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Laser Marker

Metal Printing
Process
Instruction
Manual
Metal Printing Metal Printing Individual wavelength Absorption rate
Process Examples Principles characteristics differences by material
Relationship between metal product and laser marker

“Direct marking” on metal products


“Direct marking” is a method of indicating product IDs or time limits by marking data directly on products instead of using labels or name
plates. Although a variety of marking methods exists the advantages of “direct marking” with lasers has been attracting
attention due to the need for reliable manufacturing history management.

Typical marking examples

Stamping machine Industrial inkjet printer

Pin marker Laser Marker

Characteristics of each marking method

Stamp Label Inkjet printer Laser Marker

No fading Normal Good Good Excellent


Permanent marking
(No coming off)
Poor Normal Normal Excellent
Unaffected by materials Good Good Good Normal
Less waste Good Normal Normal Excellent
Marking on uneven surfaces Normal Normal Good Good
Flexibility to changes in
marking data
Poor Good Excellent Excellent
Initial cost Excellent Good Normal Normal
Running cost Normal Poor Normal Excellent

Advantages of laser markers

Permanent Low High marking Fewer


marking
marking running cost quality errors

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Printing and Processing for Metal Products
Because laser markings cannot be erased or tampered with and has a low running cost, it is being rapidly adopted as a method for direct parts
marking. Laser marking is also used in a variety of applications, automotive manufacturing for example.

Crank shafts Identification Mirrors (patterning) Circuit


plates boards

Wiper blades Shift levers

Engine blocks Instrument


panel buttons

Bearings Metres

Bolts Fuse boxes Vehicle body Air filters


frames

Typical marking examples

2D code marking on high-temperature components 2D code marking on cast surfaces Coloured marking on cylindrical components

En g i n e b l o c k Cr an k s h af t Inj e c tor s

By emitting a laser through heat-resistant A large variety of 2D code marking 3D control is used to allow for perfectly uniform
glass, it is possible to perform marking on patterns allows for the selection of the and distortion-free marking on cylindrical
high-temperature workpieces directly after best marking method for the surface shapes. With a high-peak/short-pulse laser, it is
they have been removed from the die- condition of a workpiece. Marking possible to perform marking that inhibits the
casting machine. Easy-to-read 2D codes conditions that will allow for high-speeds effect of heat on workpieces, achieving a sharp
can be marked regardless of workpiece and are easily read by a code reader can and high-quality finish that is free of scorching
temperature. be found with ease. and thermal degradation.

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Metal Marking Processing Mechanism

Reflection, Absorption, and Transmission

Light When light is received, all objects experience “reflection”,


Reflectivity + absorption
Reflection “absorption”, and “transmission”. This relationship is a very rate + transmittance = 1
important element for laser marking and laser processing.
Object The ratio of “reflection”, “absorption”, and “transmission” of Without increasing the temperature of

Absorption the received light, forms the following relationship. the object, processing becomes more
difficult as “reflection” and
Transmission
“transmission” increase. Processing
efficiency becomes better as
Main Types of Marking “absorption” increases.

1. Black (oxidation) marking

Principle
When laser light is irradiated on the target for marking, the focal point is
shifted and only heat is transmitted. An oxidised film is created by imparting
heat with scrapping and black marks are made by making this oxidised film
appear black.

2. White etching marking

Principle
Laser light irradiates the focal point on the target for marking.
The metal surface is finely etched, resulting in a rough surface. This causes
irregular reflection, producing markings that appear white.

3. Engraving Marking

Principle
Laser light irradiates the focal point and etches the surface of the target for
marking. A deeply engraved impression can be made by increasing the
amount of engraving by increasing the laser irradiation count.

4. Surface Peeling

Principle
Laser
Uses laser irradiation to peel off the surface and remove the electroplating
of the target for marking. This makes the substrate visible, and brings the
Base Materials marking into view.

Continuous wave (CW) oscillation and pulsed oscillation There are two methods of laser oscillation as follows.

Continuous wave (CW) oscillation Pulsed oscillation


Emit a laser continuously to apply constant heat. Change the frequency repeatedly to adjust pulse energy.

A laser beam is A laser beam is stored


emitted constantly. and then emitted.

● Major applications: Welding, marking on IC packages ● Major applications: Peeling, colour development

  EYENCE laser markers allow switching between continuous wave (CW) oscillation and pulsed oscillation,
K
so that they can be used for every metal material.

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Main Processing Types
Technology that uses high energy density laser irradiation to melt and vaporise the target object by thermal energy is called laser processing. Here are the basics of
general laser processing.

1. Cut

Focuses the laser light output by a laser oscillator and irradiates any fixed point from the irradiation unit to melt the target.
Because there is no contact, it does not cause a reaction with the item processed. Deformation and cracking is kept to a
minimum. This makes it easy to cut thin material, such as leather or fabric. In addition, because it is possible to specify processing
areas in extreme detail, it is possible to create localised holes or cuts in places where cutting tools cannot fit.

2. Solder Barrier

Laser light Due to the trend toward smaller and thinner, some connector terminals have solder barriers (nickel barriers) to control
solder from soaking up. Conventionally, masking was used on locations where electroplating is not necessary, but removing
the mask material took time and effort. Surface layer peeling using laser light is effective in these cases.
Ni barrier layer
Au plating
Ni plating
Material

3. Welding

Laser welding is a method that irradiates laser light on targets and joins them at a location by melting and solidifying the
metal. It is possible to irradiate a pinpoint with high density energy and complete the process at high speeds. Material
distortion due to heat can be kept to a minimum. In the past, deformation occurred easily. Now even thin materials can be
welded.

4. Soldering

The heat from the laser melts the solder paste and joins the metal.
Laser light
Irradiation of localised laser spots is possible, so irradiation is suitable for small parts. In addition, compared to the flow
method where heat is added to the entire part, it is possible to reduce the load caused by the effect of heat on the part.

Scratch Control CONVENTIONAL Moving back and forth across the cut width

Conventional cuts move the laser light the width of the cut, It is difficult to keep the energy
and cutting is done back and forth. Using this control concentrated as the laser moves
method, it is difficult to focus the laser energy, and the back and forth over the entire area.
Cut width
wider the cut, the more energy is lost.
KEYENCE laser marker can control the cut for the desired
width as it is moving back and forth exactly. Because NEW FUNCTION SCRATCH CONTROL
energy loss is suppressed compared to a conventional
Processing is done by moving the laser beam
laser, short time cutting is realised.
back and forth across a shorter distance. This
makes it possible to focus the energy, which
Cut width
leads to improvements in processing time.

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Effect on Materials of Individual Wavelengths

Laser marker classification by wavelength

Industrial laser markers are broadly divided into


CO2 laser marker Wavelength: 10600 nm four types based on the wavelength of the laser beam:
CO2 laser markers, YVO4 laser markers, fibre laser
markers, and SHG (green) laser markers.
YVO4 laser marker In general, the shorter the wavelength of a laser, the
more energy is generated and the higher the ratio of
Wavelength: 1064 nm
(Fundamental wavelength) absorption into an object becomes. Optimum materials
for marking/processing depend on the wavelength of
Fibre laser marker*
the laser beam. The following section explains the
characteristics of each wavelength.

SHG laser marker


Wavelength: 532 nm * Fibre laser marker: 1090 nm
(SHG wavelength)

Wavelength: 10600 nm CO2 laser marker

Invisible spectrum(UV)Ultraviolet
Visible spectrum Invisible spectrum (IR) Infrared

(nm) 300 380 400 500 532 600 700 780 800 1064 1090 10600

CO 2 lasers have a wavelength that is 10 times longer than a YAG, YVO 4 or Fibre laser. This is the longest wavelength among widely used
industrial lasers. CO 2 lasers, as the name implies, generate the laser medium through stimulation of CO 2 gas. It is possible to mark, not only paper
or resin, but also transparent materials such as glass and PET, but it is hard to mark metal because laser light has almost reaction (it does not absorb).

Wavelength: 1064 nm YVO4 /Fibre laser marker

Invisible spectrum(UV)Ultraviolet
Visible spectrum Invisible spectrum (IR) Infrared

(nm) 300 380 400 500 532 600 700 780 800 1064 1090 10600

The IR wavelength which is an abbreviation for Infrared Ray is the most


versatile wavelength of light for laser processing. As the name implies, IR is   Engine Block   Bearing
the wavelength just greater than that of the red end of the visible spectrum,
meaning it is invisible to the human eye (i.e. longer than 780 nm).

Typical characteristics of 1064 nm wavelength range lasers

• A wide range of processing applications from resins to metals.


•C
 annot process transparent objects like glass as the laser passes
through such objects.
• Creates contrast on resins easily.

Wavelength: 532 nm SHG laser marker

Invisible spectrum(UV)Ultraviolet
Visible spectrum Invisible spectrum (IR) Infrared

(nm) 300 380 400 500 532 600 700 780 800 1064 1090 10600

Second Harmonic Generation (SHG) uses a wavelength that is half of the typical
1064 nm wavelength. 532 nm falls into the visible spectrum and is green in colour.   Copper Lead Frame   Metal Plated Packaging
This wavelength is produced by transmitting a 1064 nm wavelength through a
nonlinear crystal that reduces the wavelength by half. A YVO4 medium is normally
used because the characteristics of the beam are well suited for intricate processing.

Typical characteristics of 532 nm wavelength range lasers

• High absorption rates in materials that do not react well with typical
IR wavelengths and those that reflect IR light such as gold and copper.
• Intricate processing is possible because of a smaller beam spot than IR lasers.
• Transparent objects are typically not able to be processed.

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Peak power and pulse duration

Peak power Output characteristics of YVO4 and fibre lasers


200 200 kW
The output characteristics of a laser vary considerably depending on
YVO4 laser (Typical value)
laser excitation media. The major differences between YVO4 and fibre
150 lasers are the peak power and pulse duration. The peak power is the light
intensity, and the pulse duration is the duration of illumination. YVO4
100 lasers are produced by an excitation method based on end-pumping,
which allows easy focusing of the laser beam spot and creates a high

50 quality laser beam with high peak power and short pulses. On the other
10 kW
hand, fibre lasers have a high power output and low peak power
Fibre laser (Typical value)
0 compared with YVO4 lasers.
4 ns
100 ns
Pulse duration

Differences in principle between YVO4 and fibre lasers

YVO 4 lasers (End-pumping method)

YVO4 crystal End-pumping method YVO4 lasers are solid state lasers that use YVO4
crystals for their laser medium. YVO4 is a yttrium vanadate crystal and is
doped with Nd (neodymium) in the same way as YAG lasers. In this
method, pumped light is applied from one end of the YVO4 crystal. The
resonator is composed of a pair of mirrors with the crystal and Q-switch
Output coupler positioned between them.
Pumping laser diode
Ground state Excited state Stimulated Also, the degree of amplification at the centre of the crystal is large and
emission state
Total reflect mirror Q-switch the generated laser light is single mode, which makes it possible to
output high-quality lasers.

Fibre laser

Main amplifier Fibre lasers use fibres as their medium and have long-distance
Pre amplifier communication relay amplification technology to maintain consistent high
Seed LD Isolator
output. These optical fibres are composed of a core that propagates the
light along the centre of the fibre and cladding that concentrically wraps
the core. Fibre lasers use this core as the laser medium to amplify the
light. The core is doped with Yb (ytteribum).
Pumping laser diodes Pumping laser diodes

Hybrid laser (KEYENCE original)

Fibre
The KEYENCE Hybrid Laser Marker uses a next-generation laser oscillator that combines the
high quality and high intensity of YVO4 lasers with the long service life and excellent radiation
characteristics of fibre lasers. One unique characteristic of the Hybrid Laser Marker is its
two-stage construction in which a YVO4 laser oscillator (master oscillator) is used to generate
Q-switch
the pulse, which is then amplified by a YVO4 amplifier. This makes it possible to amplify the
pulse generated by the master oscillator while maintaining the high peak power and high
Output
YVO4 coupler YVO4 quality of the pulse. Also, single-emitter pumping laser diodes—an advantage of fibre
Oscillation Amplification
lasers—are used, which provide lower heat density than the multi-emitter laser diodes (laser
Rear mirror diodes that have multiple light emitting surfaces in a single semiconductor chip) of solid state
lasers. This enables the KEYENCE Hybrid Laser Marker to have a long service life even
Pumping laser diodes Master oscillator Amplifier
(single emitter)
though it is a solid state laser.

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Effect on Metal 1 Differences in deep engraving between YVO4 and fibre lasers

Differences in deep engraving between YVO4 and fiber lasers

Fibre laser superior in carving and deep engraving


  KEYENCE YVO4 laser marker
When the depth of engraving within the same marking time is
compared for a metal target, a fibre laser engraved a depth of 320 μm
and a YVO4 laser engraved 210 μm. The pulse of a YVO4 laser emits
a high intensity laser beam to the material for a short time. The
shallow engraved area in the surface layer is heated quickly and then
Depth 210 μm cools immediately. Since the laser radiation stops before the heat is
transferred, the thermal influence on the surrounding area is small.
  KEYENCE fibre laser marker On the other hand, the pulse of a fibre laser emits a low intensity
laser beam for a long time. The temperature of the material rises
slowly and a liquefied or evaporating state continues for a long time.
Consequently, a fibre laser is suitable for a large amount of engraving.

Depth 320 μm

*Results will differ according to marking conditions or materials.

Deep-engraving Control
With deep-engraving marking, as the carving proceeds the focal point is
CONVENTIONAL Fixed focal distance
gradually misaligned to the right. A phenomenon occurs that even if, because
of this misalignment, one wants to dig deeper even if it takes longer, but it
As the target is engraved, the
isn't as deep as one thought, the deeper one digs the more time it takes.
surface being processed
KEYENCE laser markers, make it possible to change the marking focal point gradually moves further away
while deep-engraving. This feature changes the focal distance automatically, from the focal point, making it
prevents energy loss during deep-engraving and can mark deeply in a short impossible to apply
sufficient energy.
amount of time.

NEW FUNCTION DEEP ENGRAVING

The focal distance is changed after each


pass. This allows for processing with
maximum energy density at all times.

Metal Hardness and Engraving Depth

In deep engraving, ease of engraving changes according the the hardness of the Metal Hardness and Engraving Depth
metal. The table to the right compares material hardness and engraving depth. The Depth (μm) Hardness (HV)
500 200
lower the hardness, the easier it is to engrave. Even under the same marking
conditions depth is different. Aluminium has a low hardness compared to SUS or
iron. Because it is easy to engrave, it has a move than double engraving volume. 150
375
Hardness is one quality of substances and materials, and expresses the degree of
difficulty of deformation and scratching. Many experimental methods for hardness
testing exists, but we use the Vickers Hardness (HV) values. 250 100

125 50

Hardness (HV)
Depth (μm)
0 0
Aluminium Iron SUS

*Use Aluminium (A5052), Iron (SPCC) and SUS (304)


*Results will differ according to marking conditions or materials.

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Marking Quality Comparisons

Depth of Focus

KEYENCE fibre laser marker KEYENCE Product YVO4 laser marker

Z = 4 mm Z = 4 mm
Origin ratio410% Illegible Origin ratio283% Illegible

Z = 3 mm Z = 3 mm
Origin ratio320% Illegible Origin ratio225% Grade: B

Z = 2 mm Z = 2 mm
230% Illegible Origin ratio166% Grade: A

Z = 1 mm Z = 1 mm
Origin ratio140% Grade: A Origin ratio108% Grade: A

Z = 0.0 mm Grade: A Z = 0.0 mm Grade: A

Z = -1 mm Z = -1 mm
Origin ratio140% Grade: A Origin ratio108% Grade: A

Z = -2 mm Z = -2 mm
Origin ratio230% Illegible Origin ratio166% Grade: A

Z = -3 mm Z = -3 mm
Origin ratio320% Illegible Origin ratio225% Grade: B

Z = -4 mm Z = -4 mm
Origin ratio410% Illegible Origin ratio283% Illegible

Incident Angle Effect

KEYENCE fibre laser marker KEYENCE Product YVO4 laser marker

ABC ABC

Compare the print quality of the YVO4 laser and the fibre laser. The YVO4 laser
produces a high peak power-short pulse laser. Marking quality is stable even
under difficult processing conditions, such as if the focus shifts or the diffraction
angle is large, because the illumination process has ideal strength distribution Comparison of
beam power
and produces high laser energy in a short time.
distribution

YVO4 laser Fibre laser


(End pumping method)

AUTO-FOCUS FUNCTION
EQUIPPED WITH AN AUTO-FOCUS FUNCTION
Our built in camera makes it possible to perform automatic focusing without the
use of any external devices. This is possible even when targets may not be
placed at the exact same focal length from the laser and eliminating the need
for external tooling. Additional production costs can be kept to a minimum while Measurement result
Length measuring
increasing efficiency and throughput. laser pointer
*The built-in camera is used to monitor the focal distance using the laser pointer. Automatic +21 mm
focusing is performed by calculating the focal distance from the pointer position. This
measurement may not be possible in some cases due to the material, shape, and surface of
the workpiece.
±0

-21 mm

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Effect on Metal 2 Differences between Green Laser and Base Wave Laser

Oscillation principle for green lasers

Green laser is a general term for lasers that emit light with a wavelength of 532 nm. They are called “green lasers” because their
wavelength is visible as an emitted green light.

A 1064-nm wavelength light (standard wavelength) generated through a


Excitation light Standard wavelength SHG wavelength
YVO4 crystalline medium is further converted into a 532-nm wavelength
light through a nonlinear optical crystal (wavelength conversion crystal).
A green laser is also called an SHG (Second Harmonic Generation)
laser. A YAG laser that generates light through the SHG process is
called an “SHG: YAG laser”, and a YVO4 laser that generates light
YVO4 crystal Nonlinear optical crystal through the SHG process is called an “SHG: YVO4 laser”.

Difference in the spot diameter between green laser and fundamental lasers

The shorter the wavelength of a laser marker is, the


smaller the spot diameter of the laser that can be λ : Wavelength
set. The spot diameter of a laser is determined by 4 × λ × M2 × f M2 : M squared
the calculation on the right. Spot diameter = f : Focal distance
π×D D : Incident beam diameter

Example of micro marking with a green laser marker


The wavelength of green lasers is half that of
fundamental lasers. Consequently, the beam spot
0.1 × 0.1 mm marking 0.04 × 0.04 mm marking
can be focused to about half the conventional size.
This indicates that green lasers are more effective
for applications which require micro marking/
processing such as electronics components under
miniaturisation.
Distortion-free marking even with characters that are 0.1 mm or smaller

Points on achieving accurate positioning for marking


Targets requiring micro marking/processing should be positioned accurately to enable marking
within a limited space. KEYENCE offers a “Viewfinder” function that displays an image
captured using the same axis as the laser on the monitor. This allows reliable and easy
positioning for marking/processing even in an extremely small space which cannot be aligned
properly by the naked eye.
It also reduces the number of parts scrapped and man-hours required to get the system up
and running.

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Absorption Rate for Metals

70
532 nm 1064 nm The graph on the left shows the different absorption rates of metal
60 Green laser Standard wave materials with a green laser (532 nm) and with the fundamental
Ratio of absorption [%]

wavelength (1064 nm). There is no significant change to the absorption


50
rate for iron (Fe), nickel (Ni) or aluminium (Al) when the wavelength is
40 changed. However, the absorption rate for gold (Au) and copper (Cu) is
affected greatly by changes in wavelength. The absorption rate for gold
30
(Au) with wavelengths of 532 nm is approximately 30%, but with the
20 fundamental wavelength of 1064 nm the absorption rate is less than
10%. Similarly, with a wavelength of 532 nm, copper (Cu) has an
10
absorption rate of 40%, whereas that rate is less than 10% with the
0 fundamental wavelength of 1064 nm.
450 550 650 750 850 950 1050 1150
Wavelength [nm]
Cu Au Ni Fe Al
(Copper) (Gold) (Nickel) (Iron) (Aluminium)

Differences in marking/processing quality between green and fundamental lasers

Take a look at the comparison of marking on copper. With the basic

Base Laser Green laser wavelength, soot is created by the effect of the heat. By contrast, green
lasers have a high absorption rate in material, so it is possible to
Copper Lead Frame counter heat stress. Also, for marking 2-dimensional codes on
aluminium materials, green lasers are able to focus the spot diameter
of the laser better than standard wavelength lasers, so they can
produce markings that do not wear out, even on cell dense parts.

Aluminium Material

0.3 mm

0.67 mm

How to find suitable conditions for any metal?


Sample Marking Function
When printing on metal, there are large changes in colour according to the
quality of the marking target or the printing conditions of the laser marker.
The sample marking function uses software to extract conditions automatically
simply by selecting the material. One look at the marking results immediately
tells users the optimal conditions. Normally, setting marking conditions
requiring experimentation can be completed in a short time.

Select the material. Quickly find the optimum


conditions.

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Free-of-charge Test Marking/Processing Available
Send in parts to be tested by our
specialised staff.
For additional information, feel free to
contact us via our company home page or
your nearest KEYENCE office.

Before After
processing processing

Marking application Processing application

www.keyence.com

Copyright (c) 2017 KEYENCE CORPORATION. All rights reserved. MDXMetalMarktext-WW-C-GB 1027-1 600L07

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