Intro slides review:

Pauli Exclusion: no two electrons in the same atom or electrons from different
atoms in which intereact can have the same four quantum numbers.
High melting temperature � Higher bonding energy
Elastic deformation: Deformation in which stress and strain are proportional,
steeper the slope higher the E
Binding Energy is the energy required to create/break the bond. Higher B.E -> High
strength = high melting temp = higher E. A steep slope of a stress-strain curve
indicates high binding energy. Deep trough means atoms separate to a lesser degree
� have low linear coefficient of thermal expansion.
Isomerism � same composition but diff structure
Polymer crystallinity � packing molecular chain into ordered arrays, density of
crystal regions in higher than amorphous ones
Point defects- localized disruptions -types include: 1. vacancy , 2. interstitial
= a. small impurity b. self
Vacancy is produced when an atom/ion is missing from its site.
Interstitial defect forms when an extra ion is inserted
Impurities are elements/compounds from raw materials
Line defects includes edge and screw dislocations
Edge dislocation � burgers vector is perpendicular to the dislocation line
Screw dislocation � burgers vector is parallel to dislocation line
Slip plane contains both dislocations and burgers vector

Chapter 6 Review
Elastic Limit: the critical stress value needed to initiate plastic deformation
Proportional Limit � level of stress above which relationship bw stress strain is
not linear
Offset yield strength � 0.002 or 0.2%
Ultimate tensile strength � maximum stress on the engineering stress-strain curve
Tensile toughness � area under the engineering stress strain curve
Impact toughness � the ability of a material to withstand an impact blow
Fracture toughness - fracture toughness refers to a property which describes the
ability of a material containing a crack to resist further fracture. If a material
has high fracture toughness, it is more prone to ductile fracture.
PUT STRESS/STRAIN CURVES HERE
Yield strength, tensile strength and E decrease at HIGH temp and ductility
increases
True stress/strain and engineering stress/strain diagram have the same yield point
but for true diagram the curve is truncated at true stress due to area being
unknown at necking.
Hardness: A measure of a material�s resistance to localized plastic deformation
Rockwell: spherical/ hardened balls as indenter

Ch 7 review
Fracture � ultimate mechanical failure
Brittle � little energy is absorbed [metals and polymers]
Ductile � absorbs energy with plastic deformation [ceramics, polymers, metals]
BCC metals and alloys show abrupt drop in ductility as temp drops., happens because
temp activates some slip systems
Ductile fracture: plastic deformation, energy absorbed, crack propagation,
microvoid coalescence, microscopic dimples, trans granular
Trans-granular (intra) � cracks pass through grains, cleavage on specific planes
Intergranular � crack propagates along grain boundaries due to weakened or
embrittled boundary
Brittle fracture: rapid crack propagation, relatively flat smooth surfaces, lines
and ridges, v shaped marking, radial ridges
In ceramics: cleavage along cpp
In glass � conchoidal fracture surface
Thermoplastic polymer � brittle failure below Tg
A better Kc (fracture toughness) means less crack propagation, more energy
absorption by smaller flaw size, good ductility, high temp, small grain size, low
load, reduced thickness, lower dislocation density
Cracks are tolerable if stress intensity factor K < plane strain factor K_IC
High strength materials have low K_IC
Griffith�s crack model � A crack propagates when a balance between the decrease in
potential energy and the increase in surface energy is achieved. Strain energy form
the system causes crack to grow. It arises from the non-equilibrium configuration
of the nearest neighbor atoms
improving fracture toughness of a fiber reinforced composite � 1. Interfacial
toughening 2. Fiber pull out 3. Crack bridging
Fatigue is the lowering of strength of failure of a material due to repetitive
stress, identify by constant repetitive spacing, can occur at stress lower than
yield stress, cyclic loads, beach marks
Stress concentration leads to defects � initiation of fatigue
Fatigue stresses develop micro-cracks at surface, grow as stresse increases, cross
grain boundaries
Fatigue scatter: surface finish, sample imperfections
S-N curves � Endurance limit is stress below which failure prob. Is 50%. Endurance
ratio is endurance limit/tensile strength
Crack Growth � below delta K, crack wont grow. Rapid growth = unstable
Creep � time dependent deformation under constant temp (high)
Coble creep � grain boundary diffusion predominates
Nabbaro herring creep � bulk diffusion is imp, higher the temp higher the diffusion
Stress rupture is the sudden failure of a material held under a constant load for a
given period of time at a specific temp. (should always choose ductile material)

Ch 16: polymers review

Polymers are chains of molecules � linear, branched (side chain interactions),
crosslink (direct mechanical connection, high levels of ductility and resilient),
3D network (complex)
Polymerization � chemically join small molecules
Plastics � thermoplastics, thermosets, elastomers
Thermoplastics- linear molecules, weak secondary bonding, amorphous/crystalline
(harder), melt upon heating, easy to recycle, higher avg molecular weight leads to
high melting temp and high E
Thermosets � crosslinked/3D, stronger but brittle than thermoplastics, harden when
heated, don�t melt, hard to recycle
Elastomer- fully elastic, full recoverability, linear, large elastic deformation
>200%
Crystallization occurs as a result of temperature changes and applied stress,
amorphous to crystalline polymer, higher crystallinity -> high density, strength,
resistance, bonding, deformation can lead to crystallization
Tacticity- distribution of non-symmetrical repeat unit
Isotactic � atoms are all on the same side
Syndiotactic � atoms alternatively occupy positions on opposite side of chain
Atactic � random arrangement of atoms (poor packing, low density)
Rubbery � slightly below Tm: under elastic/plastic deformation, less than Tm: low
temp, strong bonding
Elastic Deformation: 1. Stretch and distort covalent bonds 2. Distort entire
segments of polymer chains
Plastic deformation: Amorphous, Permanent deformation, stress drop beyond yield
point, chain will stretch, rotate,slide. Necking, stronger van der waal
Stress relaxation: Stress decreases with time
Copolymers: random, alternating, block, graft
Elastomer � retain large elastic deformation but prevent plastic deformation
Vulcanization - cross-linking of elastomers by sulfur
Thermal setting polymers- higly crosslinked, irreversible, poor ductility, brittle,
high Tg

CH 17 review Composites
Composites: multiphase materials with chemically diff phases and interfaces, high
strength/weight, low cost, resistant. Ex: natural include wood and bone, synthetic
include fiberglass, carbon, concrete
Matrix- most of the structure is in the matrix, softer, flexible continuous part,
transfer stress to other phases, protects phases from environment
Reinforcement: dispersed phase, stiffer, higher strength part, enhances matrix
properties
Composite Characteristics � properties of matrix and reinforcement, ratio of matrix
to reinf, bonding adhesion, mode of fabrication
Particle Reinforced � Elastic modulus of composites rule of mixtures
Fiber Phase � smaller diameter fiber is stronger than bulk in most materials
Matrix Phase � can be metal, polymers, ceramics, holds fibers together, transfer
external stress to fibers, protect fibers form surface damage
Failure modes � fiber breaking, matrix breaking, fiber pullout
Two Fiber Composite � Kevlar fiber 131, eglass fiber72.5 , epoxy matrix 2.41
Kevlar - High strength, high E, better strength than metals

Ch 8 : Annealing and Solidification

Bauschinger effect: Early yielding on strain reversal
Strain Hardening: done by increasing # of dislocations
Residual Stress: induced in cold working, shot peening for surface reconditioning
Stress Relief Annealing: heat up to annealing point and cool down slowly to reduce
residual stress, annealed glass (no stress), tempered glass (compressive stress)
Cold working: strengthen material while producing the shape, good dimensional
tolerances
Recrystallization temp: decreases with increasing CW%, the smaller the grain size,
the smaller the Tr, pure metals < alloys , increasing annealing time reduces Tr
SN, Pb, Zn crystallize below room temp because CW not possible under normal
conditions.

Ch 9 Solidification
Nucleation: Particle growth is accompanied by a decrease in total energy