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HIGH TEMPERATURE PHENOLIC RESIN:

The thermal stability of a phenolic‐phosphate resin, prepared by the


transesterification of triphenyl phosphate and resorcinol and cured with
hexamethylene tetraamine, has been compared with that of a conventional
phenolic resin. Thermogravimetric analysis (TGA) of the resins, in air,
demonstrated that the phenolic‐phosphate resin had the superior thermal
resistance. Accordingly, to assess the performance of phenolic‐phosphate
resins as thermally stable binders in composites, long‐term heating ageing
studies at 250°C were carried out on asbestos‐filled moulded test specimens.
The results of these tests were less welldefined than the TGA results, for the
phenolic composite had the higher flexural strength (108.5 MNm−2) initially
compared with 56.7 MNm−2 for the phenolic‐phosphate composite. However,
after 1000 h heating at 250°C neither system retained a useful level of flexural
strength, although the phenolic‐phosphate composite (18.35 MNm−2) was
stronger than the phenolic composite (5.4 MNm−2).

Types of Phenolic Resin


Phenolic resins are divided into two different types, novolacs and resoles.
Both have high temperature stability up to 300° – 350° C, high water and
chemical stability. Phenolic resins are often dark-colored from yellow to
dark red, and have an excellent price/performance profile.
Phenolic resins are found in a myriad of industrial products. They are
mainly used in the production of circuit boards. They are better known for
the production of molded products including billiard balls, laboratory
countertops, and as coatings and adhesives.

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