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PROCESS
1
Introduction
X-Y Stage
Required
Piezoactuator
Depth Model
Total Tool
Feed Reference
V
Optimum Gap
F Micro EDM Controller
DC Model
Actual Gap
(MRR + TWR)
4
Proposed Micro EDM Setup
Reference
Open loop gap Feedback V Gap
voltage Voltage Micro EDM
Piezo
- Controller
Open loop V Drive
+
Tool wear
Required - length
Depth Actual +
Depth Tool feed length
Gap Voltage
Piezoactuator
sensor
Amplifier
V F
Pulse Discharge
Dielectric Fluid Control Power
Recirculation circuit supply
Filter System
Duty Cycle
X-Y-θ Table
5
In-House developed Micro EDM Set-up
Discharge Piezoelectric
Power Microctuator
Tool feed rate
supply Driver
Controller
Piezoactuator Z
Pulse
Voltage Control X
Reference Gap
circuit Amplifier Voltage
Tool
Workpiece
X-Y-θ Table
6
Silicon Micromachining using Micro EDM
• Silicon Wafer Details:
630µm thick, 0.1Ωcm resistivity
• Machining time: 7 minutes
• Tool Diameter outer:1.57mm, Inner: 0.54mm
• 2D View from Surface Profiler
F = 4.3kHz
600µm
D.C. = 33.4%
Voltage = 60V
440µm
7
3D View of the Machined Structure
Surface roughness can
be improved by
• dielectric fluid filtering
and recirculation
• careful selection of
machining parameters
• selecting proper polarity
• giving rotary motions to
the tool
• roughing operations at
higher voltage and
finishing operations at
lower voltage
• Post process treatments
like etching
8
Model For Piezoelectric Actuator
Mechanical
Vin Vt Ft x •
T Model for
+ q
- Piezoactuator +
VH +
VtCp VH
Cp
T H x
Tx
-
+
Hysteresis
Model for
q + Vin + •
qt m
Piezoactuator q x
q = Tx + Cp Vt Vt C T T Ft=TVt
k b
Vin = VH + Vt Vt Ft
VH = H(q) -
Ft = T Vt -
mx&& + bx& + kx = Ft
⎪⎪
(
⎧ q − qb ) (
q − qbi )< vi
⎫
⎪⎪
The voltage across the hysteresis element is given by
i
if
Vi = ⎨ Ci Ci ⎬
⎪ ⎪
⎪⎩Vi sgn ( i ) and qbi = q − Ci vi sgn ( i ) else ⎭⎪
n
VH =∑ Vi
i =1
9
Work to be Done