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Invited Paper

Fiber Optic Interconnect and Optoelectronic Packaging Challenges


for Future Generation Avionics
Mark W. Beranek
Naval Air Systems Command
Patuxent River, Maryland

ABSTRACT
Forecasting avionics industry fiber optic interconnect and optoelectronic packaging challenges that lie ahead first
requires an assumption that military avionics architectures will evolve from todays centralized/unified concept based on
gigabit laser, optical-to-electrical-to-optical switching and optical backplane technology, to a future federated/distributed
or centralized/unified concept based on gigabit tunable laser, electro-optical switch and add-drop wavelength division
multiplexing (WDM) technology. The requirement to incorporate avionics optical built-in test (BIT) in military avionics
fiber optic systems is also assumed to be correct. Taking these assumptions further indicates that future avionics systems
engineering will use WDM technology combined with photonic circuit integration and advanced packaging to form the
technical basis of the next generation military avionics onboard local area network (LAN). Following this theme, fiber
optic cable plants will evolve from todays multimode interconnect solution to a single mode interconnect solution that is
highly installable, maintainable, reliable and supportable. Ultimately optical BIT for fiber optic fault detection and
isolation will be incorporated as an integral part of a total WDM-based avionics LAN solution. Cost-efficient single
mode active and passive photonic component integration and packaging integration is needed to enable reliable
operation in the harsh military avionics application environment. Rugged multimode fiber-based transmitters and
receivers (transceivers) with in-package optical BIT capability are also needed to enable fully BIT capable single-
wavelength fiber optic links on both legacy and future aerospace platforms.

Keywords: avionics, built-in test (BIT), fiber optics, interconnects, local area network, optoelectronics, packaging,
photonics, wavelength division multiplexing (WDM).

1. INTRODUCTION
Over the past three-plus decades the engineering discipline called avionics (the development, manufacture and
deployment of electronics in conjunction with aeronautics and astronautics) has built up a rich history of fiber optics and
photonics technology development and insertion on fixed and rotary wing aircraft, and space platforms. This history is
based largely on the seminal work of aerospace scientists, engineers and technicians who, in conjunction with the
academic, government, and industrial research, engineering and manufacturing technology community, developed flight-
worthy fiber optics and photonics technology solutions that have made their way onto the various aerospace platforms.
Much of this early science and technology (S&T) work focused on discovering solutions to package, manufacture, and
test fiber optic interconnect and digital transmitter/receiver (or transceiver) devices. This research has its origins in the
early 1970s when the first low-loss optical fiber technology was produced in the laboratory.12 Early NAVAIR fiber
optic platform flight test demonstration programs include the A-7 ALOFT (1976), the AV-8B Harrier (1979), the T2-C
(1983), the A-12 (1985), and the NASA/NAVAIR F/A-18 FOCSI (1985).3 Early NAVAIR fiber optic capable platform
production programs include the AV-8B Harrier and F/A-18 Hornet.4-5 The AV-8B Harrier and F/A-18 Hornet had a
limited number of point-to-point links based on short wavelength LEDs, PIN photodiodes, SMA and MIL-DTL-38999
connectors, and multimode fiber-optic cable.

Our past history not only explains where we have been, it can also be used as a valuable resource of lessons learned. At
NAVAIR past history is being drawn upon to roadmap Naval Aviations future in the context of next generation military
avionics systems engineering, including fiber optic interconnects and photonics packaging. Oversimplifying the past
three decades of avionics fiber optic interconnects and photonics packaging development achievements in this paper
would likely be a risky and unsuccessful venture. And trying to encapsulate the entire history here would certainly not
give adequate credit to all of the people who actually made avionics fiber optics and photonics history happen. That
being said, any reference omissions or oversimplifications that may ensue here are neither deliberate nor intentional.

Photonics Packaging, Integration, and Interconnects VII, edited by Allen M. Earman, Ray T. Chen
Proc. of SPIE Vol. 6478, 647809, (2007) 0277-786X/07/$18 doi: 10.1117/12.709761

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This paper will begin by first fast-forwarding avionics fiber optics and photonics history from the early 1970s to about
1987. Discussing the period from 1987 to 2006 will provide the reader an understanding of developments that led us to
where we are today. After completing the historical discussion, this paper will then focus on its main intent, which is to
provide a perspective on the fiber optic interconnect and packaging challenges that lie ahead for future generation
military / aerospace systems.

2. THE FORMATIVE DECADES: 1987 2006


2.1 Overview

Scientists, engineers and technicians tasked with meeting the avionics fiber optic interconnect and optoelectronic
packaging challenges of the late 1980s and early 1990s primarily focused their efforts on answering the following eight
questions:

1) How does one package a fiber optic coupled LED, laser diode, or photodetector in a way that meets the technical
performance requirements of an optoelectronic circuit mounted inside a weapons replaceable assembly (WRA), line
replaceable unit (LRU), or line replaceable module (LRM)?

2) How does one package an optical fiber in a cable assembly in a way that meets the technical performance
requirements of a cable bundle/harness installed in an aircraft fuselage, avionics bay, and/or wing?

3) How does one connect an optical fiber to a fiber optic transceiver, WRA, LRU, LRM, or another fiber optic
cable bundle/harness in a way that meets the technical performance requirements of WRAs, LRUs, LRMs,
and installed aircraft cable bundles/harnesses?

4) How does one package an optical backplane in a way that meets the technical requirements of 1 and/or 2
and/or 3 above?

5) How does one splice a broken optical fiber in a way that meets the technical requirements of installed
aerospace platform cable bundles/harnesses?

6) How can avionics fiber optic and photonics technology be deployed in a reliable, maintainable, and supportable
manner?

7) How can avionics fiber optics and photonics technology buy its way onto the aerospace platform? (Another way to
ask the same question: What life cycle cost / total ownership cost drivers lie in favor of fiber optics?)

8) What equipment and training is needed to support optical fiber technology on aircraft?

Suffice it to say, all eight questions were decisively answered in various forms and in accordance with a wide range of
performance guidelines specified by a number of professional disciplines including avionics, wiring, logistics, reliability
and maintainability, system safety, manufacturing, production quality, support equipment, training, and cost. There are
numerous examples of production aircraft flying today, or spacecraft in orbit or on planetary missions today, that
incorporate fiber optics technology. These platforms include the Boeing 777 air transport jet,6,7 the Air Force
F-22 Raptor,8 the Navy F/A-18 Super Hornet,9 the Air Force AWACs,10 the European EuroFighter,11 and several NASA
projects including the International Space Station,12 X-Ray Timing Explorer (XTE), Solar Anomalous Magnetospheric
Particle Explorer (SAMPEX), Tropical Rainfall Measuring Mission (TRMM), and Hubble Space Telescope, to name a
few.13

Today, the Joint Strike Fighter (JSF) program is planning to deploy digital fiber optics technology onboard the JSF
platform variants (now called F-35 Lightning II).14-15 Within the Department of Defense, the Joint Fiber Optic Working
Group (JFOWG) continues to support the joint services by providing a forum to resolve open issues and plan for future
technology upgrades and deployments. SAE Avionics Systems Division Fibre Optics and Applied Photonics
committees meet twice a year to discuss emerging aerospace technology and development of new standards. The IEEE
Avionics Fiber Optics and Photonics Conference meets annually to communicate developments coming from the

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academic, corporate (commercial and aerospace), government, and small business S&T, logistics, reliability,
maintainability, supportability, and training communities.

2.2 Legacy Data Link Packaging

During the formative decades era, MIL-STD-883 Test Methods and Procedures for Microelectronics and MIL-STD-
38534 General Specification for Hybrid Microcircuits provided significant guidance to engineers interested in packaging
fiber optic transmitters, receivers and transceivers for military avionics applications. A 1990 paper from AT&T Bell
Laboratories presented some of the first packaging results for a militarized megabit LED transmitter.16 The Bell Labs
paper described a thin, hermetically sealed package form-factor built for military avionics applications invoking the
Standard Electronic Module (SEM-E) LRM standard. A 1990 paper from Boeing presented early results at packaging a
multi-channel InGaAs photodetector array for parallel-bus optical interconnects.17 A 1991 paper from Boeing presented
some of the first packaging results for a militarized gigabit laser diode transmitter.18 The 1991 Boeing paper described
the pros and cons of utilizing thermoelectric coolers (TECs) inside laser transmitter packages, where the primary con
being the inability to attain a low package height requirement of 0.12 inches due to the height of the TEC. A 0.98 m
InGaAs/GaAs strained layer quantum well laser diode capable of operating at 125 C was also described whereby a laser
diode design capable of operating up to 200 C was demonstrated.19 Using a high temperature laser diode in conjunction
with a rear-facet monitor photodetector and a bias-current compensation circuit obviated the need for a TEC in the laser
transmitter package.

2.3 The ROCTM Connector

A 1992 paper from AT&T Bell Laboratories described the development of the ROCTM connector.20 This connector was
designed to fit the SEM-E LRM form factor for connecting LRMs to optical backplanes in avionics air transport racks
whereby the optical light beam emitted from the source optical fiber is expanded and refocused into the receiving fiber
via ball lenses bonded onto silicon optical bench structures. The ROCTM connector incorporated a miniature door
retracting mechanism designed to impede the ingress of dirt and dust at the optical interfaces during connector
mating/de-mating.

2.4 Legacy SEM-E Format Packaging

1991 to 1993 publications from Harris Corporation outlined the state-of-the-art in military avionics fiber optic
transmitter and receiver packaging for the fiber-optic High Speed Data Bus (HSDB). At that time, results from the Air
Force Research Lab PAVE PILLAR and PAVE PACE studies were driving the development of the next generation
avionics architecture.21 The military SEM-E LRM form factor drove the development of the fiber optic HSDB and Fiber
Optic Transmitter and Receiver (FOTR) packaging for the Air Force F22 Raptor tactical fighter jet platform.22-25 A
compact detachable fiber optic connector was developed for attachment to the transmitter and receiver optical
interfaces.26 The connector was designed to be compatible with an active alignment fiber optic stub-based packaging
scheme. A physical contact (PC) type package optical interface based on ceramic ferrules and a ferrule alignment sleeve
enabled connector mating and de-mating. Harris Corporation also reported on an experimental optical backplane
packaging concept based on molded polyurethane encapsulated optical fibers. Direct measurements indicated that
>2 Gb/s data transmission could be supported through the backplane.27

2.5 Space Fiber Optics and Photonics Initiatives

Also during the formative decades era, the space community was active developing fiber optics and photonics
technology for use on space vehicles. A 1993 paper describing the Boeing Photonics Space Experiment (PSE) program
demonstrated the maturity of existing and emerging fiber optic and photonic components in space environments.28-30
The PSE program provided a baseline to the space community for future aerospace fiber optic and photonic component
reliability predictions. The experiment package encompassed an optical fiber radiation effects experiment, a laser diode
experiment, a broadband light emitting diode experiment, a passive components experiment, and a 1773 bit error ratio
experiment.

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The 1994 Boeing STAR Fiber Optic Data Bus (FODB) program paper described the development of a common usage
fiber-optic data bus for space applications.31 On this program a FODB bus interface unit (FBIU) multichip module
package was developed. The FBIU package comprised hermetically sealed, uncooled 1.3 m laser diode and PIN
photodetector optical subassemblies mounted inside a 0.335-in high package cavity. A few years later Boeing developed
the 0.17-in high AS1773 fiber optic transceiver for use in aerospace experiments and missions including NASAs New
Millennium program projects and Naval Research Laboratorys Microelectronics and Photonics Test Bed.32-34 The
AS1773 transceiver packaging was based on hermetically sealed 1300 nm surface emitting LED (SELED) and PIN
photodetector optical subassemblies and thick-film multi-chip module ceramic circuitry. Table 1 summarizes the digital
data rate performance and packaging attributes of the aforementioned FOTR, HSDB, FODB and AS1773 modules.

Table 1. Legacy military and space transmitter/receiver (transceiver) package attributes.

Module Data Rate Hermetic Light Military Detachable


Ceramic Circuit Technology
Type (Mb/s) Package Emitter SEM-E Connector
Seal Ring,
FOTR 400 Low-Temp Co-fired LED yes yes
Butterfly
Seal Ring,
HSDB 50 Low-Temp Co-fired LED yes yes
Butterfly
Seal Ring, LTCC and Multilayer Thick Diode
FODB 50 to 400 no no
Butterfly Film Laser
Tub,
AS1773A 1 and 20 Multilayer Thick Film LED yes no
Butterfly

2.6 Fly-By-Light Initiatives

Defense and aerospace companies and the U.S. Government were also researching a variety of fly-by-light aircraft
flight control technologies. A sampling of papers describing some of the late-1980s to mid-1990s fly-by-light hardware
and system developments are described in the list of references.35-53 For the past decade Air Force Research Lab
(AFRL) has continued to advance fly-by-light technology for flight control and vehicle management system
applications.54 AFRLs Advanced Vehicle Management Technology and More Electric Aircraft Photonic Vehicle
Management System Technology Validation programs developed system level architectures and prototype hardware.
More recently, the AFRL sponsored Control of Multi-mission Unmanned Air Vehicle Systems program continued the
development of fly-by-light flight control and vehicle management system hardware.

2.7 Boeing 777 Commercial Jet Transport ARINC 636

In parallel with the early military, space and fly-by-light technology initiatives described in Sections 2.2 through 2.6,
Boeing was engaged in the research, development and production of the Boeing 777 commercial transport jet.6 A
125 Mb/s Onboard Local Area Network (OLAN) was deployed on the initial Boeing 777 delivery to United Airlines in
June 1995. OLAN was the first production application of fiber-optics technology onboard a Boeing commercial
aircraft.7, 55 OLAN systems were based on the ARINC 636 standard which is a variant of the commercial fiber
distributed data interface (FDDI) standard, adapted for the commercial airplane LAN environment.56-57 OLAN consisted
of an Avionics LAN (AVLAN) and a Cabin LAN (CABLAN). Each of these networks consisted of primary and
secondary fiber optic rings and two bypass switch units. The 777 aircraft utilized avionics-grade 100/140-m graded
index multimode optical fiber with a germanium-doped silica core and a pure silica cladding. Over the cladding was an
acrylate buffer coating which provided protection and strength for the fiber. A polyolefin jacket covered the acrylate
buffer to protect the fiber from abrasion.

The 777 airplane fiber optic connecters utilized both physical contact (PC) and expanded beam technologies (Figure 1).
The expanded beam connector design used ball lenses to expand and transmit the beam of light from one connector
halve to the other, and then re-focus the light beam onto the endface of the receiving fiber. The typical optical power
loss of the 777s expanded beam connector was reported to be 1.2 dB. The PC connector on the 777 airplane offered
much lower optical power loss, and was used in areas that would experience a low amount of mate/de-mate activity.
The expanded beam connector was easily maintainable and for that reason it was used at every LRU interface; areas that
were expected to experience high connector mate/de-mate activities.

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FIBER
// LENS\_____ IfRMINUS

PROTECTIVE
G LAS S

Figure 1. Physical contact (left) and expanded beam (right) technology on the Boeing 777.
The transmitter and receiver modules on the Boeing 777 operated at 125 Mb/s (4B5B encoding) at less than
2.5 X 10-10 bit error rate over a temperature range of -40 to +110C. The transmitter and receiver circuitry was housed
inside hermetically sealed fiber-pigtailed KovarTM 16 pin dual-in-line package (DIP) headers. The ARINC 636
receivers wide dynamic range and the transmitters high output power and extinction ratio, along with the extended
operating temperature range, were significant performance differentiators compared to commercial FDDI optoelectronic
modules. The ARINC 636 transmitter and receiver module optical subassemblies (OSAs) were designed to achieve
optimum coupling between 100/140-m optical fiber and the LED and PIN photodiode devices inside the modules. The
OSAs incorporated high hermeticity endurance optical feedthroughs which maintained He leak rates less than 5X10-8
atm-cc/s after 1,000 temperature cycles between -40 and +125 C.58 Table 2 summarizes the ARINC 636 transmitter
and receiver performance as compared to commercial FDDI transmitter and receiver modules.
Table 2. Comparing commercial FDDI transmitter and receiver performance to ARINC 636.
Minimum Operating
Module Data Rate Minimum Receiver Multimode
Transmitter Temperature
Type (Mb/s) Sensitivity Fiber Type
Output Power Range
Commercial
FDDI
125 -20 dBm -31 dBm 62.5/125 m -40 to +85 C

ARINC 636 125 -14 dBm -34 dBm 100/140 m -40 to +110 C

2.8 Military Aircraft Mission Systems Gigabit VCSEL Data Links and Optical Backplanes

In the early-1990s the defense industry underwent tremendous corporate consolidation that resulted in Boeing,
Lockheed-Martin, and Northrop-Grumman emerging as the primary U.S. airframers for military fixed wing aircraft.
The DoD continued development of the next generation avionics architecture that specified 1 Gb/s or greater digital
interfaces and a common integrated processing backplane.22 The ARPA Optoelectronic Technology Consortium
(OETC) program demonstrated a 32-element VCSEL parallel array transmitter and receiver pair operating at 500 Mb/s
per channel.59 A number of follow-on ARPA and DARPA programs ensued including the Affordable Optoelectronics
program and the Optical Micro-Networks (OMNET) program. Boeing publications described transmitter and receiver
optical subassembly passive alignment packaging techniques based on wide operating temperature range surface
emitting LEDs, VCSELs, PIN photodiodes, multimode optical fiber, silicon optical bench technology, precision ceramic
optoelectronic device submount molding technology, and a detachable package connector.60-64

The Optical Backplane Interconnect System (OBIS) project awarded to Unisys (now Lockheed-Martin) by the U.S.
Navy under NAVAIRs Advanced Avionics Systems and Technology program furthered the realization of the optical
backplane for use in a wide range of avionics applications.65 Expanded beam connector derivatives similar to those used
on the Boeing 777 were evaluated in a board-to-backplane avionics form factor. Linear bus, ring bus and switched
network variants in backplane topologies, including the skip-a-node approach, were investigated. Unisys proposed a
3-mm high skip-a-node receiver package concept with a detachable connector similar to that used in the FOTR and
HSDB modules described in Section 2.4. The program concluded that the central switch is the high performance
solution of the future, and that the FibreChannel protocol would result in the least amount of risk. In hindsight, the
future meant flying gigabit FibreChannel fiber-optic technology on platforms such as the F/A-18 Super Hornet and the
F-35 Lightning II.

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As the OBIS program evolved, the definition of building blocks needed to implement a unified digital avionics network
for next-generation tactical aircraft optical communication became increasingly clearer.66 The interconnect proposed to
support the network comprised components for parallel optical communication and a switched topology including
optical transmitters and receivers, optical backplanes with high-density MT ferrule connectors, board-to-backplane
connectors with MT ferrules, rack and bulkhead fiber optic connectors, and fiber optic cables for inter-rack
communication. FibreChannel had indeed emerged as the preferred networking protocol standard for avionics
integration upgrades and new platforms requiring high bandwidth and low-latency performance.67

2.9 Lower Cost Avionics Transmitter and Receiver Packaging.

About the same time period as the OBIS program, industry began looking at ways to utilize commercial packaging
technology to overcome the cost challenges inherent in high performance avionics-grade fiber optic transmitter and
receiver modules.8, 68-69 At Boeing, a new FDDI transmitter and receiver packaging concept based on chip-on-board
(COB) technology resulted in a lower-cost design.70 The chip-on-board package utilized large format multi-chip module
laminate (MCM-L) substrates and glob top encapsulation of the integrated circuits. The LED and PIN photodetector
devices were hermetically sealed in TO-can STTM receptacles. Teledyne Electronic Technologies reported on a similar
approach whereby the hermetic FOTR transmitter package developed by Harris Corporation for the F-22 Raptor was
re-packaged using a MCM-L substrate and encapsulation.71 A few years later Boeing again reported on the application
of COTS optoelectronics and MCM-L and COB packaging technology in a prototype 12-channel 1.0625 Gb/s
FibreChannel receiver module based on ball-grid array module-to-board interconnect.72

2.10 Gigabit VCSEL Transceivers

Commercial fiber optic transmitters and receivers (and transceivers) have evolved tremendously since the early days of
megabit-capable LED transmitters.73 VCSEL-based small form factor (SFF) 2X5 and small form factor pluggable (SFP)
2X10 gigabit fiber optic transceivers have been developed and fielded for Gigabit Ethernet and FibreChannel data
networking applications. More recently, 2X6 SFF and 2X7 SFF transceivers have become available in the commercial
data networking market. One of many advantages the 2X6 SFF and 2X7 SFF transceiver offers is the diagnostic
monitoring interface (DMI) standardized under multi-source agreement document SFF-8472. Applications of DMI
include transceiver lifetime prediction, fault isolation, and compliance verification. Real time parameter data specified
in SFF-8472 includes temperature, supply voltage, transmitter laser bias current, transmitter laser optical power, and
receiver optical power. SFF-8472 also allows for status indication using pre-set alarm and warning levels for transmitter
fault and receiver loss of signal. Integrated multi-rate (up to 4.25 Gb/s) VCSEL driver ICs with automatic power control
and transimpedance and limiting amplifiers are available to form a transceiver chipset. A temperature calibrated
programmable resistor network IC (changeable every 2 C) with multiple analog inputs (i.e., for temperature
compensating transceiver bias voltages and currents) and outputs (i.e., for transmitter fault and receiver loss of signal
reporting) is also offered. Other technologies available from the commercial fiber-optic transceiver sector are the multi-
source agreement-based reference design kit and the Receive Signal Strength Indicator (RSSI) circuit. Package
screening and ruggedization techniques have been implemented to determine the efficacy of commercial-off-the-shelf
(COTS) transceivers for avionics applications.74-76

Figure 2. COTS small form factor gigabit fiber optic transceiver evolution.

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In the past, there have been cases where space and/or temperature limitations precluded the use of COTS transceivers in
avionics environments. As a case in point, Figure 3 illustrates how aerospace transceiver packages evolved from the
circa mid-1990s Boeing AS1773 design era (discrete device optical subassembly with individual fiber pigtails and LED
source) to the circa early-2000 Lockheed-Martin dual-quad design era (integrated array optical subassembly and VCSEL
sources). Both the AS1773 transceiver and dual-quad transceiver packages shown in Figure 3 are significantly thinner in
height than the commercially available transceiver packages shown in Figure 2.

Figure 3. Boeing AS1773 (left) and Lockheed-Martin dual-quad (right) transceivers.

Advancements in the commercial and military fiber optic transceiver technology sectors have filled some, but not all, of
avionics fiber optic network system needs.77-80 Work is ongoing to fill existing gaps in the digital avionics gigabit fiber
optic transceiver technology sector. These gaps are specifically delineated as follows: (1) Link health diagnostic circuit
and software integration (bit error ratio performance and/or error detection and/or transmitter output power and/or
receiver input signal strength) for Start-Up BIT (S-BIT) and Periodic / Background BIT (P-BIT), and (2) Aircraft cable
plant fault isolation via Initiated BIT (I-BIT) (without having to disconnect connectors or use troubleshooting
equipment).

Avionics network application protocols make it possible to fault isolate to a single link. However to the authors
knowledge, no application protocols exist today that specify fault detection and isolation performance for detecting and
isolating degradations and faults in individual aircraft cable harness fiber optic cable segments, or within a Weapon
Replaceable Assembly (WRA) or a Line Replaceable Unit/Module (LRU/LRM). Development and insertion of optical
built-in-test (BIT) technology is needed to realize fault detection and fault isolation percentages greater than 95% in
avionics fiber optic links and networks.

Recently, Ultra Communications presented a concept for integrating fiber optic cable diagnostics within aerospace
transceivers.81 Boeing has suggested applying optical time domain reflectometry (OTDR) technology to implement
built-in test in avionics fiber optic networks.82 In a Boeing program supported by NAVAIR, the technical feasibility of
implementing OTDR with gigabit transceiver circuitry to isolate fiber optic cable plant faults to within 10 cm was
demonstrated in a prototype BIT-capable transceiver (see Figure 4).83 The BIT-capable transceiver OTDR
demonstration was based on the application of a custom transmitter optical subassembly packaged in a modified SFF
transceiver module footprint. The transceiver tested at both 1.0625 Gb/s and 2.488 Gb/s exhibited a >18 dB link budget
at room temperature.

Figure 4. Built-in test capable gigabit transceiver prototype.

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2.11 Migrating to Wavelength Division Multiplexing (WDM) Avionics Local Area Networking

Early definitions of a unified avionics local area network based on WDM technology began to emerge in a series of
papers published by University of Strathclyde and University of Glasgow in the U.K., and Lockheed-Martin in the
U.S.84-89 The U.K. researchers suggested that the high bandwidth-to-weight ratio, performance, routing flexibility,
connectivity and survivability enabled by the combination of single mode optical fiber and WDM justified a new
photonic networking approach to onboard avionics communication systems. Their research emphasized compliance
with the integrated modular avionics architecture, and the need for built-in test and fault diagnosis procedures to enhance
network supportability. A ROBUS slotted bus network that is scaleable in topology, distance, number of nodes, bit-rate
and wavelength channels was introduced for transporting avionics data in the harsh aerospace operational environment.
The Lockheed-Martin researchers looked at ways to integrate what had historically been disparate systems (core
processing, RF analog, and vehicle management) into a unified avionics system interconnected in a unified network.
The proposed architecture provided bandwidth, latency and connectivity required for equal access view of all avionics
resources. A common topology, protocol and speed independent optical backbone utilizing a single fiber optic
connection was envisioned to connect multiple systems together. Building block elements included transmitters,
receivers, couplers/splitters, add/drops, demultiplexers, amplifiers, and an interface unit (to convert native transmission
formats to an optical backbone compatible format). Lockheed-Martins LightmoverTM development roadmap has been
suggested as a means to facilitate universal data transmission across a common backbone architecture.90

Under the NAVAIR Flight Testing Optical Communication Using Open Standards (FOCUS) program, a dual redundant
digital backbone WDM architecture was developed and flight tested on a Navy EA-6B Prowler.91 The design utilized
available COTS DWDM 100 GHz spacing components. A 200 GHz spacing in the ITU C-band was selected to
accommodate possible wavelength drift of components over the aircraft environmental extremes. Single mode and
multimode fiber optic cables and connectors were also flight tested to assess suitability in the EA-6B operational
environment. An analog RF WDM design was developed to meet the airborne electronic attack mission. The major
obstacles encountered on the FOCUS program were (1) scarcity of DWDM components with small form factor, (2) lack
of adequate RF photonic components, (3) power consumption requirements of thermoelectrically cooled devices, (4)
inadequate packaging of commercial DWDM components to survive in the military avionics environment, and (5)
limited availability of single mode cables and connectors rugged enough to survive the military avionics environment.

L-3 Photonics recently presented an advanced protocol independent WDM avionics optical network than carries traffic
bi-directionally on many wavelengths.92 The network utilizes a single mode fiber bus that is scaleable in both data rate
and number of nodes, distributes signals optically, and only requires electrical conversion at the bus entrance and exit.
Passive optical tee photonic integrated circuit assemblies (called integrated passive optical nodes (IPONs))
incorporating erbium doped waveguide amplifiers compensate for losses in the optical tee.

Research results at Boeing suggest that evolution from fixed wavelength WDM with reconfigurable optical add/drop
multiplexers (ROADMs) to tunable wavelength WDM with wavelength selective meshes will naturally lead to an
increase in connectivity and fault tolerance, and benefit from the advantages of wavelength conversion.93-94 Emerging
physical layer architecture paradigms for routable, high performance digital WDM networks include: (1) low cost
wavelength tunable transmitters and receivers with passive optical routing enabled by arrayed waveguide gratings
(AWGs), (2) low cost fixed wavelength transmitters and receivers with active central routing, and (3) fully wavelength
tunable sources, cross-connects and receivers.

Research results at IPITEK describe a WDM optical network for avionics based on passive optical coupling
(multiplexing), passive optical splitting (de-multiplexing), and centralized processing of information signals.95 The
architecture contains built-in performance monitoring and automatic protection switching for fault tolerance. A key
feature of the architecture is the use of a WDM access device located on processing cards. The WDM access device
comprises integrated WDM mux/demux, local signal access, signal amplification, and signal relay. The architecture
supports both uni-cast and multi-cast signal delivery of individual transmission wavelengths to network destinations.

Further research results at Lockheed Martin under the Air Force Highly Integrated Photonics program describe a
bi-directional bus network architecture.96 In the bi-directional bus architecture, each node has the ability to launch a
signal onto the bus at a reserved ITU channel location so that it may be accessible to any other node on the loop. The

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fiber bus interface is designed to allow transmission onto (and receiving from) the bus network where the transmit signal
is available to any node on the bus and any node on the bus may choose to receive any one signal present on the bus.
Channels are not dropped when they are selected by a node, but instead are still available to all nodes simultaneously.
Optical losses experienced in the passive coupling of the transmit signals and in the tapping of the receive signals are
compensated using an integrated optical amplifier (called a lossless bus interface chip (LBIC)) in-line with the fiber
bus.97 A tunable filter is implemented as an arrayed waveguide grating demultiplexer (AWG), an array of thermo-optic
switches, and an AWG multiplexer.

Research results at the U.S. Naval Academy suggest the versatility of bi-directional add/drop multiplexers (BADMs) and
all-optical wavelength conversion as a means to implement advanced avionics local area networks based on WDM.98-99
Research results at NAVAIR indicate that advanced packaging development of next generation WDM avionics network
devices should initially focus on polarization independent versions of the devices listed in Table 3. In the future, the
priorities listed in Table 3 may indeed change depending on the evolution of the avionics industrys WDM networking
technology development roadmap, avionics WDM LAN modeling, simulation, and laboratory test results, the SAE
WDM LAN standard, any new photonic integrated circuit device developments, and technology readiness.9, 100-104

Table 3. Avionics WDM LAN device packaging candidates.

Package/Module Type Current Priority

BADM HIGH
IPON / LBIC (or derivative) HIGH
Optical Switch HIGH
ROADM LOW
Tunable Filter HIGH
Tunable Laser Transmitter HIGH
Tunable Receiver LOW
Wavelength Converter HIGH
Wavelength Selective Switch LOW

2.12 Legacy Fiber Optic Cable Plant Components

Aircraft cable plant components comprise cabled optical fiber, fiber optic termini, fiber optic connectors, fiber optic
cable assemblies, and fiber optic splices. The MIL-DTL-38999 electrical connector populated with MIL-PRF-29504
fiber optic termini has seen widespread use in legacy fiber optic capable platform applications (Figure 5). The socket
side of the MIL-DTL-38999 connector presents a potential aircraft fiber optic maintainability issue in cases where mean
time to connector repair is limited. Historically, aircraft fiber optic cable engineers have utilized both tight buffer and
loose tube fiber-optic cable designs.105-106 Newer cable designs are currently undergoing performance testing at various
venues.107-109 Fiber optic cable remove and replace aircraft maintenance concepts are currently being invoked owing
to the limited durability performance of available mechanical fiber optic splice technologies. To the authors
knowledge, polarization maintaining fiber optic interconnects have not been pursued in military / aerospace air vehicles.

Figure 5. MIL-DTL-38999 connector with MIL-PRF-29504 fiber optic termini.

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3. FUTURE FIBER OPTIC INTERCONNECT CHALLENGES
To address the need to move to a single mode based WDM LAN for next generation avionics systems, a new single
mode fiber optic cable, connector, terminus and splice solution has to be created. The single mode cable must be robust
such that its performance is insensitive to variations in manufacturing tolerances or its operational environment and
exhibit properties based on availability, durability, environmental, installability, optical, quality, maintainability,
producibility, reliability, supportability and testability performance metrics. These performance metrics are not yet fully
defined in a unified aerospace single mode fiber optic cable standard.110 First thoughts on the aerospace single mode
fiber-optic cable subject have suggested a highly bend and clamp insensitive fiber optic cable design that is compatible
with fusion splicing to standard telecommunications-grade single mode fiber. A wide operating temperature (-55 to 165
C minimum) and strippable fiber coating is also needed. Aerospace fiber optic cable performance specifications must
be updated to ensure the performance of single mode cable over a wide range of aircraft cable harness installation
scenarios.

A candidate high performance aerospace single mode fiber optic connector offering is the Next Generation Heavy Duty
Multifiber Connector (NGCon) whose development, specification and qualification is supported by the Navy.111 It is
anticipated that performance test data will enable qualification of the NGCon for aerospace applications (to replace less
maintainable legacy connectors). Primary motivations for the NGCon are to minimize procurement costs, minimize
support costs, and improve optical performance. The objective is to develop a next generation heavy-duty multi-fiber
connector that is inter-operable and inter-changeable, uses LC technology (1.25 mm OD ferrule), has a low acquisition
cost objective, and implements best engineering practices / features to give lowest total ownership cost.

Key NGCon requirements are as follows:


Inter-changeable / Inter-operable parts
Multimode and single mode capable (1.25 mm OD ferrule)
Temperature range
- Type 1: -40 to +85 C operational
- Type 2: -55 to +165 C operational
Atmospheric sealing
EMI /RFI
Shock and vibration (shipboard and aerospace)
Durability (500 mates/demates)
Salt fog
Terminus keying (optional)
Fiber densities not less than MIL-PRF-28876 (31 fibers for shell size 23)
Genderless termini
Terminus design extensible to higher performance levels
Maximum initial insertion loss 0.50 dB
Return loss better than 40 dB
Alignment sleeve captured within a removable retainer
Connector insert-to-inset bottoming
Supports up to 12 keying positions
Inclusion of full mate indicator.

Some key NGCon benefits of importance to the Navy include:


Maintainability (via significant improvement in cleanability and mean time to repair)
Reduced cost, weight and space
Commonality (qualification, training, repair and maintenance, logistics)
True multi-vendor development and supply
Modular design
Maximized applicability and interchangeability (interoperability)
Genderless termini
Accommodates multiple cable designs.

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The NGCon fiber optic terminus concept is shown in Figure 6. The NGCon connector receptable and terminus
alignment sleeve retainer concept is shown in Figure 7. The Navy and Defense Supply Center are in the process of
creating new military performance specifications for the NGCon connector and NGCon terminus. Test data is not yet
available indicating that the single mode PC version of the NGCon will perform as needed in aerospace application
environments (change in optical transmittance < 0.5 dB). An expanded beam version of the NGCon may indeed be
pursued if optical performance of the PC version is less than expected.

Figure 6. NGCon fiber optic terminus concept.

Figure 7. NGCon receptacle connector concept.

The NGCon design leverages off of commercial LC connector development. The removable alignment sleeve retainer is
an interchangeable part designed for ease of terminus cleaning. Connector density is as high as 36 contacts per shell size
25 connector (exceeds current military connector technology). Optical continuity is maintained via pull-resistant, rear
release terminus. The interfacial seal and clip are on the terminus, which enables visual inspection. The plug receptacle
connection is sealed and an optional rear grommet seal/accessory can be accommodated. The connector alignment
sequence is designed to avoid endface damage and alignment pin bending. Finally, design for manufacturing eases
issues related to mechanical tolerance stack.

4. FUTURE OPTOELECTRONIC PACKAGING CHALLENGES


In the foreseeable future, military avionics optoelectronic package research will address (1) BIT-capable single
wavelength optoelectronic transceiver packages and (2) BIT-capable active and passive WDM LAN component
packages. The research will focus on digital avionics and RF component environmental and optical performance,
durability, installability, maintainability, producibility, quality, reliability, supportability, testability and cost.

4.1 BIT-capable single wavelength optoelectronic transceiver packages.

Future BIT-capable single wavelength optoelectronic transceiver packages are forecasted to incorporate holistic design
concepts whereby BIT circuit integration, optoelectronic packaging integration, high-density detachable connector
integration, and optical time domain reflectometry (or optical frequency domain reflectometry) are applied. The BIT
packaging will enable the realization of fault detection and fault isolation percentages greater than 95% in avionics fiber
optic networks. Figure 8 summarizes the BIT-capable single wavelength optoelectronic transceiver packaging challenge

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that lies ahead. Figure 9 illustrates a potential BIT-capable transceiver package solution under development at Ultra
Communications which includes four transmitter and receiver fiber optic channels and features -50 to +100 C
operation.

Figure 8. BIT-capable single wavelength multi-channel optoelectronic packaging challenge.

Figure 9. Ultra Communications BIT-capable dual-quad transceiver package concept.

4.2 BIT-capable WDM LAN component packages.

Future avionics WDM LAN component packages are forecasted to evolve in generational steps. It is very likely that
first generation packages will not have BIT capability owing to the immaturity of BIT-capable WDM LAN system
concepts and the SAE WDM LAN standard. To the authors knowledge there are no programs in existence developing
BIT-capable WDM LANs, particularly for avionics applications where fault detection and isolation percentages exceed
95%. The current state of WDM photonic integrated circuit technology for implementing potential avionics WDM LAN
functions such as tunable wavelength laser data transmission, tunable wavelength filtering, wavelength add/drop, and
wavelength conversion requires tight temperature controlling circuits to maintain compliance with the ITU grid channel
spacing (0.8 nm, 1.6 nm, 3.2 nm, etc.). Potentially, low profile and power-efficient thermoelectric coolers will be
needed in sizes ranging from a few millimeters on a side to up to approximately 35 mm on a side.

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Figure 10 illustrates a low-profile, wide operating temperature range tunable laser package concept proposed by
OptoNet. This hermetically sealed package has a much smaller footprint (length, width and height) compared to legacy
commercial wavelength-selected distributed feedback laser and wavelength-tunable laser butterfly packages. Small
footprint hermetic packaging similar to the OptoNet design is expected to be applied in other temperature-dependent
device packaging scenarios including tunable wavelength filters and wavelength converters. Second generation avionics
WDM LAN packages will likely incorporate detachable single mode connectors. Second or third generation packages
should enable the optical BIT functionality for application in military avionics systems.

Figure 10. OptoNet tunable laser package concept.

Passive add/drop multiplexers and active high-speed optical switches may or may not require TECs and hermeticity. In
cases where TECs and hermeticity are not needed it may then be prudent to consider engineering plastics or ceramics as
a lower cost packaging materials option in favor of gold plated Kovar,TM copper-tungsten alloy or other specialty alloys.

5. SUMMARY
This paper reviewed much of the history behind todays avionics fiber optic interconnect and optoelectronic packaging
designs. A new wave of packaging and interconnects research and development is required to enable a robust next
generation BIT-capable avionics LAN technology solution based on single mode fiber and advanced WDM components.
Similarly, for high-speed point-to-point multimode fiber-optic links, cost-efficient transmitter and receiver (transceiver)
packages with in-package optical BIT capability are needed to enable fully BIT-capable fiber optic links on both legacy
and future military / aerospace platforms.

6. ACKNOWLEDGEMENTS
I wish to acknowledge Eric Chan for providing a photo of the Boeing AS1773 transceiver package, Rick Stevens for
providing a photo of the Lockheed-Martin dual-quad transceiver package, Balky Nair for providing photos of Ceramatec
ceramic multifiber ferrules, Charles Kuznia for providing a photo of the Ultra Communications BIT-capable dual-quad
package prototype, and Jing Ma for providing a photo of the OptoNet tunable laser package prototype. I also thank
Anthony Avak, Eric Bluebond, Gair Brown, Drew Glista, Christopher Good, Michael Hackert, R. Brian Jenkins,
John Kolasinski, Brian McDermott, Juock Namkung and Robert Voigt for their valuable inputs.

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