Professional Documents
Culture Documents
Inspection Techniques
X-ray inspection procedures Optical inspection (Endscope) Destructive mechanical testing
PBGA Reflow
ERSA
METCAL
KH Benz
Kaisertech
Balls have not reflowed paste has this is not clear on these images
Balls have not reflowed paste has this is very clear on these images
Balls have not reflowed paste has wetted pads this is shown by the perfect circle of the x-ray image x-
Balls have not reflowed but tin/lead paste has reflowed and wetted the joints
X-Ray Inspection
BGA CGA Chip Component J Lead Gull Wing Leadless Castellation
X-Ray Inspection
The maximum void size in any one termination will be less than 10% of that minimum solder joint dimension. In the case of multiple voids the maximum area will be less than 10%.
X-Ray Inspection
Bellcore GR 78 The maximum void size in any one termination should not exceed 1% (by volume) on average, with a worst-case incidence of 5% in less than one joint per circuit assembly.
X-Ray Inspection
Voids up to 24% of the pad area had no effect on reliability. They improved the reliability by 16% when compared with void free joints.
Mechanical Inspection
Mechanical Inspection
Solder Balls
Optical Inspection
Optical Inspection