Professional Documents
Culture Documents
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from sand to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 2
References
overview books 1. Introduction to Semiconductor Manufacturing Technology H. Xiao, Prentice-Hall, 2001. 2. Fundamentals of Microfabrication: The Science of Miniaturization M. Madou, 2nd ed., CRC Press, 2002 3. Nanoelectronics and Information Technology R. Waser ed., Wiley-VCH, 2003 4. VLSI Technology (more physical) SM. Sze, 2nd ed., McGraw-Hill, 1988
many web sites, e.g. www.memsnet.org/glossary see also companies web sites: Intel, Infineon, IBM, AMD,
Introduction
1947, 23th December John Bardeen, Walter Brattain, William Schockley ATT Bell Labs first point contact transfer resistor
reconstitution: Aylesworth
http://www.pbs.org/transistor/
MC, Nano III, 24.04.04, 4
Introduction
C. Esser, Infineon
Introduction
1961, Robert Noyce, Fairchild Camera first integrated circuit available as a monolithic chip Planar technology (Si substrate and Al lines)
C. Esser, Infineon
Introduction
1971
Intel anounces the i4004 microprocessor "a new era of integrated electronics" 2250 transistors, 10m technology, 108kHz
http://www.intel.com
MC, Nano III, 24.04.04, 7
Introduction
1981 Intel i8088 29000 transistors, 3m technology, 8MHz invention of the PC (personal computer) IBM, A.Child, B.Gates
http://www.intel.com
Introduction
Prediction 1975: from 1980 on circuit density or capacity of semiconductor devices will double every two years instead of one year
http://www.pbs.org/transistor/
Introduction
http://www.intel.com
Introduction
I think there is a world market for maybe five computers. Thomas Watson, Chairman of IBM, 1943 There is no reason for any individual to have a computer in their home. Ken Olson, President, Chairman and Founder of Digital Equipment Corp., 1977 640K ought to be enough for anybody. Bill Gates, Microsoft founder, 1981 (though today he denies he said it)
MC, Nano III, 24.04.04, 11
Introduction
1958
1 transistor = 10 US$; first integrated circuit with 4 transistors: 150 US$ market 218106 US$ for 10 US$, you receive 50106 transistors (with passive components, interconnects, ...) market 150109 US$ unprecedented in industry's history
2000
Introduction
state-of-the-art today
Introduction
going really nano, i.e. <100nm ? top-down approach: extend current techniques to smaller sizes (EUV-L, x-ray lithography., nano-imprint, flip-up principle, i.e.: horizontal/vertical exchange, etc) problem: precision, costs bottom-up approach: start from individual atoms/molecules use principles of self-organization (self-assembly; inspiration from biology, biochemistry, chemistry) problem: long-range order difficult to achieve in practice: combination of both routes
Outline
Introduction: overview, state of the art, semiconductor physics reminder
( condensed matter course)
Fabrication basics IC fabrication overview clean-rooms Silicon: from sand to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 15
Si atoms intrinsic
technologies for gate electrode pn-junction (junction FET or J-FET) Schottky barrier (metal-silicon FET or MESFET) insulated gate FET, like metal-oxide-semiconductor MOSFET
pn-junction
breakdown
Ref. 3
Ref. 3
MESFET technology
before contact
after contact
Workfunction of selected metals and their measured barrier height (eV) on germanium, silicon and gallium arsenide.
Al (Mo, W, Cu), Poly-Si SiO2, d 1.7-10 nm p- or n-type silicon 1013 - 1018 cm-3 <100>
Ref. 3
B. Fste, Infineon
B. Fste, Infineon
p-type semiconductor
B. Fste, Infineon
B. Fste, Infineon
B. Fste, Infineon
B. Fste, Infineon
B. Fste, Infineon
B. Fste, Infineon
B. Fste, Infineon
B. Fste, Infineon
Vg=0
Vg<>0
B. Fste, Infineon
Ref. 1
Refs. 1 & 3
basic logic gate: inverter Vin high (1): NMOS on, PMOS off, Vout=Vss (low, 0) Vin low (0): NMOS off, PMOS on, Vout=Vdd (high, 1)
B. Fste, Infineon
SOI substrate, Cu/low-k interconnection, 5 metal layers, features <0.13m, 300mm wafers (12 ")
Refs 1 & 3
yet The simplest cell, a single bacterial cell from human gut perhaps, or a cell torn off the skin by rubbing it, is more complex than any machine yet built by people. Maddox, 1998
Refs 2
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from sand to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 41
IC fabrication
example of (simple) CMOS process sequence
H. Xiao, Ref.1
IC fabrication
H. Xiao, Ref.1
IC fabrication
Ref. 3
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from sand to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 46
Clean room
importance of yield in industrial processes clean rooms
limit contaminants (air, people, facility, equipment, process (gas, chemicals, ...), static charges, .) special furniture and tools (paper, pens, ...)
Clean room
clean room classes
class 1 less than 1 particle of diameter larger than 0.5m in a cubic foot clean house, typ. > 500000 particles per cubic foot
Clean room
clean room design
H. Xiao, Ref.1
Clean room
simpler clean room design
H. Xiao, Ref.1
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from sand to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 51
Silicon
Si
2nd (after oxygen) most abundant in earths crusts: 26% 7th most abundant element in universe
Si ingot
up to 300mm diameter (FZ or floating zone purer butlimited to 200mm)
C. Heedt, Wacker Siltronic
edge rounding
Ref. 1
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from sand to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 62
Si + 2 H2 SiO2 + 2 H2
PECVD: plasma enhanced CVD, allows temperature reduction MOCVD: metal-organic CVD, use organometallic precursors (NB: thermal oxidation)
MC, Nano III, 24.04.04, 74
1m
SWNTs Fe, ethylene, 900C-1000C see e.g.: Dai et al. and Hafner et al.
~2nm
120
Length (m)
100 80 60 40 20 0 0 5 10 15
length of tubes vs time, flow and thickness SEM image perp. to SiO2/Si surface
Length (m)
100 80 60 0 5 10 15 20
Length (m)
100 80 60 40 20 0 5 10 15 20
Fe thickness [nm]
MC, Nano III, 24.04.04, 79
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from sand to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 82
radiation
source
DLW
illumination control system
Ref. 3
Optical lithography
source wavelengths: optical: > 450nm UV: 365nm-435nm DUV: EUV: x-ray: 157nm-250nm 11nm-14nm < 10nm
Ref. 3
Optical lithography
masking methods
contact MFS=(d.)1/2 proximity poorer resolution projection better resolution
(diffrac. limited, adj. Rayleigh crit.)
Ref. 3
Optical lithography
phase-shifting technique
Optical lithography
photoresists positive made soluble upon exposure (chain scission) e.g. PMMA (DUV, e-beam), DQN negative initiates cross-linking of side chains or polymerization of mono/oligomeric species e.g. maN400
Ref. 3
Optical lithography
Optical lithography
Optical lithography
Optical lithography
photoresists profiles
Ref. 2
Optical lithography
some important points resist baking: soft-bake, PEB, hard bake (NB: Tg polymer) adhesion layer (HMDS) development times/temperatures fresh products DOF (depth of focus) DOF /(NA)2
Ref. 3
also LIGA (lithographie, galvanoformung, developped IBM, 1975) x-ray used for high-aspect ratio structures, masters fabrication for further plastic replication
Refs. 1 & 3
HF etch (oxide)
Ref. 2
stamp
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from powder to wafer material deposition techniques lithography etching examples of devices: MEMS, NEMS Outlook: new and future techniques
MC, Nano III, 24.04.04, 100
Fabrication: etching
Chemical: wet etching (can be anisotropic due to crystal-face selectivity) Physical etching (sputtering) ion milling, FIB (focused ion beam) dry etching (plasma assisted techniques, pressures up to 10mbar) (more a combination of physical and chemical material removal) key points: etch rates, selectivity
also CMP: chemical mechanical polishing to achieve global planarization combine mechanical abrasion with chemical etching key parameters: force, slurry type, pad velocity
anisotropic
http://www.memsguide.com
polycrystalline or single-crystal isotropic: mix of HNO3 and HF (cyclic process: HNO3 oxidizes Si, HF removes oxide) Si + HNO3 + 6 HF H2SiF6 + HNO2 + H2O + H2 anisotropic (cystalline Si): (100) rate / (111) rate ~ 100 at 80C KOH 23.4% wt, C3H8O 13.3% wt (isopropyl alcohol), H2O 63.3% wt yields V-shaped groove
mix of acids (phosphoric, acetic, nitric) and water mix of sulfuric acid and hydrogen peroxide
http://www.memsguide.com
DRIE (key process for MEMS) ICP RIE SF6 alternated with C4F8 (to passivate walls), Bosch process selectivity Si:SiO2, 150:1 profile angle +/- 1
http://www.memsguide.com
Outline
Introduction: overview, state of the art, semiconductor physics reminder Fabrication basics IC fabrication overview clean-rooms Silicon: from powder to wafer material deposition techniques lithography etching examples of devices Outlook: new and future techniques
MC, Nano III, 24.04.04, 107
individual mechanical micromirrors part of a Texas Instruments Digital Light Processor (MOEMS)
structural layer
sacrificial layer
Physics World, Feb. 2001
substrate
MC, Nano III, 24.04.04, 110
O. Guenat,et al., Microfabrication and characterization of an ion-selective microelectrode array platform, Sensors & Actuators, B, 2003.
NB: 10x10x100 nm Si beam contains ~ 5 x 105 atoms, among which ~3 x 104 reside at the surface (i.e.: > 10% of the constituents are surface or near-surface atoms)
Ch. Meyer, H. Lorenz, and K. Karrai, "Optical detection of quasi-static actuation of nanoelectromechanical systems" Appl. Phys. Lett. 83, 2420 (2003).
MC, Nano III, 24.04.04, 113
A Erbe, Ch Weiss, W Zwerger, and R H Blick, Phys. Rev. Lett. 87, 096106 (2001) M Jonson and R Shekhter, Phys. World 16, 21 (2003).
MC, Nano III, 24.04.04, 114
END
MC, Nano III, 24.04.04, 116
web sites www.memsnet.org; www.biomems.net http://mmadou.eng.uci.edu/LivingBook/webterlist.htm Semiconductor physics http://ece-www.colorado.edu/~bart/book/contents.htm www.techlearner.com/semiconductors.htm web sites from companies: Intel, Infineon, IBM
Introduction
The Lives and Death of Moore's Law by Ilkka Tuomi First Monday, volume 7, number 11 (November 2002), URL: http://firstmonday.org/issues/issue7_11/tuomi/index.html
http://www.vcs.ethz.ch/chemglobe http://chemlab.pc.maricopa.edu/periodic
Schedule: 1st hour: slides 1-26 2nd hour: slides 26-62 3rd hour: slides 62-82 4th hour: slides 82-94 5th hour: slides 94-116