ASPERA-4

Venus Express

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VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 1

Thermal Analysis and Thermal Design

Name and function Prepared by: Verified by: Issued by: Vitaly Lugenkov Stas Barabash, Co-PI Herman Andersson, EM

Date 2004-04-22 2004-04-27 2004-04-28

Signature

ASPERA-4
CHANGE RECORD Version Issue Rev 1 1 1 2 1 3 2 0 2 1 2 2 3 1 Date Changed Paragraphs All All All All Fig 2 and 3, Table 3 All

Venus Express

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VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 2

Remarks New document New document New document

2003-04-14 2003-11-26 2004-04-08 2004-04-22

ASPERA-4
TABLE OF CONTENT

Venus Express

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1
1.1

THERMAL MODEL DESCRIPTION .................................................................... 4
Technical Basis .........................................................................................................................4

2
2.1.1 2.1.2 2.1.3 2.1.4 2.1.5

IMA THERMAL ANALYSIS CASES ..................................................................... 8
IMA Cold case 1 .......................................................................................................................8 IMA Cold case 2 .......................................................................................................................8 IMA Cold case 2A, Sensitivity analysis ...................................................................................8 IMA Hot case..........................................................................................................................10 IMA Hot case, Sensitivity to radiator ageing..........................................................................10

3
3.1.1 3.1.2 3.1.3 3.1.4 3.1.5 3.1.6

MU THERMAL ANALYSIS CASES..................................................................... 12
MU Cold case 1 ......................................................................................................................12 MU Cold case 2 ......................................................................................................................12 MU Cold case 2A, Sensitivity analysis ..................................................................................12 MU Hot case ...........................................................................................................................14 MU Hot case, Sensitivity to radiator (SSM CC/UVS) and silver tape ageing........................14 MU Hot case A .......................................................................................................................14

4 5 6 7
7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6

THERMAL DESIGN REQUIREMENTS ............................................................. 16 IMA THERMAL DESIGN AND MATHEMATICAL MODEL......................... 18 MU THERMAL DESIGN AND MATHEMATICAL MODEL .......................... 25 THERMAL CALCULATIONS RESULTS........................................................... 34
Predicted temperatures for IMA nodes. ..................................................................................34 IMA Cold case 1 (2.1.1) .........................................................................................................34 IMA Cold case 2A, Sensitivity analysis (2.1.3)......................................................................36 IMA Hot case (2.1.4) ..............................................................................................................37 IMA Hot case, Sensitivity to radiator ageing (2.1.5) ..............................................................38 Predicted temperatures for MU nodes. ...................................................................................39 MU Non-operating cold case 1 (3.1.1) ...................................................................................39 MU Non-operating cold case 2 (3.1.2) ...................................................................................40 MU Non-operating cold case 2A (3.1.3) ................................................................................42 MU Operating hot case (3.1.4) ...............................................................................................44 MU Operating hot case, Sensitivity to radiator and silver tape ageing (3.1.5) .......................46 MU Operating hot case A (3.1.6) ...........................................................................................48

8

CONCLUSIONS....................................................................................................... 50

ASPERA-4
1 1.1 THERMAL MODEL DESCRIPTION Technical Basis

Venus Express

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VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 4

Analyzer of Space Plasmas and EneRgetic Atoms (ASPERA-4) experiment consists of two units: 1. Main Unit (MU), containing Scanner Box (motor, wheel, board, housing) and rotating Sensor Head (ELS, NPI, DPU, NPD) with its mounting structure. 2. Ion Mass Analyser (IMA), containing DPU Box (boards, housing) and Sensor Head (boards, housing). Figures (next two pages): drawings of MU (ME-ASP-MD-1000) and IMA (IMA-002) from different viewing geometry’s. Radiators of IMA and MU are not shown on this drawings. The following calculations were executed with finite difference computer program. The MU and IMA units were approximated by the nodes systems (17 nodes for IMA and 32 nodes for MU). The results are presented as tables with MU and IMA nodes predicted temperatures for different cases. The mission data and calculation cases are based on the Reference No. VEX/IF/0016/T.ASTR, Issue 2 “Venus Express/ASPERA Thermal Interface Requirements”, dated 27.06.03. The body of spacecraft is a box with 1700×1650 mm sides and 1600 mm height with two solar array wings stretching out on both sides. High Gain Antenna (HGA) with diameter 1630 mm is mounted on the third side of spacecraft box. External S/C “±Z” walls surfaces are covered with Kapton MLI with α(BOL) = 0.39, ε(BOL) = 0.64 and α(EOL) = 0.50, ε(EOL) = 0.64 thermo-optical coefficients. Venus-EXPRESS spacecraft co-ordinate system is defined as follows: • • • • The origin is located in the center of the s/c to launcher I/F adapter The Z axis is perpendicular to the launcher I/F plane, directed positively through the S/C body The X axis is perpendicular to the Z axis and the solar array drive axis, directed positively trough the of the S/C containing the HGA The Y axis completes the right hand system (directed along the solar arrays)

The ASPERA-4 MU unit is accomodated on the lower part of s/c wall (-Y axis side) of Venus Express spacecraft so that +Xu axis is co-aligned with -Zs/c axis. IMA unit is accommodated on -Z wall of s/c. Sun Aspect angle (the angle between the s/c longitudinal “+Z” axis and the Sun) can be from -100 deg. to +5 deg. at the Communication phase of flight. The main parameters of Venus Observation phase are: • • • • • Inclination: 90 deg. (polar orbit) Argument of pericenter: 110 deg. Pericenter altitude: 400 km Apocenter altitude: 66408 km (period 24h) during nadir pointing phase around pericenter, the s/c is maintained with the “+Z” face pointed towards Venus center.

ASPERA-4

Venus Express

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Observation phase (s/c altitude is below 10000 km)

Stop 65 min eclipse

Start 45 min eclipse

Start 65 min eclipse

Stop 45 min eclipse Start 4h high altitude imaging

Communication phase

Stop 4h high altitude imaging

Figure 1 Operation orbit timeline

5.7 mm.ASPERA-4 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. 0. 64. : 1 2004-04-22 Page: 6 Mass IMA w/o thermal h/w Thermal h/w IMA-MU interconnection cable CoM wrt URF Xu. 3 mm 0. Yu. IMA .0135. -84. Zu ToI wrt URF centered at CoM Ix. 15 % Figure 2 Ion Mass Analyser. 0.0075.0125 kgm AA6061 and AA7075 Stainless Steel 4 of M5x25 Ti Grade 5 4+4 of GE313 fibreglass MIL-C-5541 for J02 (green) 2. Iz Materials Enclosure Aperture grids Fasteners Thermal isolators Surface treatment Flight Cover FC02 2182 g 227 g 283 g 110. Iy.

0553. -109. Iz Materials Enclosure Aperture grids Fasteners Thermal isolators Surface treatment Flight Cover FC04 6819 g 441 g 135. Yu. Iy. Figure 3 Main Unit. 101 mm. 0.ASPERA-4 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.0686 kgm 0.0606. -86. 0.0645 kgm AA6061 and AA7075 Stainless Steel 6 of M4x25 Ti Grade 5 6+6 of GE313 fibreglass MIL-C-5541 for J04 (green) 2. 15 % 15 % 2.0803. 3 mm 109. Iy. Iz ToI wrt URF centered at CoM in CCW position Ix. 0. : 1 2004-04-22 Page: 7 Mass MU w/o thermal h/w Thermal h/w CoM wrt URF in Parking position Xu. Zu ToI wrt URF centered at CoM in Parking position Ix. 3 mm 0. 101 mm.0706. MU . 0. Zu CoM wrt URF in CCW position Xu. Yu.

2. • 2. IMA on the Sun o 45m Venus eclipse o 4h Observation phase (Figure 4) coatings are corresponded to BOL.1 IMA Cold case 1 Steady thermal state: • • • • • • cruise phase IMA unit is turn in switch OFF solar constant is 1320 W/m2 spacecraft interface temperature is 223K solar aspect angle is 0 deg.1.ASPERA-4 2 IMA THERMAL ANALYSIS CASES Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.1.2 IMA Cold case 2 Transient thermal state: • • • • • orbit phase IMA unit is turn in switch OFF solar constant is 2570 W/m2 spacecraft interface temperature is 223K Earth pointing phase o 50m Observation phase. Sensitivity analysis Transient thermal state: • • • • • orbit phase IMA unit is turn in switch OFF solar constant is 2655 W/m2 spacecraft interface temperature is 243K Earth pointing phase o 50m Observation phase. • . coatings are corresponded to BOL. : 1 2004-04-22 Page: 8 The following IMA thermal analysis cases have been considered: 2.1.3 IMA Cold case 2A. IMA on the Sun o 45m Venus eclipse o 4h Observation phase (Figure 4) coatings are corresponded to BOL.

ASPERA-4 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 9 Observation phase Start 45 min eclipse Stop 45 min eclipse Start 4h high altitude imaging Communication phase Stop 4h high altitude imaging Figure 4 IMA Cold case (Venus orbit) .

47.57 instead of 0.1.4 IMA Hot case Transient thermal state: • • • • • orbit phase IMA unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h IMA on the Sun (Figure 5) o coatings are corresponded to EOL.5 IMA Hot case. Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.ASPERA-4 2.1. Sensitivity to radiator ageing Transient thermal state: • • • • • orbit phase IMA unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h IMA on the Sun (Figure 5) coatings are corresponded to EOL α coefficient for silver tape is 0. : 1 2004-04-22 Page: 10 2. • • .

: 1 2004-04-22 Page: 11 Observation phase Stop 65 min eclipse Start 65 min eclipse Start 4h high altitude imaging Communication phase Stop 4h high altitude imaging Figure 5 IMA Hot case .ASPERA-4 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

1.1. • 3. MU on the Sun o 45m Venus eclipse o 4h MU in s/c eclipse (Figure 6) coatings are corresponded to BOL • .2 MU Cold case 2 Transient thermal state: • • • • • • initial data are corresponded with steady state for cold case 1 and solar constant 2570 W/m2 orbit phase MU unit is turn in switch OFF solar constant is 2570 W/m2 spacecraft interface temperature is 223K Earth pointing phase o 50m Observation phase.1 MU Cold case 1 Steady thermal state: • • • • • • cruise phase MU unit is turn in switch OFF solar constant is 1320 W/m2 spacecraft interface temperature is 223K solar aspect angle is 0 deg. Sensitivity analysis Transient thermal state: • • • • • • initial data are corresponded with steady state for cold case 1 and solar constant 2570 W/m2. spacecraft interface temperature 243K orbit phase (transient thermal state) MU unit is turn in switch OFF solar constant is 2570 W/m2 spacecraft interface temperature is 243K Earth pointing o 50m Observation phase. 3. coatings are corresponded to BOL.ASPERA-4 3 MU THERMAL ANALYSIS CASES Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 12 The following MU thermal analysis cases have been considered: 3.3 MU Cold case 2A. MU is on the Sun o 45m Venus eclipse o 4h MU is in s/c eclipse (Figure 6) coatings are corresponded to BOL.1.

: 1 2004-04-22 Page: 13 Observation phase Start 45 min eclipse Stop 45 min eclipse Start 4h high altitude imaging Communication phase Stop 4h high altitude imaging Figure 6 MU Cold case (Venus orbit) .ASPERA-4 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

47. α coefficient for silver tape is 0.07.ASPERA-4 3.17 instead of 0. • • • 3. : 1 2004-04-22 Page: 14 • 3.1. α coefficient for CC/UVS covering is 0.57 instead of 0. • .1. Sensitivity to radiator (SSM CC/UVS) and silver tape ageing Transient thermal state: • • • • • orbit phase MU unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h MU on the Sun (Figure 7) coatings are corresponded to EOL. Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.5 MU Hot case.1.4 MU Hot case Transient thermal state: • • • • • orbit phase MU unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h MU on the Sun (Figure 7) coatings are corresponded to EOL.6 MU Hot case A Transient thermal state: • • • • • orbit phase MU unit is turn in switch ON and Scanner is turn in switch OFF solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h MU on the Sun (Figure 7) coatings are corresponded to EOL.

: 1 2004-04-22 Page: 15 Observation phase Stop 65 min eclipse Start 65 min eclipse Start 4h high altitude imaging Communication phase Stop 4h high altitude imaging Figure 7 MU Hot case .ASPERA-4 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

Table 1 MU operational temperatures Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Operational temp. : 1 2004-04-22 Page: 16 The thermal design both MU and IMA is mainly driven by constraints of their electronic parts and MU Scanner motor. [ºC] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 . Operational temperature ranges for MU and IMA units are given in Table1 and Table2.ASPERA-4 4 THERMAL DESIGN REQUIREMENTS Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

[ºC] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 .ASPERA-4 Table 2 IMA operational temperatures Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 17 Operational temp.

#4). 20 layers Dacron net.5 mil) Crinckled Kapton × vda. : 1 2004-04-22 Page: 18 IMA THERMAL DESIGN AND MATHEMATICAL MODEL The following main requirements for IMA thermal design have been considered in calculation: • • • • • • • • • • • • • • the IMA unit should be thermally decoupled with s/c with 10 mm height special fibreglasses plug and titanium screws of 4× M5 diameter using. external surface of ring radiator should be covered with the same silver tape Table 3 Multilayer insulation blanket design description External Layer Material Internal Layer Material Radiation Shield Material and number of layers Spacer Material And number of layers Additional Comments Effective thermal conductivity Yellow: 25µm (1 mil) Kapton/Al. rings (EQM-020. outer surfaces of rings (EQM-022. the rest surface of sensor unit should be covered with MLI of the same type part of Sensor Housing outer surface (Figure 9) is used as a radiator with 0. 5 layers vda × 12µm (0.76W heat power one thermostat with operating temperature range -24ºC… -28ºC should be installed on the Sensor Housing surface (node#3). EQM-023) should be covered with CuSO4 black covering. ring radiator with external diameter 148 mm.10 W*m-2*deg-1 . 20 layers 1) non-aluminized side of Crinckled Kapton (5 layers of yellow colour side) should be pointed to the Space direction <0. perforated. perforated Al/50µm (2 mil) Kapton/Al.014 m2 area and covered with Sheldahl 5 mil FEP×silver×Inconel ×9703 Tape outer surface of Sensor structure should be also covered with the same silver tape inner surface of Sensor structure should be black anodized or painted with black paint outer surface of Sensor Unit should be black anodized (excluding of radiator area) or IRIDITED inner surface of Sensor Unit should be black anodized inner and outer surfaces of DPU Housing should be anodized black or painted with black paint on the inner surface of Sensor Unit around the MCP holder should be mounted a heater (or heaters) with 5.5 mm (area is 0.ASPERA-4 5 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. internal diameter 127 mm and thickness 1.5 mil) Kapton × vda. DPU unit surface should be covered with “yellow” Kapton MLI according to MLI design description (Table3 and Figure 8) Sensor structure (EQM-009) and Sensor Housing radiator surfaces are not covered with MLI. perforated 12µm (0. nodes #2.0045 m2) coupling with Sensor Housing is use. perforated.

20 Layers Internal Layer Unit Figure 8 Multilayer insulation blanket for IMA and MU +Zu Radiator area 60° +Yu 15° Figure 9 Area of radiator on IMA sensor housing . 5 layers vda×Kapton×vda. 20 layers Spacer (Dacron net). : 1 2004-04-22 Page: 19 External Layer Crinckled Kapton×vda.ASPERA-4 Space Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

ASPERA-4 Table 4 IMA node list Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. . : 1 2004-04-22 Page: 20 The IMA thermal mathematical model was created using a finite difference representation and nodes method as detailed in Figure 10 and Table 4 to Table 10.

15 1 17 11 12 16 Figure 10 IMA unit nodes . : 1 2004-04-22 Page: 21 7 8 9 10 13 .ASPERA-4 2 4 5 3 6 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

39 0.53 0.85 0. Misc. Misc.64 0.75 0.36 0.64 0.84 0.64 0.39 0.50 0.90 0.91 0.09 0.50 0.39 0.75 ρhd 0.36 0.15 0. Misc.84 0. MLI MLI MLI MLI AL-6062 Internal Internal Internal Internal Internal Internal Internal Internal Kapton/Al Kapton/Al Kapton/Al Kapton/Al Silver tape αs 0.75 0.36 0.47 0.15 0.16 0.91 0. Misc.90 0. AL-6062 Misc.25 ρhs - .09 0.10 0.61 0.85 0.09 0.50 0.25 0.10 0.90 ρss - εh 0.ASPERA-4 Table 5 IMA BOL surface properties Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.75 0.64 0.53 ρss - εh 0.36 0. Misc.50 0.50 0.91 0.47 0.25 ρhs - Table 6 IMA EOL surface properties Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Material Thermal finish AL-6062 Silver tape AL-6062 AL-6062 CuSO4 black Silver tape CuSO4 black AL-6062 Misc.50 0.25 0.09 0.36 0. Misc.53 0.10 ρsd 0.61 0. Misc.25 0.50 0.16 0.75 0. Misc.91 0.36 0.75 ρhd 0. MLI MLI MLI MLI AL-6062 Internal Internal Internal Internal Internal Internal Internal Internal Kapton/Al Kapton/Al Kapton/Al Kapton/Al Silver tape αs 0.61 0.36 0.50 0.64 0.39 0.64 0. : 1 2004-04-22 Page: 22 Material Thermal finish AL-6062 Silver tape AL-6062 AL-6062 AL-6062 CuSO4 black Silver tape CuSO4 black Misc. AL-6062 Misc.64 0. Misc.64 0.25 0.61 0.36 0. Misc.47 ρsd 0.

053 0.200 0.0099 0.250 0.004 0.4 45. 0.054 0.226 0.141 0. misc.s/c structure Number 1 1 1 1 C [W/ºK] 0.5 56. misc.0213 0.9 8. 0.3 22.ASPERA-4 Table 7 IMA node properties Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing+Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Material AL-6062 AL-6062 AL-6062 AL-6062 misc.0145 0.0400 0.s/c structure Foot-1*M5-washer.113 .10 0.4 4. : 1 2004-04-22 Page: 23 mCp [J/ºK] 61.0830 0. MLI MLI MLI MLI AL-6062 Area [m2] 0.6 4.0080 0.30 0.3 Non-Op.0145 Node 11 11 11 11 Conductive i/f node 1 1 1 1 Table 9 IMA internal conductive couplings From Node 1 1 1 3 3 3 3 3 3 3 5 6 7 8 Name Aperture Aperture Aperture Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Outer plate MCP Amplifier Board Digital Board To Node 2 4 17 5 10 11 13 14 15 17 6 7 8 9 Name Outer Deflector Inner Deflector Ring radiator Outer plate HVPS Board 2 DPU Housing Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) Ring radiator MCP Amplifier Board Digital Board HVPS Board 1 Coupling GL [W/ºK] 0.5 15. 0.2 39. 0.0 88.0110 0.75 0.28 0. 0.0011 0.400 0.0420 0. 1. misc.0145 0. 0.0 100.0059 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.2 358.0630 0.650 1.8 52.0 45.2 954.76 - Power diss [W] 0.0080 0. misc.210 0.0099 0.0540 0. 0. heater [W] 5.0145 0. AL-6062 misc.0110 0.0079 0. misc. Table 8 IMA interface conductive couplings Type Foot-1*M5-washer-s/c structure Foot-1*M5-washer.0054 0.0099 0.30 0. 0.s/c structure Foot-1*M5-washer.7 15.81 0.0099 0.0500 0.7 320.141 0. 0.

87*10-2 0.14*10-2 .04*10-2 0.01*10-2 0. : 1 2004-04-22 Page: 24 Name HVPS Board 2 CPU + HK Boards DPU MLI Coupling GL [W/ºK] 0.0063 Table 10 IMA radiative couplings Node 1 1 1 2 2 2 3 3 3 3 3 3 3 4 4 4 5 6 7 8 9 11 13 14 15 16 17 Name Aperture Aperture Aperture Outer Deflector Outer Deflector Outer Deflector Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Inner Deflector Inner Deflector Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 DPU Housing Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Node 2 4 4 17 5 6 7 8 9 10 5 17 6 7 8 9 10 12 Name Space Outer Deflector Inner Deflector Space Inner Deflector Ring radiator Space Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 Space Outer plate Ring radiator MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 CPU + HK Boards Space Space Space Space Space GR [m2] 1.00*10-2 0.62*10-2 0.32*10-2 0.64*10-2 0.67*10-2 2.57*10-2 1.28*10-2 0.39*10-2 0.05*10-2 0.32*10-2 0.81*10-2 0.38*10-2 0.27*10-2 0.34*10-2 1.15*10-2 0.05*10-2 0.20*10-2 0.27*10-2 0.29*10-2 4.56*10-2 3.ASPERA-4 From Node 9 11 11 Name HVPS Board 1 DPU Housing DPU Housing To Node 10 12 16 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.09*10-2 0.075 0.25*10-2 0.14*10-2 0.113 0.

motor box (excluding “+Zu” ) should be covered with “yellow” Kapton MLI according to MLI design description (Nable3 and Figure 8) external surfaces of DPU housing (excluding of radiator internal surface) should be Iridited internal surface of DPU housing (excluding of radiator internal surface) should be painted with paint or black anodized special radiation shield is installed on the external surface of ELS cylindrical part internal surface of radiation shield should be Iridited external surface of radiation shield should be covered with Sheldahl 5 mil FEP×silver×Inconel ×9703 Tape external surface of DPU housing of “+Xu” side should be covered with Sheldahl 5 mil FEP×silver×Inconel ×9703 Tape internal surface of DPU housing “+Xu” side should be painted with paint or black anodized internal surface of motor box should be painted with paint or black anodized part of external surface of motor box covered with MLI should be IRIDITED part of external surface of motor box not covered with MLI (excluding screws heads surfaces) should be covered with Sheldahl 5 mil FEP×silver×Inconel ×9703 Tape motor box screws heads surfaces should be painted with white paint external surface of motor box bottom should be IRIDITED internal surface of motor box bottom should be painted with paint or black anodized external and internal surfaces of NPD-1&2 housings should be IRIDITED following electrical heaters with total power 17.75 W + 0.16 W (5. : 1 2004-04-22 Page: 25 MU THERMAL DESIGN AND MATHEMATICAL MODEL The following main requirements for thermal design of MU have been considered: • • • • • • • • • • • • • • • • • the MU should be thermally decoupled with s/c with special fibreglasses plug ME-ASP-MD5225.27) with power 15. the ELS Housing external surface should be Iridited NPI Housing external surfaces should be covered with Sheldahl 5 mil FEP×silver×Inconel ×9703 Tape the ELS Housing internal surface and NPI Housing internal surface should be IRIDITED two thermoswitches for heaters control are necessary one thermoswitch should be installed on NPI housing surface other thermoswitch should be installed on the Motor box surface special radiator for sensor head cooling is necessary special radiator VE-ASP-MD-6000 of 0.on the DPU housing surfaces and radiator surface (nodes #30.ASPERA-4 6 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.22 W+4.33 W should be installed: .72 W) the ELS Top Plate external surface should be covered with Sheldahl 5 mil FEP×silver×Inconel ×9703 Tape the ELS Top Plate internal surface should be covered with CuSO4 black covering.95 W + 0. ME-ASP-MD-5226 and titanium screws of 6×M4 diameter using the DPU housing (excluding “+Zu” side and “+Xu” side).on the Scanner motor box surface (node #19) with powers 0.31.22 W + 5.0186 m2 area should be coupled thermally with DPU Housing sides external surface of radiator should be covered with Low Absorptance Conductive Coated SSMs (CC/UVS/SSMs) of 150 µm thickness internal surface of radiator should be painted with paint or black anodized • • • • • • • • • • • • . NPD-1 and NPD-2 housings.47 W .

: 1 2004-04-22 Page: 26 The thermal mathematical model was created using a finite difference representation and nodes method as detailed in Figure 11 and Table 11 to Table 17. .ASPERA-4 Table 11 MU node list Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

: 1 2004-04-22 Page: 27 11.29-31 27 12 13 14 15 16 17 23-26 21 20 18 19 22 6 8 10 28 Figure 11 Main Unit nodes .ASPERA-4 1 2 32 3 4 5 Venus Express 7 9 Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

64 0.90 0. AL-6062 AL-6062 AL-6062 AL-6062 Thermal finish Silver tape Internal Internal.25 0. Internal.64 0.36 0. misc.75 0.10 0. internal internal Silver tape Silver tape Internal.ASPERA-4 Table 12 MU BOL surfaces properties Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Material AL-6062 AL-6062 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.39 0.10 0.64 0.90 0.25 0.90 ρss - εh 0.61 0.10 0.61 0.90 0. AL-6062 misc. misc. misc. AL-6062 misc. misc.25 0.36 0. Internal.75 0.39 0.64 0. Internal. Internal Internal Internal Internal.61 0. Internal. AL-6062 AL-6062 misc.75 0.10 0.05 0. misc. misc. misc.39 0.75 ρhd 0.61 0. misc.25 ρhs - .80 0. misc.36 0. MLI MLI MLI MLI MLI AL-6062 misc.61 0. Kapton/Al Kapton/Al Kapton/Al Kapton/Al Kapton/Al SSM CC/UVS internal internal internal internal Silver tape αs 0.75 0.36 0. : 1 2004-04-22 Page: 28 misc.25 0.20 0.90 0.64 0.36 0. Silver tape Internal Internal internal Internal.39 0. misc.10 ρsd 0.39 0.95 0. misc.

: 1 2004-04-22 Page: 29 misc.53 0. misc.50 0. internal internal Silver tape Silver tape Internal. Internal.75 0. Internal.75 0.25 0.25 0.20 0.75 0.50 0.47 0.50 0.36 0.80 0. MLI MLI MLI MLI MLI AL-6062 misc.47 0.50 0.93 0.50 0.64 0.47 ρsd 0. misc. misc. misc.64 0.36 0.25 0.75 0.50 0. misc.47 0. misc.64 0. misc. AL-6062 AL-6062 AL-6062 AL-6062 Thermal finish Silver tape Internal Internal.47 0.53 ρss - εh 0.25 0.50 0. Silver tape Internal Internal internal Internal.64 0.50 0.53 0. AL-6062 AL-6062 misc.36 0.25 ρhs - . Internal Internal Internal Internal. misc.50 0.07 0.53 0.50 0.36 0.75 ρhd 0. Internal. misc. Internal.64 0. misc. AL-6062 misc. AL-6062 misc.36 0. Kapton/Al Kapton/Al Kapton/Al Kapton/Al Kapton/Al SSM CC/UVS internal internal internal internal Silver tape αs 0. misc.53 0.ASPERA-4 Table 13 MU EOL surfaces properties Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Material AL-6062 AL-6062 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

31 2.001 0.6 88.033 0.5 107. ELS MCP misc.0 94.040 0.018 0.0 695.22 - Power diss [W] 0.075 0.ASPERA-4 Table 14 MU node properties Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name Material Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. DPU Housing “+Xu” AL-6062 DPU DC/DC misc.007 0. ELS HVPS (lower board) misc.019 0.7 166.033 0.0 88.039 0.014 0.437 0. : 1 2004-04-22 Page: 30 Area [m2] 0.032 0.041 0. 0. DPU Processor Board misc. 0.019 0.9 56.80 - Table 15 MU Interface conductive couplings Type Foot-1*M4-washer-s/c structure Foot-1*M4-washer.70 1.0 247. ELS FEE Board misc.6 122.043 0.s/c structure Foot-1*M4-washer-s/c structure Foot-1*M4-washer-s/c structure Number 1 1 1 1 1 1 C [W/ºK] 0.0 24.005 0.7 17.263 0.s/c structure Foot-1*M4-washer. i/f node 1 1 1 1 1 1 .671 0.17 4. NPD1 misc. 0.0143 0.7 70.4 22. Motor Board misc.033 0.7 46.78 1.6 122.032 0. ELS HVPS (upper board) misc.22 5.0 28.101 0. 5.009 0. NPI Housing AL-6062 NPI Amplifier Board misc. 3.50 0.0143 0.15 0.6 695.004 0.6 78.9 415.0143 0. Motor Wheel AL-6062 Motor Box AL-6062 Motor misc. DPU Housekeeping misc.671 0.010 0.013 0.0 22.0143 Node 19 19 19 19 19 19 Cond.9 29.9 126. NPI MCP misc.5 96. MLI Motor Box MLI MLI NPD+DPU “-Xu” MLI MLI NPD+DPU “+Yu” MLI MLI NPD “+Zu” MLI MLI NPD +DPU “-Yu” MLI Radiator AL-6062 Mother Board misc.3 333.6 Non op.20 0. Board DPU HV Board misc.3 37.263 0.2 111. NPD2 misc.0 114.002 0.1 126.009 0.0143 0.2 143.019 0.019 0. heater [W] 2.024 0. DPU Housing “-Zu” AL-6062 DPU Housing “+Yu” AL-6062 DPU Housing “-Yu” AL-6062 Radiation shield AL-6062 mCp [J/ºK] 21.022 0.024 0.s/c structure Foot-1*M4-washer.72 5.0 14.5 56.0143 0.024 0.023 0.041 0.020 ELS Top Plate AL-6062 ELS Housing AL-6062 ELS Deflector misc.

051 0.005 5.770 .034 0.00096 0.048 0.449 0.022 0.075 1.026 0.281 0.512 0.035 0.190 0.0012 0.512 0. : 1 2004-04-22 Page: 31 Name ELS Housing ELS Deflector ELS HVPS (upper board) ELS FEE Board NPI Housing ELS HVPS (upper board) ELS FEE Board DPU DC/DC ELS HVPS (lower board) ELS FEE Board NPI Amplifier Board NPI MCP DPU Housing “+Xu” NPI MCP Radiator DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” DPU Housekeeping Board Mother Board DPU Housing “+Yu” DPU Housing “-Yu” DPU HV Board Mother Board DPU Processor Board Mother Board Mother Board NPD2 MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Mother Board DPU Housing “+Yu” DPU Housing “-Yu” MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Mother Board Motor Box Motor DPU Housing “-Zu” Motor Coupling GL [W/ºK] 0.410 0.300 0.048 2.040 0.00096 0.014 0.021 0.040 2.281 0.00120 0.00096 0.030 0.022 0.0032 0.900 0.00096 0.970 0.150 0.660 0.172 0.850 0.ASPERA-4 Table 16 MU internal conductive couplings From Node 1 2 2 2 2 3 3 7 4 6 8 8 8 9 11 11 11 11 12 12 12 12 13 13 14 14 15 16 16 16 16 16 16 16 17 17 17 17 17 18 18 18 19 To Name Node ELS Top Plate 2 ELS Housing 3 ELS Housing 4 ELS Housing 7 ELS Housing 8 ELS Deflector 4 ELS Deflector 7 ELS FEE Board 12 ELS HVPS (upper board) 5 ELS MCP 7 NPI Housing 9 NPI Housing 10 NPI Housing 11 NPI Amplifier Board 10 DPU Housing “+Xu” 27 DPU Housing “+Xu” 29 DPU Housing “+Xu” 30 DPU Housing “+Xu” 31 DPU DC/DC 13 DPU DC/DC 28 DPU DC/DC 30 DPU DC/DC 31 DPU Housekeeping Board 14 DPU Housekeeping Board 28 DPU HV Board 15 DPU HV Board 28 DPU Processor Board 28 NPD1 17 NPD1 24 NPD1 25 NPD1 26 NPD1 28 NPD1 30 NPD1 31 NPD2 23 NPD2 24 NPD2 25 NPD2 26 NPD2 28 Motor Wheel 19 Motor Wheel 20 Motor Wheel 29 Motor Box 20 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.210 0.201 0.100 0.512 0.300 0.300 0.

02*10-2 0.03*10-2 1.35*10-4 0.110 Table 17 MU radiative couplings Node 1 1 32 2 2 2 2 3 3 3 4 5 6 7 8 8 8 9 9 10 11 11 11 11 11 11 12 12 12 12 12 Name ELS Top Plate ELS Top Plate Radiation shield ELS Housing ELS Housing ELS Housing ELS Housing ELS Inner Dome Assy ELS Inner Dome Assy ELS Inner Dome Assy ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE board NPI Housing NPI Housing NPI Housing NPI Sensor NPI Sensor NPI MCP NPI MCP DPU Housing “+Xu” DPU Housing “+Xu” DPU Housing “+Xu” DPU Housing “+Xu” DPU Housing “+Xu” DPU DC/DC DPU DC/DC DPU DC/DC DPU DC/DC DPU DC/DC Node 2 3 4 5 7 4 5 6 5 7 7 8 9 10 10 12 12 27 28 30 31 13 27 28 30 31 Name Space ELS Housing Space ELS Inner Dome Assy ELS HVPS (upper board) ELS HVPS (lower board) ELS FEE board ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS HVPS (lower board) ELS FEE board ELS FEE board NPI Housing Space NPI Sensor NPI MCP Space NPI MCP DPU DC/DC Space DPU DC/DC Radiator DPU Housing “+Zu” DPU Housing “+Yu” DPU Housing “-Yu” DPU HV board Radiator DPU Housing “+Zu” DPU Housing “+Yu” DPU Housing “-Yu” GR [m2] 0.10*10-2 0.05*10-2 1.04*10-2 0.02 0.02*10-2 0.417 0.64*10-2 0.18*10-4 0.35*10-2 0.86*10-2 0.54*10-2 0.66*10-2 0.18*10-4 0.04*10-2 0.03 0.05*10-2 0.15*10-2 0.11*10-2 .300 0.09*10-2 1.79*10-2 1.250 0.45*10-2 0.ASPERA-4 From Node 19 19 21 27 27 28 29 29 32 Name Motor Box Motor Box Motor Board Radiator Radiator Mother Board DPU Housing “-Zu” DPU Housing “-Zu” Radiation shield To Node 21 22 28 30 31 29 30 31 8 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.11*10-2 0.01*10-2 0.14*10-2 0.05*10-2 0. : 1 2004-04-22 Page: 32 Name Motor Board MLI Motor Box Mother Board DPU Housing “+Yu” DPU Housing “-Yu” DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” NPI Housing Coupling GL [W/ºK] 1.351 2.18*10-2 1.0041 0.88*10-4 0.28*10-2 0.005 0.04*10-2 0.417 1.351 0.

22*10-2 1.12*10-2 0.91*10-2 1.35*10-2 0.10*10-2 0.11*10-2 0.10*10-2 0.50*10-2 0.09*10-2 0.09*10-2 0.15*10-2 0.25*10-2 0.09*10-2 1.50*10-2 0.20*10-2 0.10*10-2 2.11*10-2 0.10*10-2 0.ASPERA-4 Node 13 13 13 13 13 14 14 14 14 14 15 15 15 15 15 16 16 16 17 17 18 18 18 18 19 19 19 19 22 23 24 25 26 27 27 27 27 28 28 28 30 32 Name DPU HV board DPU HV board DPU HV board DPU HV board DPU HV board DPU Housekeeping board DPU Housekeeping board DPU Housekeeping board DPU Housekeeping board DPU Housekeeping board DPU board DPU board DPU board DPU board DPU board NPD1 NPD1 NPD1 NPD2 NPD2 Motor Wheel Motor Wheel Motor Wheel Motor Wheel Motor Box Motor Box Motor Box Motor Box MLI Motor box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Radiator Radiator Radiator DPU Housing “+Zu” DPU Housing “+Zu” DPU Housing “+Zu” DPU Housing “+Yu” Radiation shield Node 14 27 28 30 31 15 27 28 30 31 16 27 28 30 31 17 18 18 19 20 21 20 21 23 28 30 31 29 30 31 31 2 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.11*10-2 0.14*10-2 0.46*10-2 0.11*10-2 0.22*10-2 1.12*10-2 0.75*10-2 0. : 1 2004-04-22 Page: 33 Name DPU Housekeeping board Radiator DPU Housing “+Zu” DPU Housing “+Yu” DPU Housing “-Yu” DPU board Radiator DPU Housing “+Zu” DPU Housing “+Yu” DPU Housing “-Yu” NPD1 Radiator DPU Housing “+Zu” DPU Housing “+Yu” DPU Housing “-Yu” Space NPD2 Motor Wheel Space Motor Wheel Space Motor Box Motor Motor board Space Motor Motor board MLI NPD+DPU “-Xu” Space Space Space Space Space Space DPU Housing “+Zu” DPU Housing “+Yu” DPU Housing “-Yu” DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” DPU Housing “-Yu” ELS Housing GR [m2] 0.10*10-2 1.12*10-2 0.53*10-2 1.14*10-2 0.14*10-2 0.09*10-2 0.01 0.15*10-2 0.07*10-2 0.20*10-2 1.22*10-4 0.14*10-2 0.05*10-2 0.07*10-2 0.02*10-2 .89*10-2 0.74*10-2 1.

60 Operational temp. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 Thermal flux from IMA unit to s/c: Q = +1.47 -28.46 -29.19 -140. . Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.46 -32.45 -30.47 -28.1) Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Predicted temp.1.67 -140.92 -27.1 THERMAL CALCULATIONS RESULTS. Predicted temperatures for IMA nodes.40 -142.1. : 1 2004-04-22 Page: 34 The following tables give the predicted temperatures for every nodes of the model.73 -152.94 -28.46 -28.1 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 IMA Cold case 1 (2. 7.67 -32.47 -28. [°C] -35.46 -28.ASPERA-4 7 7.61 -28.01 W.

70 -24.61 -20.15 -25.56 -28.18 -28. heaters are OFF -25.92 -141.42 -29. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 Thermal flux from IMA unit to s/c: Q = +1.30 -4.71 -28.1.1.14 -25. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator .71 -141.02 -7.67 -18.46 -139.62 -139.02 -24.19 W.06 -24.26 -25.05 -7. in steady state [°C].55 -28.01 -151.63 -140.05 -25. heaters are ON -24.32 -44.04 -25.76 Operational temp.21 +23.12 -22.16 -25.57 -140.2) Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Predicted temp.13 -28. in steady state [°C].98 -24.43 -139.26 Maxi predicted temperature in transient state [°C] +0.76 -24.12 -14.04 -25.81 -29.37 -28.89 +56.82 -26.92 -27.70 -25.89 -28.24 Operational temp.18 -25.13 -28.23 -3.75 -24.2 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.11 -151.16 -28.41 Predicted temp.ASPERA-4 7.76 +65.09 -29.79 -25.20 -30.63 +47.87 -44.86 -24. : 1 2004-04-22 Page: 35 IMA Cold case 2 (2.16 -25.14 +34. Node Name Min predicted temperature in transient state [°C] -40.15 W to +1.11 -25.72 -141.80 -27.25 -29.05 -28.66 -140.15 -151.

97 +48.01 +58.87 -24.17 -20. in steady state [°C].03 -25.01 -151. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 . heaters are OFF -24.48 -140.13 -27.ASPERA-4 7.54 -27.84 -27.12 -25.33 -28.80 -12.22 -25. : 1 2004-04-22 Page: 36 IMA Cold case 2A.00 -6.49 -23.63 -23.70 +67.70 -139.1.13 -151.1.11 -21.21 -24. Sensitivity analysis (2. heaters are ON -24.65 -141.28 W to +1.95 -3.59 -139.06 -25.19 -151.30 -139.88 -27.43 -22.38 +34.81 -25.16 -27.09 Operational temp.64 -16.47 -25.00 -6.76 Max predicted temperature in transient state [°C] +2. in steady state [°C].05 -25.06 -24.30 W.47 -44.3) Predicted temp.95 -27.30 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.97 -26. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 Thermal flux from IMA unit to s/c: Q = +1.96 -24.17 -140.75 -28.31 -140.78 -24.02 -23.39 -25.99 -141.95 -22.37 -28.58 -25.18 Operational temp.86 -45.28 -27.93 -24.3 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Predicted temp.71 -25.00 -2.86 -141.42 -17.11 -25.62 -27.38 -21. Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Min predicted temperature in transient state [°C] -41.88 +24.48 -28.

08 +27.27 +22.27 +86.60 +21. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 Thermal flux from s/c to IMA unit: Q = -1.42 +104.20 +13.07 +26.49 +43.83 +46.90 +24.85 +26. Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Min predicted temperature in transient state [°C] -17.25 Operational temp.25 +41.41 -137.01 -122.68 W.56 -142.03 +45.4) Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Predicted temperature in steady state [°C] +13.49 +23.45 -100.42 +17. : 1 2004-04-22 Page: 37 IMA Hot case (2.58 +44.31 +64.04 -24.84 +81.1.23 +17.76 -129.25 +22.63 Operational temp.02 +15.48 -45.97 -130.81 +18.41 +118.03 +17.27 +40.1.38 +115.07 +6.11 Max predicted temperature in transient state [°C] +56.12 +27.94 +19.ASPERA-4 7.30 +45.85 +48.01 -25.77 +46.06 -0.49 +19.52 +21.44 -128.4 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 .77 +22.69 +16.46 +45.

69 -23.08 +19.59 +11.59 +45.41 +29.5 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.26 +86.50 +52.78 +118. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 Thermal flux from s/c to IMA unit: Q = -1.90 +81.94 +23.73 +1.65 +18.93 +29.71 -23.81 +24.15 -128. : 1 2004-04-22 Page: 38 IMA Hot case.16 +27.71 +49.61 +24.20 +24.94 +7.68 -129.11 +28.23 +19.52 -122.02 +20.56 W.22 +43.01 +49.30 +52. [°C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 .11 -100. Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (“+Xs/c” side) Sensor MLI (“-Xs/c” side) Sensor MLI (“-Ys/c” side) DPU MLI Ring radiator Min predicted temperature in transient state [°C] -15.1.ASPERA-4 7.33 -142.11 +19.43 +44.82 +48.36 +64.22 +21.01 Operational temp.51 -128.99 +53. Sensitivity to radiator ageing (2.40 +30.01 +107.85 +26.40 +118.44 +48.56 -45.5) Predicted temperature in steady state [°C] +17.91 Operational temp.43 +23.44 Max predicted temperature in transient state [°C] +61.45 -137.62 +18.89 +15.1.

1. .44 -15.10 -28.95 -27.30 Operational temp.71 -23.2 Predicted temperatures for MU nodes.29 -25. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 Thermal flux from MU unit to s/c: Q = +2. Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.1) Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Predicted temp.19 -23.19 -15.92 -14.ASPERA-4 7. 7.01 -27.1 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 MU Non-operating cold case 1 (3.94 -17.54 -18.68 -17.92 -134.83 -26.11 -15.30 -25.48 -14.47 +101.77 -14.25 -14.07 -139.13 -133.49 -25. : 1 2004-04-22 Page: 39 The following tables give the predicted temperatures for every nodes of the model.53 -27.70 -28.05 -17.2.31W.44 -139.13 -23.37 -25.71 -15. in steady state [°C] -35.10 -14.

43 -22.78 -15.63 -28.38 -30.57 -25.80 -131.89 Operational temp.67 -26.69 -139.97 -11.2) Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Predicted temp. heaters are ON -33.66 -21.27 -13.81 -15.88 +168. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 Thermal flux from MU unit to s/c: Q = +2.54 -25.00 -23.22 -25. in steady state [°C].89 -23.54 -22. heaters are OFF -37.00 -131.77 -27.94 W.57 -17.36 -15.03 -20.40 -25.ASPERA-4 7.63 -139.66 -22.75 -15.79 -23.51 -31.2.2 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.08 -12.72 -12.83 -28.43 -25.16 -29.51 -22.91 -21. : 1 2004-04-22 Page: 40 MU Non-operating cold case 2 (3.81 +168.35 -127.83 -15.51 -23.60 -12.64 -22.11 -10.85 -127.53 -139.72 -139.89 -26.76 -21. in steady state [°C].57 -28.41 -25.85 -22.59 -25.97 -13.1.83 -29.13 -20.88 -22.20 -11.57 -10.40 -10. .60 Predicted temp.35 -11.07 -23.49 W to Q = +2.62 -11.

61 -31.41 -18.28 -19.02 -139.73 -23.52 -27.32 -29. in transient state [°C] -19.09 -20.15 -29.50 -16.84 -21.70 -129.36 -29.37 -19. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 .59 -24.52 -29.37 -29. : 1 2004-04-22 Page: 41 Min predicted temp.17 -29.93 -23.53 +177.52 -17.36 -23.88 -24.42 -28.27 -19.58 -31.65 -19.41 -29. in transient state [°C] -37.36 -16.31 -22.75 -28.22 -20.52 -28.54 +168.91 -142.66 -28.95 Operational temp.61 -30.74 -28.69 -50.09 -28.08 -22.54 -28.09 -16.26 -114.62 -31.01 -28.01 -23.41 -30.15 -18.42 -19.54 -29.17 -31.25 -21.76 -28.50 -29.23 -28.68 -23.89 Max predicted temp.33 -16.54 -22.59 -135.02 -75.72 +176.ASPERA-4 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.

29 -22.33 -11.58 -11.17 -14.48 -25.50 -27.79 -131.3) Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Predicted temp.1.00 -24.42 -19.70 -28.28 -19.16 -23.00 +168.58 -127.74 -20.66 -25.86 -26.23 -12.23 -23.31 W to Q = +1.36 -10.93 -17.05 -19.07 -21.69 -14.56 W.33 -29. heaters are ON -33.95 -15.36 -25.52 -12. : 1 2004-04-22 Page: 42 MU Non-operating cold case 2A (3.24 -25.3 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 Thermal flux from MU unit to s/c: Q = +1.67 -127.65 -15.36 -23. in steady state [°C].67 -26.68 -139.72 -139.35 Operational temp.79 -139.16 -26.95 -20.52 -11.92 -11. in steady state [°C].35 -26.84 -139.20 -10.34 -23. heaters are OFF -36.89 -11.2.ASPERA-4 7.65 -29.23 -16.02 -11.67 -24.06 -17.14 +168.92 -12.29 -10.67 -12.07 -30.45 -12. .77 -11.68 -25.90 -131.71 Predicted temp.63 -21.18 -26.79 -14.

80 -28.85 -29.79 -29. in transient state [°C] -19.28 -143.86 -23.90 -18.01 -75.03 -29.96 Max predicted temp.98 -28.08 +168.43 -21.18 -31.24 -28.81 -28.13 -21.30 -27.18 -29.07 -29.53 Operational temp.78 -28.11 -134.11 -18. : 1 2004-04-22 Page: 43 Min predicted temp.04 -139.31 -30.31 -29.50 -30.05 -16.23 -22.55 -18.18 -18.12 -28.29 -22.46 -28.67 +177.45 -142.77 -28.55 -15.34 -28. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 .34 -28.28 -15.21 -50.37 -15.56 -113.86 -28.49 -29.70 -18.24 -18.41 -21.37 -23.45 -16.30 -19.57 -28.29 -18.58 +176.77 -21. in transient state [°C] -37.55 -20.ASPERA-4 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.83 -29.74 -19.91 -24.03 -28.88 -19.56 -18.80 -27.

07 +48.65 -118.75 +44.55 +53. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 Thermal flux from MU unit to s/c: Q = +0. .37 +47.51 +56.14 +47.14 +39. : 1 2004-04-22 Page: 44 MU Operating hot case (3.15 +47. Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Predicted temp.82 +47.27 Operational temp.2.52 +48.08 +187.4) .18 +44.00 +48.93 +49.1.45 -117.53 +42.39 -73.ASPERA-4 7. in steady state [°C] +21.50 +43.02 +38.87 +54.07 +38.15 +41.38 +48.02 +42.18 +45.17 +43.4 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.94 +57.18 -128.34 W.56 +58.30 +44.

07 +43.42 +45.31 +41.95 +28.57 +42.15 +26. in transient state [°C] +5.45 +35.54 +187.66 -128.54 +19.69 +39.51 -119.18 +28.72 +45.57 +33.94 -105.33 +99.38 +47.91 +47.23 +54.01 +39.22 +38.25 +46.07 +22.45 +34.97 Max predicted temp in transient state [°C] +71.56 +43.51 -38. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 . : 1 2004-04-22 Page: 45 Min predicted temp.69 -122.46 +38.45 +14.35 Operational temp.00 +18.19 +39.69 +22.48 -73.96 +50.91 +43.11 +46.42 +47.81 +45.89 +51.31 +28.53 +50.72 +41.06 +48.42 +48.52 +34.28 +45.34 +46.93 +38.91 +34.98 +57.85 +19.43 +36.97 +48.90 +35.91 +35.91 +47.99 +51.ASPERA-4 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.91 +47.64 +188.57 -25.43 +45.

00 +55.37 +56.1. : 1 2004-04-22 Page: 46 MU Operating hot case.86 +52.75 +56.26 +188.18 +61.13 +54.44 +52.27 +46.36 +55.84 +47.06 -69.35 +61.19 +56.58 +46.44 +51. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 Thermal flux from MU unit to s/c: Q = +0.86 +59.29 +52. Sensitivity to radiator and silver tape ageing (3.77 -116.26 +65.2.ASPERA-4 7.77 Operational temp.19 +66. in steady state [°C] +28. .23 +56.5) Predicted temp.09 +55.56 +64.5 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.99 +52.73 +53.97 W.34 -117.64 +53.09 +50.02 +50.12 -126.

in transient state [°C] +9. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 .21 +43.33 +44.05 +52.38 +44.56 -70.00 +39.26 +60.77 +24.67 +52. in transient state [°C] +86.03 +47.61 +63.22 +50.61 +19.87 +52.75 +40.44 Max predicted temp.60 +53.51 -24.75 +50.00 +54.35 +24.01 +52.78 +53.20 +52.82 +34.77 +60.06 +188.14 +43.76 +34.20 +52.26 +54.77 +53.09 +61.51 -38.44 +27.63 +40.87 +45.89 +31.19 +33.34 +41.33 +52.30 +27.18 +57.69 +57.59 -126.49 +57.95 +188.26 +50.90 +53.13 +99. : 1 2004-04-22 Page: 47 Min predicted temp.54 +45.03 -121.37 +41.35 -105.ASPERA-4 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.65 -118.68 +40.56 +40.50 Operational tem.39 +52.24 +23.02 +53.91 +56.61 +39.67 +50.

01 +52.79 +40.33 +41.55 +40.03 +33. : 1 2004-04-22 Page: 48 MU Operating hot case A (3.34 -119.6) .26 +33.74 W.34 +40.6 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.80 +42.23 +33.12 +50.61 Operational temp.1. in steady state [°C] +17.41 +37.00 +185.73 +38. Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Predicted temp.34 +40.83 +40.37 +38. .99 +37.11 -129. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 Thermal flux from s/c to MU unit: Q = -0.08 +38.ASPERA-4 7.51 +39.30 -119.17 +37.33 +40.32 +41.2.30 +41.75 -79.55 +36.43 +40.50 +40.37 +45.

67 +41. [°C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120 .96 +39.07 +36.69 +39.80 -106.30 +32.01 +30.20 +14.71 +39.67 +38.21 +32.16 -25.30 -38.13 +46.01 +46.72 +27.49 +38.55 +38.75 +14.67 Operational temp.41 +30.67 +21.53 +37.52 +42.78 +16.35 +36.79 +31.35 -123.11 +38.ASPERA-4 Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing “+Xu” DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU “-Xu” MLI NPD+DPU “+Yu” MLI NPD “+Zu” MLI NPD +DPU “-Yu” Radiator Mother Board DPU Housing “-Zu” DPU Housing “+Yu” DPU Housing “-Yu” Radiation shield Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev.58 +48. : 1 2004-04-22 Page: 49 Min predicted temp.37 +23.04 +187.20 +36.29 +20.49 +42.09 +43.43 +30.36 +50.92 +43.90 Max predicted temp in transient state [°C] +68.92 +27.63 +35.66 +40.98 +30.13 +99.43 -121.83 +37.01 +43.62 +23.63 -129.46 +32.72 +188.12 +35.65 +26.63 +13.67 +9.47 +28. in transient state [°C] +0.67 +27.98 +29.01 +32.95 -79.07 +39.15 +35.26 +16.

In hot operational case (sensitivity to radiator and silver tape aging) temperatures of motor and electronic boards are get out of their required temperature range both steady state and transient state on the all phases of orbital flight.89°).9. 7.). 20(51.17. At the same state temperatures of electronics boards are some lower than their operational limits but not satisfy to margin requirements (10 deg.17. : 1 2004-04-22 Page: 50 The IMA unit thermal control allows good results on keeping representative IMA nodes in their required temperature range for the all its cold cases. For the hot case (2.97°) are great than required (50°) and temperatures of nodes ## 6.1.1. In hot operational case (3.). On the Observation phase temperatures of nodes ## 4.10.4) all temperatures of the IMA nodes are corresponded to its operational levels on the Communication phase.1. On the Observation phase all temperatures of the IMA nodes are corresponded to its operational levels but temperatures of nodes ## 6.12.15.21.). For the hot operational case (3.7.12.7. 3.7.12 are not satisfied to margin requirements (10 deg.5. 4.12.13 are also lower than their operational limits but not satisfy to margin requirements (10 deg.28 are lower than their operational limits but not satisfy to margin requirement (10 deg.8 are not satisfied to margin requirements (10 deg.6.14. For the hot case (2.5) all temperatures of the IMA nodes are also corresponded to its operational levels on the Communication phase.16. 2.28 are lower than their operational limits but not satisfy to margin requirements (10 deg.ASPERA-4 8 CONCLUSIONS 1.). 5.).87°) is great than required (50°) on steady state before beginning of the Observation phase.6 / scanner motor is OFF) on steady state at the Communication phase temperatures of nodes ##5.13.15.8.4) temperature of scanner motor (57. On the Observation phase temperatures of nodes #4(50. Venus Express Reference Issue Date Volume : : : : VE-ASP-DS-0002 3 Rev. The MU unit thermal control allows good results on keeping representative MU nodes in their required temperature range for the all cold cases.42°).). #13(50.23°).7. . On the Observation phase all temperatures of the IMA nodes are corresponded to its operational levels but temperatures of nodes ## 6.16. 6.1. #5(51.