Q& fin Q& fin
fin = = =
Heat transfer rate from the surface of area Ab Q& no fin hAb (Tb T )
Overall effectiveness:
Q& total , fin h( Aunfin + fin A fin )(Tb T ) A fin
fin , overall = = & fin = fin
&
Q hAno fin (Tb T ) Ab
total , no fin
MCTR1004 Page 2 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
where Lc is the characteristic length, which is the height L for a vertical plate and the
diameter D for a horizontal cylinder.
The correlations for the Nusselt number Nu = hLc /K in natural convection are
expressed in terms of the Rayleigh number defined as
Nusselt number relations for various surfaces are given in Table. All fluid properties
are evaluated at the film temperature of Tf = (Ts + T).
The outer surface of a vertical cylinder can be treated as a vertical plate when the
curvature effects are negligible.
The characteristic length for a horizontal surface is Lc = As/p, where As is the surface
area and p is the perimeter.
The average Rayleigh number and Nusselt number for vertical isothermal parallel
plates of spacing S and height L is given as
The optimum fin spacing for a vertical heat sink and the Nusselt number for optimally
spaced fins is
All fluid properties are to be evaluated at the average temperature Tave = (Ts + T)/2.
Arrays of printed circuit boards used in electronic systems can often be modeled as
parallel plates subjected to uniform heat flux.
The modified Rayleigh number for uniform heat flux on both plates and the Nusselt
number at the upper edge of the plate where maximum temperature occurs are
determined from:
MCTR1004 Page 3 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
The optimum fin spacing for the case of uniform heat flux on both plates is given as
The critical surface temperature TL occurs at the upper edge of the plates
All fluid properties are to be evaluated at the average temperature Tave = (TL + T)/2.
In a horizontal rectangular enclosure with the hotter
plate at the top, heat transfer is by pure conduction and
Nu = 1. When the hotter plate is at the bottom, the
following simple correlations are used for air:
These relations can also be used for other gases with 0.5 < Pr < 2.
For water, silicone oil, and mercury:
For vertical horizontal enclosures, the Nusselt number can be determined from:
For aspect ratios greater than 10, the following Eqs. should be
used.
Again all fluid properties are to be evaluated at the average temperature = (T1+T2)/2.
The airflow in the analysis of electronic equipment can be assumed to be
laminar. The natural convection heat transfer coefficient for laminar flow of air at
atmospheric pressure is given by a simplified relation of the form:
MCTR1004 Page 4 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 5 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 6 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 7 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
Sphere:
MCTR1004 Page 8 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
Square
MCTR1004 Page 9 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 10 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 11 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 12 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 13 of 14
Cooling of Electronic Systems
MCTR1004
Spring 2016
MCTR1004 Page 14 of 14