Mapa Institute of Technology

School of CHE-CHM-BE-MSE

LFL PCB
Advanced Circuit Technology

Production of Printed Circuit Board with Insulating

Substrate Using Nanoclay/ Carbon Nanotube Filled
Composites

School of Chemical Engineering, Chemistry, Biological Engineering, and

Materials Science and Engineering

In partial fulfilment of the Requirements for the Degree

Bachelor of Science in Material Science and Engineering

By

Ledesma, Nikko Kirby D.

Lim, Ian Francis C.

Dr. Blessie A. Basilia

Instructor

1
LFL PCB

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 APPROVAL SHEET

This is to certify that I have supervised the preparation of and read the report. I certify that I have

examined this report and hereby recommend it to be accepted as a partial fulfilment of the

requirements for the Bachelor of Science in Materials Science and Engineering.

______________________

Dr. Blessie A. Basilia

Professor

3
December 10, 2016

Dr. Blessie A. Basilia

Faculty
School of CHE-CHM-BE-MSE
Mapua Institute of Technology
Intramuros, Manila

Dear Dr. Basilia,

In line with the requirements in MSE117 (Plant Design), we are submitting this paper entitled,

Production of Printed Circuit Board with Insulating Substrate Using Nanoclay/ Carbon

Nanotube Filled Composites. This involves the evaluation of market, technical, and financial

aspects of the study.We hope that this will satisfy the requirements for the standards set in Plant

Design. Thank you.

Respectfully yours,

Ledesma, Nikko Kirby D.

Lim, Ian Francis C.

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 TABLE OF CONTENTS

TITLE PAGE

LFL PCB Logo 2

Approval Letter 3

Letter of Transmittance 4

Table of Contents 5

Chapter 1: Project Description

1.1 Company Profile 11

1.2 Company Vision 12
1.3 Company Mission 12

Chapter 2: Market Study

2.1 Supply 13
2.2 Demand 13

Chapter 3: Technical Study

3.1 Product Description 14

3.1.1 Introduction 14
3.1.2 Substrate Material 14
3.1.3 Electrodeposited Copper Foil 15

3.2 Process Description 17

3.2.1 Process of making PCB 17

3.2.1.1 Front-end tool data preparation 18
3.2.1.2 Preparing of Phototools 18

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 3.2.1.3 Print Inner Layer 19
3.2.1.4 Etch inner layers 21
3.2.1.5 Register punch and Automatic Optical Inspection 22
3.2.1.6 Lay-up and bond 23
3.2.1.7 Drilling the PCB 25
3.2.1.8 Electroless Copper deposition 26
3.2.1.9 Image the outer layers 27
3.2.1.10 Plating 28
3.2.1.11 Etch Outer Layer 30
3.2.1.12 Apply Solder Mask 32
3.2.1.13 Plated Gold Edge Connector 34
3.2.1.14 Silt Screen Cure 35
3.2.1.15 Electrical Test 35
3.2.1.16 Profiling V cut Scoring 36
3.2.1.17 Final Inspection 36

3.2.2 Development of PCB 37

3.3 Material Balance 39

3.4 Machineries and Equipments 40

3.4.1 Production of PCB 40

3.4.1.1 Laser Photoplotter 40

3.4.1.2 Automatic Optical Punch 41

3.4.1.3 Xray Drill 42

3.4.1.4 Ink Jet Printer 43

3.4.1.5 Flying Probe Tester 44

3.4.1.6 V-Cut Machine 45

3.4.2 Development of PCB 46

3.4.2.1 Thermo Noran Sytem Six Energy Dispersive X-ray Spectrometer 46

3.4.2.2 XE 100 AFM 47

3.4.2.3 Universal Testing Machine 48

3.4.2.4 MKS Izod Impact Testing Machine 49

3.4.2.5 Mitutoyo AR-10 hardness tester 50

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 3.4.2.6 Digital LCR Meter 51

3.4.2.6 2940 TMA of TA Instrument 52

3.5 Materials Handling 53

3.5.1 Storage of Raw Materials and Mobility 53

3.5.3 Storage of Product 53

3.5.4 Shipping 53

3.6 Quality Control 54

3.6.1 Incoming Quality Control 54

3.6.2 Automated Optical Inspection 54

3.6.3 Flying Probe Test 54

3.6.3 Random Laminate Tg and Td inspection 55

3.7 Health and Environmental Safety 56

3.7.1 Material Safety Data Sheets for Raw Materials 56

3.7.1.1 Carbon Nanotube 56

3.7.1.2 Epoxy Resin 59

3.7.1.3 Fibre Glass 62

3.7.1.4 Copper Foil 64

Chapter 4: Plant Site

4.1 Site Location 65

4.1.1 Geography 65

4.2.2 Climate 66

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 4.2.3 Economic Data 66

4.2 Plant Layout 67

Chapter 5: Financial Analysis

5.1 Plant Operations Organizational Chart and Functional Responsibilities 72

5.2 Raw Materials 73

5.3 Labor Requirements 74

5.4 Utilities 75

5.5 Land 75

5.6 Machineries and Equipments 76

5.7 Miscellaneous Expenses 76

5.8 Taxes, Licenses, and Insurance 77

5.9 Registration 77

5.10 Cost of Building a Plant 77

5.11 Monthly Dues 78

5.12 Target Production Output (per week) 78

5.13 Income Average 78

5.14 Return of Investment 79

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 LIST OF TABLES

Table 3.1.2 Elemental Composition of the experimental PCB substrate 15

Table 3.1.3 Specification and Quality Test Result 16

Table 3.4.1.4 Specs of Ink jet Printer 43

Table 3.4.1.5 Specs of Flying Probe Tester 44

Table 3.4.1.6 Specs of V cut machine 45

Table 3.4.2.3 Specs of Universal testing machine 48

Table 3.4.2.7 Specs of 2940 TMA 52

Table 4.1 Dimensions of rooms 68

Table 5.1 Raw Material Costings 73

Table 5.2 Labor Requirements 74
Table 5.3 Utilities Costings 75
Table 5.4 Land Costings 75
Table 5.5 Machineries and Equipment Costings 76
Table 5.6 Miscellaneous Expenses 76
Table 5.7 Taxes, Licenses, and Insurance 77
Table 5.8 Registration 77
Table 5.9 Cost of Building a Plant 77
Table 5.10 Monthly Dues 78
Table 5.11 Target Production Output (Per day) 78

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 LIST OF FIGURES

Figure 2.1 Trends in Regional Growth of World PCB Production 13

Figure 2.2 PCB Demand Falls 13

Figure 3.1 Process of Making PCB 17

Figure 3.2 Process of Developing PCB 37

Figure 4.1 Location of Plantsite in Batangas City 65

Figure 4.2 Plant Layout 67

Figure 5.1 Organizational Chart 72

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 CHAPTER 1

PROJECT DESCRIPTION

1.1 Company Profile

Company name: LFL PCB

Company Logo:

Capital: 200,000,000

Plant Location: Bgy Balagtas, Batangas City

Product: Printed Circuit Board with Insulating Substrate Using Nanoclay/ Carbon

Nanotube Filled Composites

LFL PCB plant is located in the city of Batangas, the capital of Batangas Province. The

city of Batangas has been the target location for the plant because of the Batangas Port and

continues growth of the economy of Batangas.

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1.2 Company Vision

Our vision is to be the top provider of Printed Circuit Board in Asia, and to be the

number one on research for improving the Printed Circuit Board technology.

1.3 Company Mission

To provide high quality of advanced circuit board technology for the electronic

industry by continually improving our process through the use of modern technology.

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 CHAPTER 2

MARKET STUDY

2.1 Supply

The analysis of PCBs market supply and demand is one of the key things in the

success of our company. We study how the PCB is desired by the buyers and how much

the market can offer. This analysis helps on how many PCB will we create and how

many can we sold to our buyers.

Figure 1: Trends in Regional Growth of World PCB Production

Market supply represents on how the market can offer. In figure (insert number of figure) we

can see that the market supply of pcb goes higher. As of 2014, China and Hong Kong have the

highest growth of supply in PCB production.

2.2 Demand

Figure 1: PCB Demand Falls

Demand refers to how much of the product or service is desired by the buyers. Figure

(insert number of figure) shows the demand of PCB from september 2011 to september 2012.

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 CHAPTER 3

TECHNICAL STUDY

3.1 Product Description

3.1.1 Introduction

The LFLPCBproduce an inovative insulating substrate, the Insulating substrate is

made of recycled polycarbonate (RPC) reinforced with nano clay/ carbon nanotube. The

insulating substrate made of RPC is found to have a lower water absorption than the

usual Paper Reinforced Phenolic Resin substrate. It has a better hardness and better

structural properties than the usual substrate.

3.1.1 Substrate Material

Using the spectral analysis and Energy Dispersive X-ray spectroscopy analysis, the

elemental composition and the image of dispersion of the elements on the cross section of the

substrates and the reference substrate were determined as shown in the Table. 1. The samples

were prepared for testing by IR (International Rectifier) failure analysis department.

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 Table 1. Elemental composition of the experimental PCB substrates.

% atom
Substrates
C O Si Al Cu P Br

PP (reference) 50.74 45.59 1.26 2.41

RPC-5%MMT 69.24 27.37 2.46 0.94

RPC-5%MMT-
71.04 24.88 2.74 1.33
0.5CNT

RPC-5%MMT-
70.37 25.29 4.35
2%CNT

3.1.3 Electrodeposited Copper Foil

The copper foil used as a conducting path was purchased from Fukuda Metal Foil &

Powder Co.LTD. A Surface Treated Electrodeposited Copper Foil was chosen because it is the

widely used type of foil for PCB application. Table 2 below summarizes specification and quality

of the foil being used. All the results conform to IPC-4562.

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Table 2 Specifications and Quality Test results by FUKUDA METAL FOIL & POWDER CO., LTD.

Specification

Type Surface Treated Electrodeposited Copper Foil

Grade CF-T9LF-UN-35

Size 210mm X 300mm

Thickness 35m

Tests Unit Results

Copper Foil (visuals) - Good

Area Weight g/m2 286.2

At 23C Mpa 373

At 180C Mpa 197

Elongation At 23C % 16.6

At 180C % 6.2

Properties after lamination onto FR-4

N/mm 1.63
Peel Strength, Condition A

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3.2 Process Description

3.2.1 Process of making PCB

By understanding the manufacturing process you will be able design PCBs that

can made more easily and cheaply. Designing boards that fit within industry standard

specifications gives you two advantages: you keep down the cost of your end product, so

that it will sell better; and you improve its long-term reliability, so that your customers

will keep on coming back to you.

Front -End Tool data Preparring the

Print Inner Layers
Preparations Phototools

Register Punch and

Drilling the PCB Lay-up and Bond Automatic Optical
Inspection

Electroless copper Image the outer

Apply Soldermask
deposition layers

RoHs complaint
Plated gold edge sufrace finishes and
Silk Screen and Cure
connectors electroless gold
over nickel

Profiling V cut
Electrical Test Final Inspection
Scoring

Fig3.2. 1: Process of Making PCB

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3.2.1.1 Front-end tool data preparation

The board designer has prepared the layout on a Computer Aided Design or CAD

system. Each CAD system uses its own internal data format, so the PCB industry has

developed a standard output format to transfer the layout data to the manufacturer.

First we check that data meets our manufacturing requirements. These validations are

mostly done automatically. We check the track widths, the space between tracks, the pads

around the holes, the smallest hole size etc. The engineer can also check and measure

individual areas where he wishes. Once the data is verified as good he will output all the

tool files needed to drive the machines that will make and test the PCB.

3.2.1.2 Preparing the Phototools

We use laser photoplotters in a temperature and humidity-controlled darkroom to

make the films we will use later to image the PCBs. The photoplotter takes the board data

and converts it into a pixel image. A laser writes this onto the film. The exposed film is

automatically developed and unloaded for the operator. The films are ready now for the

PCB fabrication process.

We have generated one film or phototool per PCB layer. Now the films are registered

with each other so that the different layers of the PCB will be perfectly aligned. We do

this by punching precise registration holes in each sheet of film. The operator puts the

film on the table of the punch and then micro-adjusts the table until the targets on the film

are exactly lined up with the targets on the film punch. The operator then punches each

sheet of film with the registration holes which will fit onto the registration pins in our

imaging equipment.

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3.2.1.3 Print inner layers

To produce the inner layers of our multilayer PCB, we start with a panel of

laminate. Laminate is an epoxy resin and glass-fibre core with copper foil pre-bonded

onto each side.

Fig 3.2.1.3.1: Panel of Laminate

The first step is to clean the copper. We print the panels in a clean room to make sure that

no dust gets onto the surface where it could cause a short or open circuit on the finished

PCB. The cleaned panel is coated with a layer of photosensitive film, the photoresist.

Fig 3.2.1.3.2: Panel coated with a photosensitive film

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The bed of the printer has registration pins matching the holes in the phototools and in the

panel. The operator loads the first film onto the pins, then the coated panel then the

second film. The pins ensure that the top and bottom layers are precisely aligned. The

printer uses powerful UV lamps which harden the photoresist through the clear film to

define the copper pattern.

Fig 3.2.1.3.3: Panel coated with second photosensitive film

Under the black areas the resist remains unhardened. The clean room uses yellow lighting

as the photoresist is sensitive to UV light. Outside the yellow room the panel is sprayed

with a powerful alkali solution which removes the unhardened resist ( etching) . The

panel is pressure-washed and dried. The copper pattern we want is now covered by the

hardened resist. The operator checks a sample of the panels to make sure that the copper

surface is clean and all the unwanted resist has been removed. You can now see in the

blue resist what will be the copper on our inner layer panel.

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 Fig 3.2.1.3.4: Inner layer of the panel with copper

3.2.1.4 Etch inner layers

We remove the unwanted copper using a powerful alkaline solution to dissolve (or

etch away) the exposed copper from the inner layer. The process is carefully controlled to

ensure that the finished conductor widths are exactly as designed. But designers should be

aware that thicker copper foils need wider spaces between the tracks. The operator checks

carefully that all the unwanted copper has been etched away.

Fig 3.2.1.4.1: Panel that has been

Etched

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Next we strip off the blue photoresist which protected the copper image. So now we have

the exact pattern required. The operator checks that all the photo-resist has been removed.

Fig 3.2.1.4.2: Exact pattern required

3.2.1.5 Register punch and Automatic Optical Inspection

The inner core of our multilayer is now complete. Next we punch the registration

holes we will use to align the inner layers to the outer layers. The operator loads the core

into the optical punch which lines up the registration targets in the copper pattern and

punches the registration holes. We wont be able to correct any mistakes on the inner

layers once we have assembled the multilayer so we now give the panel a complete

machine inspection. The automatic optical inspection system scans the board in broad

strips and compares it with the digital image generated from the original design data. Any

errors are displayed on screen.

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 Fig 3.2.1.5: Automatic Optical
Inspection

3.2.1.6 Lay-up and bond

The outer layers of our multilayer consist of sheets of glass cloth pre-impregnated

with uncured epoxy resin (prepreg) and a thin copper foil. The lay-up operator has already

placed a copper foil and 2 sheets of prepreg on the heavy steel baseplate. Now he places

the pre-treated core carefully over the alignment pins. Then he adds 2 more sheets of

prepreg, another copper foil and an aluminium press plate He builds up 3 panels on the

baseplate in the same way. Then he rolls the heavy stack under a press which lowers

down the steel top plate. He pins the stack together and rolls the finished stack out of the

clean room into a rack.

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Fig 3.2.1.6.1: Layers of Coppers, aluminum press
plate
The press operator collects 3 stacks on a loader and loads them into the bonding

press. This press uses heated press plates and pressure to bond the layers of the PCB

together. The heat melts and cures the epoxy resin in the prepreg while the pressure bonds

the PCB together. The process is computer controlled to build up the heat and the

pressure correctly, hold it and then to cool the press down. In this way we ensure a

permanent bond that will last the lifetime of the PCB. Our board has 4 layers but complex

PCBs for defence, avionic and telecommunications applications can have more than

50. These may include sub-assemblies of cores, prepregs and foils drilled and plated

before being assembled into the final PCB. Once the cycle is completed the press operator

unloads the press and carefully rolls the heavy stacks into the clean room. Here the lay-up

operator de-pins the stack and removes the top plate. He unloads each of the panels from

the stack, removing the aluminium press plates used to ensure a smooth copper

finish. The copper foil is now bonded in place to form the outer layers of the PCB.

Fig 3.2.1.6.2: Outer Layer of PCB

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3.2.1.7 Drilling the PCB

Now we drill the holes for leaded components and the via holes that link the

copper layers together. First we use an X-ray drill to locate targets in the copper of the

inner layers. The machine drills registration holes to ensure that we will drill precisely

through the centre of the inner layer pads. To set up the drill the operator first puts a panel

of exit material on the drill bed. This stops the drill tearing the copper foil as it comes

through the PCB. Then he loads one or more PCB panels, and a sheet of aluminium entry

foil. The drilling machine is computer-controlled. The operator selects the right drill

program. This tells the machine which drill to use and the X Y co-ordinates of the

holes. Our drills use air-driven spindles which can rotate up to 150,000 revolutions per

minute. High speed drilling ensures clean hole walls to provide a secure base for good

Fig 3.2.1.7: Panel with Drilled hole

plating on the hole walls. Drilling is a slow process as each hole must be drilled

individually. So depending on the drill size we drill a stack of one to three PCB panels

together. We can drill holes down to 100 microns in diameter. To give you an idea of the

size, the diameter of a human hair is about 150 microns. Drill change is fully

25
automatic. The machine selects the drill to use from the drill rack, checks that it is the

correct size, and then loads it into the drill head. Once all the holes are drilled the operator

unloads the panels from the drilling machine and discards the entry and exit material.

3.2.1.8 Electroless Copper deposition

The first step in the plating process is the chemical deposition of a very thin layer

of copper on the hole walls. The operator clamps the production panels into the jigs. The

line is fully computer controlled and the panels are carried through a series of chemical

and rinsing baths by the overhead crane. Almost all PCBs with 2 or more copper layers

use plated through holes to connect the conductors between the layers. A good connection

needs about 25 microns of copper on the walls of the holes. This thickness must be

electroplated, but the walls of the holes are non-conductive glass cloth and resin. So the

first step is to deposit a conductive layer over the hole walls. We use electroless copper,

that is we deposit chemically a layer of copper about 1 micron thick over the walls of the

hole (and incidentally across the whole panel). This is a multi-stage process as you see

from the video with washing steps between the stages. We pre-treat the panel, then we

seed the hole wall with micro-particles of palladium, and finally deposit the copper.

Fig 3.2.1.8: Panel with electroless deposited

copper
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3.2.1.9 Image the outer layers

We image the outer layers in a clean room to make sure that no dust gets onto the

panel surface where it could cause a short or open circuit on the finished PCB. The panel

is first coated with a layer of photosensitive film, the photoresist, which is hot-rolled onto

the copper using a cut-sheet laminator. The laminated panels are collected by an automatic

rack. The clean room uses yellow lighting as the photoresist is sensitive to UV light.

Fig 3.2.1.9.1: Imaged Outer Layer

We image the outer layers in a clean room to make sure that no dust gets onto the panel

surface where it could cause a short or open circuit on the finished PCB. The panel is first

coated with a layer of photosensitive film, the photoresist, which is hot-rolled onto the

copper using a cut-sheet laminator.The laminated panels are collected by an automatic

rack.The clean room uses yellow lighting as the photoresist is sensitive to UV light.

27
 Fig 3.2.1.9.2: Imaged outer layer with exposed
copper

3.2.1.10 Plating

Next we electroplate the boards with copper. The operator loads the panels onto

the flight bars. He checks all the clamps to ensure a good electrical connection. The

panels themselves act as cathodes for electroplating and we can plate the hole walls thanks

to the conductive carbon layer already deposited there. The operator starts the automated

plating line. The copper surface of the panels is cleaned and activated in a number of

baths and then electroplated. . The whole process is computer controlled to ensure that

each set or flight of panels stays in each bath exactly the right amount of time. You can

see the copper anodes in their bags. To ensure good conductivity through the holes we

need to plate an average of 25 microns of copper on the hole walls. This means that we

also plate 25 30 microns on the surface tracks. So if we start with a typical 17.5 micron

copper foil it will be 40 42 microns after processing.

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 Fig 3.2.1.10.1: Copper Plated Panel

The baths are designed to produce an even copper thickness across the panel. Modern

chemical solutions also have good throwing power to produce an even thickness of

copper right through the hole. Once we have plated the copper onto the board we then

plate a thin layer of tin. This we will use in the next step of the process when we etch off

the unwanted copper foil. When plating is completed the flight of panels is returned to the

operator and he unloads and stacks the plated panels. He then uses non-destructive testing

to check a sample of each flight to ensure that the copper and tin plating is the correct

thickness.

Fig 3.2.1.10.2: Tin plated Panel

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3.2.1.11 Etch outer layers

We have now plated the panel with 25 microns of copper through the hole and an

additional 25 30 microns on the tracks and pads. The copper is covered with a thin layer

of tin as an etch resist. Now we will remove the unwanted copper foil from the surface.

We do this on a single continuous process line. The first step is to dissolve and wash off

the resist which covers the unwanted copper.

Fig 3.2.1.11.1: Etched Outer Layers

Then we remove the unwanted copper using a powerful alkaline solution to etch away the

exposed copper. The process is carefully controlled to ensure that as we etch down we

dont etch sideways as well. This means that the finished conductor widths are exactly as

designed. But designers should be aware that thicker copper foils need wider spaces

between the tracks.

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 Fig 3.2.1.11.2: Removed the unwanted
parts
Finally we strip off the thin tin coating which protected the copper image. So now you

can see that only designed copper pattern remains. As the boards emerge from the line

they are stacked automatically.

Fig3.2.1.11.3: Designed copper pattern

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3.2.1.12 Apply Soldermask

Most boards have a epoxy-ink soldermask printed onto each side to protect the

copper surface and prevent solder shorting between components during assembly. The

panels are first cleaned and brushed to remove any surface tarnish and then are

conveyored into the yellow room. Each panel is given a final clean to remove any dust

from the surface and loaded into the vertical coater. The coating machine simultaneously

covers both sides of the panel with the epoxy soldermask ink. The double action ensures

that the ink completely encapsulates the copper tracking, typically now 35 40 microns

higher than the surface of the panel.

Fig 3.2.1.12.1: Panel Applied with

soldermask

The panels are now racked and put through a conveyorised drier which hardens the resist

just enough to allow it to be printed . The operator checks for a complete and even

coating. Next the coated panels are imaged. For this we use a two drawer UV

printer. The operator mounts the phototool films on the machine and then places the panel

onto the registration pins. She checks that the film and the copper layer are precisely

aligned. Mask alignment will be better than 50 microns. As with the etch and plating

resists used earlier in the process, the UV lamps in the machine harden the ink where the
32
film is clear, that is where we need soldermask on the finished board. The imaged panels

are put on a conveyor out of the clean room and into the developer which strips off the

unhardened and unwanted resist. Later the required resist will be further hardened or

cured to provide a robust and permanent coat. For this we use a conveyorised oven in

the same way in which the boards were previously tack-dried. But first the operator

checks the alignment of the soldermask on the panel and makes sure that there are no

traces of ink on the pads or through the holes. Even slight traces will compromise the

solderability of the finished PCB.

Fig 3.2.1.12.2: Stripped the unwanted resist and unhardened parts

RoHS-compliant surface finishes electroless gold over nickel.

The copper component pads and holes have been left clear of soldermask. Now we apply a

solderable surface finish to protect the copper until the components are soldered onto the

board. On this line we chemically deposit first nickel onto the copper and then a thin

coating of gold over the nickel. This is a chemical process needing no electrical

connections. The line is fully automated, moving the panels through a series of tanks

33
which clean and sensitive the copper surface and then deposit about 5 microns of nickel

and a tenth of a micron of gold.

Fig 3.2.1.12.3: ENIG Finished panel

3.2.1.13 Plated gold edge connectors

For edge-connectors we electroplate hard gold. First the operator puts protective

tape on the board above the connectors. Then he mounts the panel on a horizontal

electroplating bath. Electroplated gold is needed for edge connectors on printed circuit

boards which will require repeated insertion and removal.. Electroless gold gives good

solderability but is too soft to withstand repeated abrasion. For this you require a hard

electroplated gold. For edge connectors we electro-plate 1 1.5 microns of gold over 4

5 microns of plated nickel. So if your PCB will be repeatedly inserted into a connector,

you should specify hard gold plate on the edge connectors. When the edge connectors

have been plated we will remove the tape.

34
3.2.1.14 Silk-screen and cure

Today we use ink-jet printers to image the legends direct from the board digital

data. Like a conventional paper printer the ink-jet printer sprays minute droplets of ink

onto the panel to generate the image. If a legend is needed on the second side the ink is

tack-dried on a conveyorised heater and the printing process is repeated. Ink-jet printing

needs no set-up. Previously we lost time preparing and cleaning silk-screens for each

legend printing. That is why the legend is often called the silk-screen.

Fig3.2.1.14: Preparing and cleaning silk screen

3.2.1.15 Electrical Test

At the end of the PCB production process we electrically test every multilayer

PCB against the original board data. Using a flying probe tester we check each net to

ensure that it is complete (no open circuits) and does not short to any other net. The flying

probe testers in our quality control department are easy to set up as they dont need a test

fixture but testing every net is slow. A faster test method is the Acceler8. This uses 4000

tiny probes like a brush. It builds an electronic map of the PCB from a pre-tested

35
good board. Then it compares each board to be tested with its map. This cuts test times

by 90%.

3.2.1.16 Profiling. V-cut scoring

The final manufacturing stage is to profile the PCBs and cut them out of the

production panel. For this we use a computer-controlled milling machine or

router. First the machine mills out any small slots or internal cut-outs. The cutter

follows the path defined in the original tool file. Next the milling head automatically

picks up a 2 mm cutter, checks the diameter and mills around each PCB. The brush

around the milling head ensures that all the dust produced is collected by the vacuum

system. The circuits are held in place by small bridges of material. We will drill through

these and then remove each separate PCB from the production panel. This panel has also

been V-scored.

3.2.1.17 Final inspection

In the last step of the process (Final inspection - quality control ) a team of sharp-

eyed inspectors give each PCB a final careful check-over. Here an inspector checks a

customers assembly panel. She looks for any cosmetic defects like scratches. Then she

measures the panel against the mechanical drawing, checking hole diameters with a

tapered probe. After inspection the PCBs are vacuum-sealed to keep out dirt and

moisture. Then they are bubble-wrapped, securely boxed, sealed and shipped off to the

customers. The process is complete.

36
3.2.2 Process of developing PCB

After making our own PCB, We want to push the boundries of technology by

developing the insulating substrates of PCB using nanoclay/carbon nanotube filled

polycarbonate nanocomposite

Fig 3.2.2: Process of Developing PCB

37
A RPC-MMT substrate with loading concentration of 1% and 5% of MMT and RPC-

MMT-CNT substrate with loading concentration of 5% MMT for both 0.50% and 2% of

CNT is. The reference material paper reinforced phenolic resin (PP) was purchased at

Alexan Manila, Philippines. The fabricated RPC-MMT, RPC-MMT-CNT and the

purchased PP substrate was sliced in a dimension required for the test as needed. The

substrates together with the reference substrate (PP) were subjected into various

characterization techniques to determine its physical, mechanical, electrical and thermal

properties. The substrates are bonded with Electrodeposited Copper (ED) foil at one side

to produce a Single-sided (SS) PCB. The fabricated SSPCB underwent spectral analysis

and EDX on its cross sectional area to determine the atom percentage on each PCB.

38
 3.3 Material Balance

2 Shifts (200/ shift) 8 hrs. / shift

Preparing Phototools Photosensitive Film

Epoxy Resin
Print Inner Layers Glass Fibre
Copper Foil

Unwanted Copper
Etch Inner Layers
Removed

Epoxy Resin
Lay-up and Bond Glass Fibre
Copper Foil

Unwanted Copper Etch outer Layers

Removed

Apply Soldermask Soldermask

Finish Product
(200 pcs)

39
3.4 Machinery And Equipment

3.4.1Machinery and equipment in making PCB

3.4.1.1 Laser Photoplotters

This will be used in a temperature and humidity-controlled darkroom to make films that
will be used to image the PCB.

Price : 470, 000 pesos

Maximum film size250 mm x 380 mm

( 9.8 inch x 15 inch )

Plotting speed7 mm ( inch ) of film width/min

For 2032 x 25000 dpi resolutionSource of lightLaser diode 670 nm (red)Reads inGerber

(RS 274D, RS 274 X) Hi Res BMP Bitmap

Extended Gerber

All files can be transferred via the USB port from a PC or directly via a USB memory

stick in conjunction with the touch screen control panel on the PhotoplotterPhotoplotter

Dimensions580 mm (22.8 inch) length 340 mm (13.4 inch) width

200 mm ( 7.9 inch) heightPhotoplotter weightapprox. 20 kg ( 44 lbs )Power

Fig 1: Laser Photoplotters

40
3.4.1.2 Automatic Optical Punch System

This will be used to punch the registration holes that will be used to align inner and

outer layers

Price : 1,000,000 pesos

Complete, fully-contained, self-standing unit.

Full gantry configuration (i.e. the camera moves over the parts; the parts
themselves do not move).
Available with high-speed 240 VAC servomotor motion system.
Available in a wide range of travels, short and long.
Available with application-specific camera / optics / illumination module.
Available with a resolution as fine as 0.1 micron.
Optional LASER module for laser profiling is also available.
Easy to use, easy to program, fully automated inspection system.
Inspection and measurement programs (i.e. "recipes") are easily created and
modified using intuitive Graphical User Interface. Programs can be saved to disk
and read-in later on.

Fig 1: Automatic Optical Punch System

41
3.4.1.3 X-ray Drill

This will be used to drill the PCB for leaded components

Price : 850, 000 pesos

Fig 1: X-ray Drill

42
3.4.1.4 Ink Jet Printer

This will be used to image the outer layers of the PCB

Price : 280,000 pesos

Detailed parameters
Print head type MIDI + type (70u)
Nominal character range Up to 16 dot
Number of line 1 to 2 line
Max.Message length Up to 1055 characters
Max.Speed 6.25m/s
Max.Printing character per second
Up to 1482 characters

Cabinet dimensionsL*W*H 585mm*455mm*290mm*

Print head size 42mm*188mm
Weight 23kg

Fig 1: 4 Ink Jet Printer

43
3.4.1.5 Flying probe tester

This will be used for the electrical test

Price : 1,000,000 pesos

Number of Arms 4 (L, ML, MR, R)

Number of test steps of test steps 40,000 (max.)

Measurement ranges Resistance: 400 to 40 M

Capacitance: 1 pF to 400 mF
Inductance: 1 H to 100 H
Diode VZ measurement: 0 to 25 V
Zener diode VZ measurement: 0 to 25 V, 25 to
80 V (optional feature)
Digital transistors: 0 to 25 V
Photo couplers: 0 to 25 V
Short: 0.4 to 400 k
Open: 4 to 40 M
DC voltage measurement: 0 to 25 V
Measurement time Max. 0.025 sec./step
Probing precision Within 100 m for each arm (X and Y
directions)
Positioning repeatability Within 50 m (probing positions)
Inter-probe pitch Min. 0.2 mm
Min. 0.5 mm (when using 4-terminal probes)
Testable board dimensions 510 mm (20.08 in) W 460 mm (18.11 in) D

Fig 1: 4 Flying probe tester

44
3.4.1.6 V-cut machine

This will be used to cut the pcb out of the production panel

Price : 500,000 pesos

Model YSVC-1
PCB Cutting Length (mm) 330
Cutting Speed (mm/s) 0~400
Cutting Thickness (mm) 1.0~3.5
Power Supply (V) 110/220
Size (mm) 420*280*400
Weight (Kg) 20/40
Guarantee (Year) 1
Delivery (Day) 1
Ability (Set) 1000

Fig 1: 4 V-cut machine

45
3.4.2 Machinery and equipment in developing PCB

3.4.2.1 Thermo Noran Sytem Six Energy Dispersive X-ray Spectrometer (EDX)

This will be used for the structural and elemental analysis. The spectral imaging will be

used to illustrate how will be the distribution of elements on each substrate. The EDX

will be used to show the percentage of the elements on the given specimens

Price : 4,000,00 pesos

Traditional X-ray Microanalysis

Spectral Imaging
COMPASS Automated Statistical Analysis
XPhase Distribution Software
Spectral Match

46
3.4.2.1 XE 100 AFM
Fig 1: Thermo Noran Sytem Six Energy Dispersive X-ray Spectrometer (EDX)
The XE 100 AFM will be used for the topographical analysis. An atomic force

microscopy will be used on the smoothest possible region to determine the surface

roughness of the specimen. AFM will be used to investigate the influence of filler

loading concentration to the average roughness and root mean square roughness of the

substrate specimen.

Price : 1,700,00 pesos

Fig 1: XE 100 AFM

47
3.4.2.3 Universal Testing Machine (UTM)

The Universal Testing Machine will be used for the tensile test. A hydraulic type of

UTM will be used to verify the tensile strength of the formulated substrate with the

reference PP substrate.

Price : 7,500,000

Model HUT305B
Capacity (kN) 300
Calibration accuracy Class 1 / Class 0.5
Force accuracy Better than 1%/0.5%
Force range 1%100%FS
Extension range 1%-100%FS
Extension accuracy Better than 1%/0.5%
Extension resolution 1/350000 of max extension
Actuator (piston) speed (mm/min) 0-180
Force loading speed 0.02%-2% FS /s

Fig 1: Universal Testing Machine (UTM)

48
3.4.2.4 MKS Izod Impact Testing Machine

It will be used for the impact test. It will be used to determine the resistance to the

impact load.

Price: 3,000,000

The highly strained & wearing parts like support blocks & strikers are of special alloy
steels duly heat treated.

Safety guard for the user is provided.

Initial potential energy for Charpy is 300 Joules & for Izod is 170 Joules with a Least
Count of 2 Joules (for Analogue models) & resolution of 0.5 Joules (for Digital Model).

Drop Angle of Pendulum for Charpy is 140 Deg. & for Izod is 90 Deg.

ASTM Impact Testing machine is also provided, which conforms to E-23 ASTM
standard.

Gauges, Tongs, Sub-zero bath, T

Fig 1: MKS Izod Impact Testing Machine

49
3.4.2.5 Mitutoyo AR-10 hardness tester

It will be used for the Rockwell hardness test. It will be used to determine the hardness

of the substrates.

Price : 1,000,000 pesos

DESCRIPTION:

RockwellHardness Tester

Force range 10kg(98.07N)

Dial display

Test force 60kgf/ 100kgf/ 150kgf

Test force is selected by weight exchange

Load duration 3-5.5s

Minimum reading 0.5

Maximum speciman height 140mm(5.51)

Fig 1: Mitutoyo AR-10 hardness tester

50
3.4.2.6 Digital LCR Meter

This will be used in determining the electrical properties. It will be used to measure the

Dissipation factor together with the capacitance of the substrates.

Price : 5,000 pesos

Display: 3-1/2 Digital 1999 Counts Backlit LCD

Low Battery and Overload Indication
Confirms to IEC1010 Standards
Auto Power Off
DC Voltage : 0 - 200mV/2V/20V/200V/1000V
Accuracy : 0.5%
AC Voltage : 0 - 200mV/2V/20V/200V/750V
Accuracy : 0.8%
DC Current : 0 - 2mA/20mA/200mA/20A.
Accuracy : 0.8%
AC Current : 0 - 2mA/20mA/200mA/20A.
Accuracy : 1.0%
Resistance : 0 - 200/2k/20k/200k/2M/20M/2000M.Ohms
Accuracy : 0.8%
Capacitance : 0 - 20nF/200nF/2uF/20uF/200uF
Accuracy : 2.5%
Frequency : 0 - 2k/20k/200k/2M/10MHz
Accuracy : 1.0%
Inductance : 0 - 2m/20m/200m/2/20H
Accuracy : 2.5%
Temperature : -40C~+1000C
Accuracy : 1.0%

Fig 1: Digital LCR Meter

51
3.4.2.7 2940 TMA of TA Instrument

This will be used in determining the thermal properties. It will be used to obtain the

CTE. CTE describes the property of materials to expand as they are being heated

Price : 4,000,000 pesos

Temperature Range (max) -150 to 1,000 C

Temperature Precision 1C
Furnace Cool Down Time(air cooling) <10 min from 600 C to 50C
Maximum Sample Size solid 26 mm (L) x 10 mm (D)
Maximum Sample Size film/fiber Static
26 mm (L) x 1.0 mm (T) x 4.7 mm (W)
Operation
Dynamic Operation (Q400 EM only) 26 mm (1.) x .35 mm (T) x 4.7 mm (W)
Measurement Precision 0.1%
Sensitivity 15 nm
Displacement Resolution <0.5 nm
Dynamic Baseline Drift <1m (-100 to 500 C)
Force Range 0.001 to 2 N
Force Resolution 0.001 N
Frequency (Q400 EM only) 0.01 to 2 Hz
Mass Flow Control Included
Atmosphere static or controlled flow Inert Oxidizing or Reactive Gases

Fig 1: 2940 TMA of TA Instrument

52
3.5 Material Handling

3.5.1 Storage of Raw Materials

Raw materials will be directly transferred from the loading dock to the material

storage room immediately after delivery. In the storage facility, the material will

be organized and labelled according to their date of delivery. The binding

materials will be kept at a temperature less than 23C [73F] and will be stored in

sealed bags or Moisture Barrier Bags (MBB) to prevent moisture condensation.

There will be a department that will monitor the inventory of raw materials and

make a weekly report of the input and output of the companys resources.

3.5.2 Storage of Product

PCB product will be stored in a temperature of 20C to 25C and in an airtight

packaging because the materials used in PCB are hygroscopic and tend to absorb

moisture in the air. The PCB product will be stored in a separate storage facility

other than the storage facility where the raw materials are stored. There will be

another department that will monitor the Final product and they will organize and

put label according to the manufacturing date, PCB should not be stored longer

than 1 year. PCB that has been stored longer than 1 year will be disposed.

3.5.3 Shipping

The product will be packed at an air tight packaging to avoid moisture absorption

with moisture barriers. The package will include desiccants to absorb the moisture,

humidity indicator to provide a visual indication on the level of moisture present

53
 inside the packaging, and shipping documentation such as a certificate of analysis

and material safety data sheet for transparency.

3.6 Quality Control

3.6.1 Incoming Quality Control (IQC)

In IQC or Incoming Quality Control is the process of controlling quality of

the materials and parts for manufacturing a product before production

begins. This will include the inspection of the supplier quality records and

perform a visual and functional inspection of the materials before production

3.6.2 Automated Optical Inspection (AOI)

AOI, automatic optical inspection systems use visual methods to monitor printed

circuit boards for defects. They are able to detect a variety of surface feature

defects such as nodules, scratches and stains as well as the more familiar

dimensional defects such as open circuits, shorts and thinning of the solder. They

can also detect incorrect components, missing components and incorrectly placed

components. As such they are able to perform all the visual checks performed

previously by manual operators, and far more swiftly and accurately.

Soldering Defects

Components Defects

3.6.3 Flying Probe Test

Flying probe testing uses electro-mechanically controlled probes to access

components on printed circuit assemblies (PCAs). Commonly used for test of

analog components, analog signature analysis, and short/open circuits.

54
Unlike ICT, no costly test fixtures are needed. This eliminates enormous cost

programming time and allows design changes with simple test program changes.

Connector testing

Reverse Engineering

Substrate testing

Load Board testing

Fault Injection

Copper plating measurement

3.6.4 Random Laminate Tg and Td Verification

99% of all PCB customers dont have the ability to test the base laminate to make

sure that it is what they want, which means that they dont find out that the

material is wrong until they have populated the parts. Because of this, four times a

month LFL PCB will choose a random job and send samples to a third party

laboratory to confirm that Tg and Td values of the laminate that we specified for

production has been supplied.

55
3.7 Environmental health and safety

3.7 Material Safety Data Sheet

3.7.1 Carbon Nano tube

Carbon nanotubes are a modern and extremely light material that can add
desirable properties to many industrial products, but they may be a health
hazard. Extremely small fibers such as carbon nanotubes can make their
way far into the lungs which can cause pulmonary effects including
inflammation, granulomas, pulmonary fibrosis and in the worst case it can
present an increased risk of developing cancer

Occupational exposures that could potentially allow the inhalation

of CNT is of the greatest concern, especially in situations where the CNT
is handled in powder form which can easily be aerosolized and inhaled.
Also of concern are any high-energy processes that are applied to various
CNT preparations such as the mixing or sonication of CNT in liquids as
well as processes that cut or drill into CNT based composites in
downstream products. These types of high-energy processes will
aerosolize CNT which can then be inhaled.

As of today several international agencies suggest the Hierarchy of

Hazard Control which is a system used in industry to minimize or
eliminate exposures to hazards. The hazard controls in the hierarchy are as
follows (in decreasing effectiveness):

- Elimination
- Substitution
- Engineering Controls
- Administrative Controls
- Personal Protective Equipments

56
Material Safety Data Sheet

PRODUCT NAME: Carbon Nanotube

Physical Data

Solubility in Water: Insoluble

Appearance/ Odor: Dark granular solid; odorless

Toxicity/Health Hazards

No Toxicity Data Available

Eye Contact: Dust may cause irritation.

Inhalation: Dust causes irritation and is possibly allergenic.

First Aid:

Contamination of the eyes should be treated by immediate and prolonged irrigation with copious
amounts of water. In case of contact, immediately wash skin with soap and copious amounts of water. If
inhaled, remove to fresh air. If not breathing give artificial respiration. If breathing is difficult, give
oxygen. If swallowed, wash out mouth with water provided person is conscious. Call a physician. Wash
Contaminated clothing before reuse.

Fire and Explosion Hazard Data

Extinguishing Media:

Dioxide, Dry Chemical Powder, Polymer Foam, Water Spray

Special Firefighting Procedures:

Use normal procedures which include wearing self-contained breathing apparatus and protective
clothing to prevent contact with skin and eyes.

Unusual Fire and Explosion Hazards:

This material, like most materials in powder form, is capable of creating a dust explosion.

Reactivity Data

Incompatibilities:

Strong Oxidizing Agents

Hazardous Combustion or Decomposition Products Toxic Fumes of: Carbon monoxide, Carbon dioxide

57
Spill or Leak Procedures

Steps to be taken if material is released or spilled: Wear respirator, chemical safety goggles, rubber
boots and gloves. Sweep up, place in a bag and hold for waste disposal. Avoid raising dust. Ventilate
area and wash spill site after material pickup is complete.

Waste Disposal Method:

Dissolve or mix the material with a combustible solvent and burn in a chemical incinerator, equipped
with an afterburner and scrubber.

Handling and Storage

Chemical Safety Goggles. Compatible Chemical-resistant Gloves. NIOSH/MSHA approved respirator.

Safety Shower and Eye Bath. Mechanical Exhaust Required. Do Not Breathe dust. Avoid contact with
eyes, skin an clothing. Wash thoroughly after handling. Irritating dust. Keep tightly closed. Store in a cool
dry place.

58
PRODUCT NAME: Epoxy Resin

CHEMICAL NAME: Bisphenol A based epoxy resin.

PRIMARY ROUTE(S) OF ENTRY: Skin contact.

HAZARD IDENTIFICATION

POTENTIAL HEALTH EFFECTS:

ACUTE INHALATION: If product is heated, vapors generated can cause headache, nausea, dizziness and
possible respiratory irritation if inhaled in high concentrations.

CHRONIC INHALATION: Repeated exposure to high vapor concentrations may cause irritation of pre-
existing lung allergies and increase the chance of developing allergy symptoms to this product.

ACUTE SKIN CONTACT: May cause allergic skin response in certain individuals. May cause moderate
irritation to the skin such as redness and itching.

CHRONIC SKIN CONTACT: May cause sensitization in susceptible individuals. May cause moderate
irritation to the skin.

EYE CONTACT: May cause irritation.

INGESTION: Low acute oral toxicity.

SYMPTOMS OF OVEREXPOSURE: . Possible sensitization and subsequent allergic reactions usually seen
as redness and rashes.

MEDICAL CONDITIONS AGGRAVATED BY EXPOSURE: . Pre-existing skin and respiratory disorders may
be aggravated by exposure to this product. Pre-existing lung and skin allergies may increase the chance
of developing allergic symptoms to this product.

FIRST AID MEASURES

FIRST AID FOR EYES: Flush immediately with water for at least 15 minutes. Consult a physician

FIRST AID FOR SKIN: Remove contaminated clothing. Wipe excess from skin. Apply waterless skin
cleaner and then wash with soap and water. Consult a physician if effects occur.

FIRST AID FOR INHALATION: Remove to fresh air if effects occur.

FIRST AID FOR INGESTION: No acute adverse health effects expected from amounts ingested under
normal conditions of use. Seek medical attention if a significant amount is ingested.

FIRE FIGHTING MEASURES

59
FLASH POINT: >200F (Tag Closed Cup)

EXTINGUISHING MEDIA: Foam, carbon dioxide (CO2), dry chemical.

SPECIAL FIRE FIGHTING PROCEDURES: Wear a self-contained breathing apparatus and complete full-
body personal protective equipment. Closed containers may rupture (due to buildup of pressure) when
exposed to extreme heat.

FIRE AND EXPLOSION HAZARDS: During a fire, smoke may contain the original materials in addition to
combustion products of varying composition which may be toxic and/or irritating. Combustion products
may include, but are not limited to: phenolics, carbon monoxide, carbon dioxide.

ACCIDENTAL RELEASE MEASURES

SPILL OR LEAK PROCEDURES: Stop leak without additional risk. Dike and absorb with inert material (e.g.,
sand) and collect in a suitable, closed container. Warm, soapy water or non-flammable, safe solvent may
be used to clean residual.

HANDLING AND STORAGE

STORAGE TEMPERATURE (min./max.): 40F (4C) / 120F (49C)

STORAGE: Store in cool, dry place. Store in tightly sealed containers to prevent moisture absorption and
loss of volatiles. Excessive heat over long periods of time will degrade the resin.

HANDLING PRECAUTIONS: Avoid prolonged or repeated skin contact. Wash thoroughly after handling.
Launder contaminated clothing before reuse. Avoid inhalation of vapors from heated product.
Precautionary steps should be taken when curing product in large quantities. When mixed with epoxy
curing agents this product causes an exothermic, which in large masses, can produce enough heat to
damage or ignite surrounding materials and emit fumes and vapors that vary widely in composition and
toxicity.

EXPOSURE CONTROLS/PERSONAL PROTECTION

EYE PROTECTION GUIDELINES: Safety glasses with side shields or chemical splash goggles.

SKIN PROTECTION GUIDELINES: Wear liquid-proof, chemical resistant gloves (nitrile-butyl rubber,
neoprene, butyl rubber or natural rubber) and full body-covering clothing.

RESPIRATORY/VENTILATION GUIDELINES: ... Good room ventilation is usually adequate for most
operations. Wear a NIOSH/MSHA approved respirator with an organic vapor cartridge whenever
exposure to vapor in concentrations above applicable limits is likely.

ADDITIONAL PROTECTIVE MEASURES: Practice good caution and personal cleanliness to avoid skin and
eye contact. Avoid skin contact when removing gloves and other protective equipment. Wash
thoroughly after handling. Generally speaking, working cleanly and following basic precautionary

60
measures will greatly minimize the potential for harmful exposure to this product under normal use
conditions.

OCCUPATIONAL EXPOSURE LIMITS: Not established for product as whole. Refer to OSHAs Permissible
Exposure Level (PEL) or the ACGIH Guidelines for information on specific ingredients.

61
PRODUCT NAME: FIBRE GLASS

HAZARD IDENTIFICATION

APPEARANCE AND ODOR: White/off-white colored solid with no odor.

PRIMARY ROUTE(S) OF EXPOSURE: inhalation, skin, eye

POTENTIAL HEALTH EFFECTS

ACUTE (SHORT TERM) : Fiber glass continuous filament is a mechanical irritant. Breathing dusts and
fibers may cause short term irritation of the mouth, nose and throat. Skin contact with dust and fibers
may cause itching and short term irritation. Eye contact with dust and fibers may cause short term
mechanical irritation. Ingestion may cause short term mechanical irritation of the stomach and
intestines.

CHRONIC (LONG TERM): There is no known health effects connected with long term use or contact with
this product

MEDICAL CONDITIONS AGGRAVATED BY EXPOSURE: Long term breathing or skin conditions that are
aggravated by mechanical irritants may be at a higher risk for worsening from use or contact with this
product.

FIRST AID MEASURES

INHALATION: Move person to fresh air. Seek medical attention if irritation persists.

EYE CONTACT: Flush eyes with running water for at least 15 minutes. Seek medical attention if irritation
persists.

SKIN CONTACT: Wash with mild soap and running water. Use a washcloth to help remove fibers. To
avoid more irritation, do not rub or scratch affected areas. Rubbing or scratching may force fibers into
skin. Seek medical attention if irritation persists.

INGESTION: Ingestion of this material is unlikely. If it does occur, watch the person for several days to
make sure that intestinal blockage does not occur.

FIRE FIGHTING MEASURES

FLASH POINT AND METHOD: None

FLAMMABILITY LIMITS: None

AUTO IGNITION TEMPERATURE: Not Applicable

EXTINGUISHING MEDIA: Water, foam, CO2 or dry chemical.

UNUSUAL FIRE AND EXPLOSION HAZARDS: None known.

62
FIRE FIGHTING INSTRUCTIONS: Use self contained breathing apparatus (SCBA) in a sustained fire.

HAZARDOUS COMBUSTION PRODUCTS: Primary combustion products are carbon monoxide, carbon
dioxide and water. Other undetermined compounds could be released in small quantities.

ACCEDENTAL RELEASE MEASURES

LAND SPILL: Scoop up material and put into suitable container for disposal as a nonhazardous waste.

WATER SPILL: This material will sink and disperse along the bottom of waterways and ponds. It can not
easily be removed after it is waterborne; however, the material is non-hazardous in water.

AIR RELEASE: This material will settle out of the air. If concentrated on land it can then be scooped up
for disposal as a non-hazardous waste.

HANDLING AND STORAGE

STORAGE TEMPERATURE: Not applicable.

STORAGE PRESSURE: Not applicable.

GENERAL: No special storage or handling procedures are required for this material.

EXPOSURE CONTROLS AND PERSONAL PROTECTION

VENTILATION: General dilution ventilation and/or local exhaust ventilation should be provided as
necessary to maintain exposures below regulatory limits.

RESPIRATORY PROTECTION: A properly fitted NIOSH/MSHA approved disposable dust respirator such as
the 3M model 8210 (or 8710) or model 9900 (in high humidity environments) or equivalent should be
used when: high dust levels are encountered; the level of glass fibers in the air exceeds the OSHA
permissible limits; or if irritation occurs. Use respiratory protection in accordance with your company's
respiratory protection program, local regulations and OSHA regulations under 29 CFR 1910.134.

SKIN PROTECTION: Loose fitting long sleeved shirt that covers to the base of the neck, long pants and
gloves. Skin irritation is known to occur chiefly at pressure points such as around neck, wrist, waist and
between fingers.

EYE PROTECTION: Safety glasses or goggles

63
PRODUCT NAME: Copper Foil

HAZARD IDENTIFICATION

EMERGENCY OVERVIEW: Edges may be sharp. The use of protective gloves is recommended

FIRST AID MEASURES

INHALATION: No specific treatment is necessary since this material is not likely to be hazardous by
inhalation. If exposed to excessive levels of dust, remove to fresh air and get medical attention if cough
or other symptoms develop.

FIRE FIGHTING MEASURES

COMMENTS: Material is a metal and noncombustible.

ACCIDENTAL RELEASE MEASURES

COMMENTS: N/A

HANDLING AND STORAGE

GENERAL PROCEDURE: The use of gloves is recommended.

EXPOSURE CONDITIONS/PERSONAL PROTECTION

ENGINEERING CONTROLS: If user operations generate dust, use ventilation to keep exposure to
airborne contaminants below the exposure limit.

PERSONAL PROTECTION: Breathing of copper dust should be avoided. Use a NIOSH approved dust
mask.

64
 CHAPTER 4

Plant Site

4.1 Site Location

4.1.1 Geography

The City of Batangas is a coastal city lying in a cove-like shape at the south-eastern

portion of Batangas Provinceand geographically situated at coordinates 13 degrees, 45

minutes and 25.96 seconds north latitude and 121 degrees, 3 minutes and 29.2 seconds

east longitude. It is bounded on the northwest by the municipality of San Pascual; on the

north by the municipality of San Jose; on the east by the municipalities of Ibaan, Taysan

and Lobo; and on the south by the Batangas Bay.

Figure. Location of Plant site in Brgy. Balagtas, Batangas City.

65
4.1.2 Climate

Batangas City is generally coolest during the months of December to January with

temperature ranging from 22C to 26C The mean temperature rises and attains a

maximum of 36 degrees Celsius (36C) in May. The month of October marks the steady

fall of temperature. The months from October to December are not characterized by dry

weather as compared to the months from January to April. This is partly due to the fact

that typhoons and depressions most frequently affect the city during the months from July

to December.

4.1.3 Economic Data

The City`s total assets, liabilities government equity, income and expenses for CY 2014

compared with that of 2013 as follows

CY 2014 CY 2013 Increase (Decrease)

Total Assets 3,859,483,100 4,552,986,111 (693,503,011)

Total Liabilities 542,345,563 1,286,985,399 (744,639,836)

Total Equity 3,317,137,537 3,266,000,712 51,136,825

Total Income 1,813,300,725 1,747,767,652 65,533,073

Total Expenses 1,676,164,015 1,699,365,316 (23,201,301)

Income class: First Class City

Number of Registered Business Establishments: 7,144 as of 2015

66
4.2 Plant Layout

2 1

4 5 6

The propose design of the plant will be 1.3 hectares and will contain 6 buildings as

shown in figure. The propose plant will have an office building. The Office building

contains the Sales department, the Human resources department, Information and

technology department, and will have a security office. The plant will also have its own

research facility for the development of the PCB, The propose plant will have two storage

facilities, one for the raw materials and one for the finish product, Both storage facilities

will have its own loading dock for loading and unloading of deliveries.. The plant will

also have a canteen; the canteen will have a kitchen and comfort room. The Production

building is where the production will be conducted. There will be a clinic in the said

building.

67
4.2.1 Main Building (315.43 m)

Main Office CR
Security
Marketing IT
Office

Conference Room

HR

Accounting

Room Dimensions (by width, length and height)

Rooms Dimensions

Security Office
6m x 3m x 6m

IT Department 6m x 4m x 6m

Marketing Department 6m x 5m x 6m

Accounting 3m x 8m x 6m

HR 3m x 8m x 6m

Conference Room 3m x 8m x 6m

Main Office 3.2m x 8m x 6m

CR 2m x 5m x 6m

68
4.2.2 Research and Maintenance Building (1092. 07 m)

Research
Quality Control Department
Department
Locker
Research
Facility
Maintenance
CR Department

Room Dimensions (by width, length and height)

Rooms Dimensions

Locker
5.06m x 11.32m x 6m

CR 5.06m x 6.02m x 6m

Quality Control Department 19.8m x 7.55m x 6m

4.2.3 Production Building (1408.72 m)

CR Clinic

Testing
Department

Shop
Production
Department

Room Dimensions (by width, length and height)

Rooms Dimensions

Testing Department 7.2m x 9.2m x 6m

69
 CR 3.3m x 5.14m x 6m
Quality Control Department 14.13m x 5.14 x 6m
Production Department 14.8m x 10.9m x 6m
Shop 47.38m x 22.63m x 12m

4.2.4 Warehouse for Finish Product (450.34 m)

Storage Space

Loading Dock

Room Dimensions (by width, length and height)

Rooms Dimensions

Loading Dock 19.7m x 5.02m x 8m

Storage Space 19.7m x 17.5m x 8m

4.2.5 Warehouse for raw Materials(455.67 m)

Storage
for
Binding Storage Space
Materials

Loading Dock

70
 Room Dimensions (by width, length and height)
Rooms Dimensions

Storage for Binding Materials 7.23m x 15.11 x 8m

Loading Dock 19.53m x 5m x 8m

4.2.6 Canteen (590.26 m)

CR

Kitchen

Room Dimensions (by width, length and height)

Rooms Dimensions

Kitchen 7.1m x 11.8 x 6m

CR 6.2m x 2m x 6m

Dining Area 25m x 17.8m x 6m

71
 Chapter 5

Financial Analysis

Manpower and Labor Requirements

Plant Operations Organizational Chart & Functional Responsibilities

Chief Executive
Officer

Information
Technology
Services

Director of Director of Plant Director

Administrative and Operations Enviromental
Financial Services (General Manager) Health & Safety

Direct Environmental
Sales Finance Production Research and Compliances
Human Manager Developement
Manager Manager Engineer
Resources

Production Occupational
Demand Financial Human Health & Safety
Forecaster assistant Resources Supervisors Specialist
Services

Accounting Security Quality

Clerks Services Assurance

Food Process
Services Workers

Building and Maintenance

Facility Workers
Maintenance

Procurement
Personnel

Warehouse Delivery and

Workers Shipping

72
Table 5.1 Raw Material Costings

(Philippine Peso, PhP)

Amount of Total cost Amount of Total cost
Price
Item material/substance per month material/substance per year
($)
per month (PhP) per year (PhP)
99.73
Epoxy
per 240 gallons 1,196,760 2,880 gallons 14,361,120
Resin
gallon
Fibre 5 per
2,160 m 540,000 25,920 m 6,480,000
Glass m
Copper 4.96per
960 kg 238,080 11,520 kg 2,856,960
Foil kg
Photosensi 20 per 4,080 per 200 cm x 30 48,960 per 200 cm x
4,080,000 48,960,000
tive Film 200x30 cm 30 cm
Fibre
6.6 per 11,520 pcs per 10
Glass 960 per 10 yds 316,800 3,801,600
10 yds yds
Cloth
4.96
Solder
per 100 2400 per 100g 595,200 28,800 per 100g 7,142,400
Mask
g
TOTAL 6,966,840 83,602,080
*$ 1.00 = PhP 50

73
Table 5.2 Labor Requirements

SALARIES and WAGES (Assumption: Fringe = 20% per month)

Group
Individual Grouped
Monthly Fringe Total
Total Monthly
Department Position Quantity Salary Benefits Yearly
Monthly Salary
(PHP) (PHP) Salary
Salary (PHP)
(PHP)
CEO/President 1 100,000 20,000 120,000 120,000 1,440,000
Administrative
Secretary 1 25,000 5,000 30,000 30,000 360,000
Safety Manager 1 70,000 14,000 84,000 84,000 1,008,000
Environmental Compliance
1 45,000 9,000 54,000 54,000 648,000
Health and Specialist
Safety Doctor 2 45,000 9,000 54,000 108,000 1,296,000
Nurse 4 18,000 3,600 21,600 86,400 1,036,800
Information
IT 4 18,000 3,600 21,600 86,400 1,036,800
Technology

Plant(General)
1 90,000 18,000 108,000 108,000 1,296,000
Manager

Production
2 60,000 12,000 72000 144,000 1,728,000
Manager

Production
4 25,000 5,000 30,000 120,000 1,440,000
Supervisor

Procurement
2 12,000 2,400 14,400 28,800 345,600
Personnel
Process
18 12,000 2,400 14,400 259,200 3,110,400
Workers

Maintenance/
8 12,000 2,400 14,400 115,200 1,382,400
Skilled Worker
Plant
Operations Warehouse
2 8,000 1,600 9,600 19,200 230,400
Keeper
Delivery and
2 8,000 1,600 9,600 19,200 230,400
Shipping
Quality
4 12,000 2,400 14,400 57,600 691,200
assurance
R&D Leader 2 45,000 9,000 54,000 108,000 1,296,000

R&D Members 6 18,000 3,600 21,600 129,600 1,555,200

74
 Chief Manager 1 90,000 18,000 108,000 108,000 1,296,000
Finance
1 60,000 12,000 72,000 72,000 864,000
Manager
Accounting
2 25,000 5,000 30,000 60,000 720,000
clerk
Sales Manager 1 60,000 12,000 72,000 72,000 864,000
Demand
Administrative 2 25,000 5,000 30,000 60,000 720,000
Forecaster
and Financial
HR Manager 1 45,000 9,000 54,000 54,000 648,000
Services
Security Guard 8 12,000 2,400 14,400 115,200 1,382,400
Janitor 8 8,000 1,600 9,600 76,800 921,600
Cook 2 8,000 1,600 9,600 19,200 230,400
Purchaser 2 8,000 1,600 9,600 19,200 230,400
Caf
2 8,000 1,600 9,600 19,200 230,400
Maintenance
TOTAL 95 972,000 194,400 1,166,400 2,353,200 28,238,400

Table 5.3 Utilities

Item Cost per Month (Php) Cost per Year (Php)

Electricity 47,440.85 569,290.20
Water 2,353.15 28,237.78
Telecommunication 8,450.00 101,400.00
Internet 9,500.00 114,000.00
Fuel 15,000.00 180,000.00
TOTAL 82,744.00 992,927.98

Table 5.4 Land

Location Lot Size Land Price

Bagumbayan, Tanauan, PhP 45,692,500

13055 m2
Batangas (PhP 3500 per sqm)

75
Table 5.5 Machineries and Equipment

Equipment Brand Quantity Amount (PhP) Cost (PhP)

Laser Photoplotter Fortex 2 470,000 940,000
Automatic Optical
VisionX 2 1,000,000 2,000,000
Punch System
X-ray Drill Pluritec 2 850,000 1,700,000
Ink Jet Printer Ec- Jet 2 350,000 700,000
Flying Probe
Hioki 2 1,000,000 2,000,000
Tester
YUSH Electronic
V-cut Machine 2 500,000 1,000,000
Technology Co.,Ltd
Energy Dispersive
X-ray Thermo 1 4,000,000 4,000,000
Spectrometer
XE- 100 AFM Park Systems 1 5,000,000 5,000,000
Universal Testing
Wance 1 7,500,000 7,500,000
Machine
MKS, Izod Impact
Texcare 1 3,000,000 3,000,000
Testing Machine
AR-10 Hardness
Mitutoya 1 1,000,000 1,000,000
Tester
Digital LCR Meter Metravi 4 5,000 20,000
2940 TMA of TA
Instrument TA Instruments 1 4,000,000 4,000,000

TOTAL 32,860,000
Table 5.6 Miscellaneous Expenses

Name Quantity (pcs) Price (PHP) Amount (PHP)

Alarm System 5 20,000 100,000.00
Office Air-
12 28,000 336,000.00
Condition
Production Air
1 140,000 140,000.00
Condition
Biometric Time Clock 1 9,576 9,576.00
Chair 40 1,900 95,000.00
Desk 30 1,500 45,000.00
Computer 12 28,000 336,000.00
Printer 5 7,000 35,000.00
Fax Machine 2 3,500 7,000.00
Exhaust Fan 8 16,000 128,000.00
Smoke Detector 16 5,500 88,000.00
Office Supplies ---- 10,000 10,000.00

76
 TOTAL 1,329,576.00

Table 5.7 Taxes, Licenses, and Insurance

Items Cost (Php) Taxes and Licenses Insurance (Php)

(Php)
Building 51,749,880 ------ 450,000
Equipment 32,860,000 ------ 121,590
Transportation 2,200,000 8,000 20 000.00
Vehicle
Total 57,159,000 8,000 591,590

TOTAL 591,590
Table 5.8 Registration

Components Cost (PHP)

SEC (Securities and Exchange Commission) 1,000.00
BOI (Board of Investments) 14,000.00
DTI (Dept. of Trade and Industry) 6,330.00
PEZA (Philippine Economic Zone 15,960.00
Authority)
ECC (Environment Compliance Certificate) 6,000.00
TOTAL 43,290.00

Table 5.9 Cost of Building a Plant

Total Amount of Plant Related Expenses (Fixed Cost for Starting a Plant)
Item Cost (PhP)
Land 45,692,500 (3500 per sqm)
Building 51,749,880
Vehicles 2,200,000
Registration 43,290
Tax, License, Insurance 591,590
Equipment 32,860,000
Miscellaneous 1,329,576.
Total 134,466,836

77
Table 5.10 Monthly Dues

Total Amount of Production Cost Per Month

Item Cost (Php)
Employment 2,353,200
Utilities 82,744.00
Energy 5,000,000
Raw Materials 6,966,840
TOTAL 14,402,784

Table 5.11 Target Production

Daily 400 pcs

Monthly 12000 pcs

5.12 Income Average

Product Price:

Quantity ordered Price (PhP)

1 2400/ pc
2-11 2350/ pc
12-23 2300/pc
24- 100 2250/pc

Minimum order quantity: 1

Unit of measure: Piece

Income Average (Basis: 400 pcs / 2400/pc)

Batch Cost (PhP)

Daily 960,000

Monthly 28,800,000

78
 Yearly 345,560,000

5.13 Return of Investment

Revenue = Total Cost of Building Plant = PhP 134,466,836

Gross = Product Price Monthly Bills Raw Materials Cost = PhP 14,397,216

Basis of 12 months or 1 year:

12(14,397216)134,466,836
ROI = x 100% = x 100 %
134,466,836

ROI = 28.48 % per year

Pay Back Period = 3 years 5 months 11 weeks

79