CERAMIC MANUFACTURING PROCESS

RAW MATERIAL COMPOUND

MIXING AND MILLING

SPRAY DRYING

SLIP

TAPE CASTING

ROLL COMPACTION

DRY PRESSING

EXTRUSION

STAMPING

FIRING

DRYING

MACHINING

CUTTING

SINTERING

SINTERING

GLAZING

GRINDING AND LAPPING

FIRING

LASER SCRIBING

INSPECTION

INSPECTION

INSPECTION

GLAZING

INSPECTION

SMOOTH SUBSTRATE FOR THIN FILM

TAPE SUBSTRATE FOR THICK FILM

GLAZED SUBSTRATE

PRESSED AND EXTRUDED PARTS

LASER SCORED SUBSTRATE

Tape Substrates for Thick Film

We are producing 96% alumina substrates (A-476) and 93% alumina substrates (A-473T) which have excellent thick film reliability and consistency.

sFeatures Our substrates have excellent thick film reliability and precise dimensional tolerance control (Super premium: 0.25%). They are cost effective for through-hole processes with small diameter holes (Min. 0.2mm) allowing densification of precision circuitry.

sApplication Hybrid lntegrated Circuit Resistor Network Chip Resistor Potentiometer Focus Substrate, etc

sCharacteristics of Material
Item Material Code Appearance Color Alumina Content Bulk Density Water Absorption Vickers Hardness (Hv 1.0) Flexural Strength Young's Modulus Coefficient of Linear Thermal Expansion Thermal Conductivity (20C) Dielectric Strenght Volume Resistivity Dielectric Constant (1MHz) Dielectric Loss Angle (1MHz) Surface Roughness % kg/m3 % GPa MPa GPa 40-400C 40-800C W/(m K) V/m cm (20C) (300C) (500C) 10-4 Ra m 96 3.7 103 0 13.7 350 320 7.2 10-6/C 7.9 10-6/C 24 12 10-6 >1014 1010 108 9.4 4 0.2-0.80 Material Alumina (Al2O3) A-476 (Tape) Dense White 92 3.6 103 0 12.3 310 280 6.9 10-6/C 7.8 10-6/C 22 12 10-6 >1014 1011 109 8.8 6 0.2-0.80 A-473T (Tape)

sDesign Guideline
Tape Manufacturing Method As Fired Camber Thickness Availability Thickness Tolerance Size Availability Standard:0.8%NLT.004 (0.10) Premium:0.5%NLT.003 (0.08) Length & Width Tolerance Super Premium: 0.25%NLT.002 (0.05) Scribing Tolerance Parallelism Perpendicularity Corner R Hole Size Spacing Between Holes or Edge to Holes Surface Roughness Standard:0.8%NLT.004 (0.10) Premium:0.5%NLT.003 (0.08) Super Premium: 0.25%NLT.002 (0.05) Standard:0.5% of outside dim. Premium:0.3% of outside dim. .020 (0.51) .008 (0.20) Dia. Min. .015 (0.38) Square Min. Minimum equal to thickness of substrate NLT.020 (0.51) * * * Punched/Greenscored

Unit: Inch (mm)

Surface Roughness

Laser Scored

+.008 (0.20) .002 (0.05) Edge to Scoreline: +.008 (0.20) .002 (0.05) Scoreline to Scoreline: .002 (0.05) .002 (0.05)

A-476: 8 to 30 inch CLA (Ra 0.2-0.75 m) A-473T: 8 to 30 inch CLA (Ra 0.2-0.75 m)

A-473T (93% Alumina)

sApplication
q Thick

sFeatures
q Uniform

film hybrid IC substrate, and others

grain size and small voids to A-476 for thick film characteristics

q Focus

q Equivalent q Less

camber and edge-curl size can be produced (Max. 8" 10") Premium: 0.25% tolerance:Standard: 0.5%

q Larger

SEM (A-473T)

q Tight

q Same

surface roughness on both sides

5.00 m

Pressed and extruded parts

As a leader in ceramic developement and one of the largest manufacturers of advanced ceramics in the world, Kyocera offers a complete line of ceramics with features such as; excellent electrical insulation at high frequency, high mechanical strength, high heat resistance, high wear resistance, extremely low thermal expansion and excellent chemical resistance. Kyocera's advanced dry pressing and extrusion technology can provide complicated designs and precise dimensional tolerances.

sCharacteristics of Material
Material Item Material Code Appearance Color Alumina Content Russet Dark brown A-459 A-445 A-473 ALUMINA (Al2O3) A-476 Dense White Ivory A-479 A-479SS A-480S

Al2O3 90% Al2O3 91% Al2O3 92% Al2O3 96% Al2O3 99% Al2O3 99.5% Al2O3 99.7% High Mechanical Strength, High Temperature Resistance, High Frequency Insulation, High Chemical Resistance Good for Light Good for Good Surface Hard and Hard and Metallizing Intercepting, Metallizing, Smoothness Chemically Chemically High Heat Mechanically Stable Stable, Dissipation Strong Fine Grain Strong and Smooth High Purity, High Chemical Resistance, Good Anti-Plasma, Wear Resistance 3.7 x 103 0 16.2 350 380 0.23 7.2 8.0 32 0.75 x 103 12 x 106 >1014 1013 1010 9.9 1 10

Main Characteristics

Thermal Mechanical Characteristics Characteristics

Bulk Density Water Absorption Vickers Hardness (HV1.0) Flexural Strength Compressive Strength Young's Modulus Poisson's Ratio Fracture Toughness

kg/m3 % GPa MPa MPa GPa MPa m

JIS C2141 JIS C2141 JIS R1610 JIS R1601 JIS R1602 JIS R1607 JIS R1618 JIS R1611 JIS R1611

40~400C Coefficient of Linear Thermal Expansion 10 -6/C 40~800C Thermal Conductivity W/m K Specific Heat J/kg K Heat Shock Resistance (Put in water) C V/m Dielectric Strength 20C cm Volume Resistivity 300C 500C Dielectric Constant (1MHz) (10 -4) Dielectric Loss Angle (1MHz) Loss Factor (10 -4)

JIS C2141

3.6 x 103 0 11.8 310 280 0.23 7.0 7.9 14 0.75 x 103 12 x 106 >1014 1011 109 8.8 6 53

3.8 x 103 0 12.7 290 320 0.24 7.3 8.1 12 0.75 x 103 12 x 106 >1011 107 106 9.8 25 245

3.6 x 103 0 12.3 310 2,300 280 0.23 6.9 7.8 18 0.75 x 103 200 12 x 106 >1014 1012 1010 9.0 6 54

3.7 x 103 0 13.7 350 320 0.23 7.2 7.9 24 0.75 x 103 200 12 x 106 >1014 1010 108 9.4 4 38

3.8 x 103 0 15.2 270 2,160 360 0.23 4.6 7.2 8.0 29 0.75 x 103 200 12 x 106 >1014 1010 108 9.9 2 20

3.8 x 103 0 15.2 340 2,350 370 0.23 4.2 7.2 8.0 32 0.75 x 103 250 12 x 106 >1014 1013 1010 9.9 1 10

Electrical Characteristics

MULLITE (3Al2O3 2SiO 2) K-690 Porous White Excellent Thermal Shock Resistance Very low Thermal Expansion Very low Thermal Expansion Dark brown White ML-652 S-210

STEATITE (MgO SiO 2) S-211 Dense Dark brown Good Light Shield F-1120

FORSTERITE (2MgO SiO 2) F-1023

ZIRCONIA (PSZ) Z-201N

Light yellow High Thermal Expansion

Milky white High Mechanical Strength, Excellent Wear Resistance, Good Surface Finish, High Fracture Toughness

Thermal Insulator

Good Surface Finish

2.0(Bulk) x 103 10~20 30 4.1 4.8 1 0.67 x 103

3.2 x 103 0 10.8 280 210 5.0 5.8 5 0.75 x 103 12 x 106 >10 14 1012 109 7.4 20 148

2.8 x 103 0 5.4 180 120 0.24 7.4 8.0 2.2 0.71 x 103 13 x 106 >10 14 1010 107 6 18 1kgf/mm 2=9.807MPa

3.1 x 103 0 6.4 180 130 0.22 9.2 10.4 2 0.71 x 103 13 x 106 >10 14 107 107 8 750

3.0 x 103 0 6.9 160 150 0.24 9.7 5 0.75 x 103 13 x 106 >10 14 1010 1010 6.5 5

3.0 x 103 0 5.9 160 150 0.24 10.1 5 0.75 x 103 13 x 106 >10 14 109 109 6.5 5

6.0 x 103 0 12.3 980 5,690 210 0.31 4.5 10.5 11.0 3 0.46 x 103 300

1cal/cm sec C=418.7W/(m k)

1cal/g C=4.187J/ g K=4.187x10 3J (kg K)

Thin Film Substrates

For thin film deposition, we have 99.6% alumina substrates (A-493, A-494) which offer excellent surface smoothness.

sCharacteristics of Material
Item Surface Roughness Bulk Density Grain Size Average Alumina Content Color Water Absorption Dielectric Constant Dielectric Loss Angle Volume Resistivity Thermal Conductivity 25C 300C 500C Side B: Unit

Unit: Inch (mm)

A-493 3.0 (.08) 5.0 (.125)

A-494 2.0 (.05) 4.0 (.10)

Side A: CLA inch (Ra m) kg/m3 m Wt% 1MHz 1MHz cm Wm/ k perC

3.86 103 < 1.5 < 1.0 99.6 White Nil 9.9.2 2 10-4 > 1014 (25C) 33 30 25 7.2 10-6 7.4 10-6 8.2 10-6 550

Coefficient Of Linear Thermal Expansion Flexural Strength

25 to 300C 25 to 600C 25 to 800C MPa

SEM A-493

Design Guideline Thickness A-494

Thickness Minimum: .005 (0.127) Maximum: .040 (A493), .027 (A494) Tolerance Standard: 10% NLT.002 (0.05) Premium: 5% NLT.0008 (0.02)

Unit: Inch (mm)

Standard: .010 (0.25), .015 (0.38), .025 (0.635)

6.0 m

6.0 m

Length, Width
Item Max Size Green Score Standard: 0.8% NIL.004" Premium: 0.5% NIL.003" Laser Score (0.10) Standard: +.008"/-.002" (+0.2/-0.05) Premium: (Thickness:0.020"orLESS) (0.08) .004"/-.002" (+0.1/-0.05) Straightness
L

4.7" 4.7" (120 120)

Surface Roughness
Tolerance

A-493

Perpendicularity
100 m
a

A-494
1 m

Perpendicularity Straightness Standard:

L b

a=L 0.5% b=L 0.5% Premium: a=L 0.3% b=L 0.3%

.002"

Polished Substrates For Thin Film

sFeatures
q Excellent q Tight

surface quality for thin film application.

dimensional tolerances (thickness, flatness).

sMaterial
q Kyocera

A493, A494 (99.6% alumina) thickness .010"-.0315" (0.25-0.80mm)

q Available q .002" q8

thickness is available with maximum size of 2" 2" and

inch surface finish.

sVisual Defects
q Scratches: q Voids:

.0003" deep max. Not allowed (by naked eye)

.0008"dia max.

q Contamination:

Surface Roughness Data

A-493 Standard
0.5m 100m

A-493 Premium

sSurface Roughness
Standard Premium

Unit: Inch (mm)

1.2 inch CLA (Ra0.03 m) 0.4 inch CLA (Ra0.01 m)

A-494 Standard

sThickness Tolerance
Size Standard Premium Less than 3" .0008 (0.02) .0004 (0.01) 3" or more .0020 (0.05) .0008 (0.02)

Unit: Inch (mm)

A-494 Premium

sFlatness
Size (inch) 2 2 .010 2 2 .015 2 2 .025 3 3 .010 3 3 .015 3 3 .025 4 4 .010 4 4 .015 4 4 .025 4.5 4.5 .015 4.5 4.5 .025 Standard One side polished .0020 (0.05) .0016 (0.04) .0008 (0.02) .0036 (0.09) .0032 (0.08) .0024 (0.06) .0200 (0.50) .0100 (0.25) .0032 (0.08) .0200 (0.50) .0080 (0.20) max. Both sides polished .0016 (0.04) .0012 (0.03) .0006 (0.015) .0030 (0.075) .0024 (0.06) .0016 (0.04) .0120 (0.30) .0060 (0.15) .0024 (0.06) .0140 (0.35) .0060 (0.15) max. One side polished .0014 (0.035) .0010 (0.025) .0005 (0.013) .0020 (0.05) .0016 (0.04) .0012 (0.03) .0100 (0.25) .0050 (0.13) .0020 (0.05) .0120 (0.30) .0050 (0.13) max. Premium

Unit: Inch (mm)

Both sides polished .0010 (0.025) .0006 (0.015) .0004 (0.01) .0016 (0.04) .0012 (0.03) .0008 (0.02) .0050 (0.13) .0032 (0.08) .0016 (0.04) .0080 (0.20) .0040 (0.10) max.

Glazed Substrates for Thermal Printheads

sFeatures
Kyocera glazed substrates consist of 96% alumina with a glass overcoat. They have superior flatness and fewer surface defects so it is very applicable for thermal printheads used in advanced and downsized facsimile machines. Kyocera can provide various types of glazed substrates for each application such as partial glazed, full glazed and serial glazed substrates.

Glazed Substrates
1.Partial Glazed Substrates Used in both thin and thick film types of thermal printheads for high speed G3 and G4 type facsimiles and color printers. Heater elements are put on a 1 to 3 mm narrow glazed portion to allow thermal printheads to closely fit a sheet of thermal paper and provide very clear and crisp printing.

Glazed Part

2.Full Glazed Substrates Used in thick film type of thermal printheads for regular type of facsimiles. The glazed surface is quite flat and the meniscus at the edges are low, so the full glazed substrates allow thermal printheads print very clear words.
Glazed Part

3.Serial Glazed Substrates Used in thermal printheads for wordprocessors and bar code printers. The dimensional tolerances of glaze pitch are very tight allowing the distance between the substrate edge and the glazed portion for heater elements to be short and the width of the glazed portion to be narrow so high speed printing is possible.

Glazed Part

sGlazed Substrate Material Specification

Item Glass Transition Temperature Glass Softening Temperature Coefficient of Linear Thermal Expansion Thermal Conductivity Unit C C 1/C W/m k Condition R. T. to 400C 20C 20C Volume Resistivity C 300C 500C Dielectric Constant Dielectric Loss Angle Surface Roughness Ra m 1MHz 20C 1MHz 20C GS-5 669 856 6.6 10 0.83 >1014 >1014 2.8 1010 7.2 14.6 10-4 <0.02
-6

GS-71 680 870 6.8 10-6 0.75 >1014 >1014 2.1 1010 8.7 10.0 10-4 <0.02

sGlazed Substrate Design Guideline

Item STD Dimensions .025 (0.635) Thickness .032 (0.800) .040 (1.000) L:12.44 max. Outside Dimensions (316 max.) W:3.15 max. (80 max.) Thickness .025/.032 Camber Substrate Size: 9 3.1 (230 80) Glaze Thickness: .0027 (70 m) Thickness .040 (1.0)t Full Glaze Partial Glaze Full Glaze: .0018 to .0032 Glaze Thickness (45 to 80m) Partial Glaze: .0012 to .0024 (30 to 60m) Meniscus of Full Glazed Substrates .120" from all edges (3mm) .0008 max. /.120 (20m max./3mm) .0004 (10m) .0006 (15m) .020 max. (0.5 max.) .016 max. (0.4 max.) (0.635/0.8) Partial Glaze .020 max. (0.5 max.) Full Glaze .080 (0.20) .024 max. (0.6 max.) .080 (0.20) STD Tolerance .0024 (0.06) .0032 (0.08) .0040 (0.10)

Unit: Inch (mm)

Premium Tolerance .0016 (0.04) .0024 (0.06) .0032 (0.08) .040 (0.10) .040 (0.10) .020 max. (0.5 max.) .016 max. (0.4 max.) .016 max. (0.4 max.) .012 max. (0.3 max.)

.0004 (10m)

.00028 (7m) .0006 max. /.120 (15m max./3mm)

Glaze thickness of partial glazed substrate with width of less than .035" is .002" max.

Microwave Dielectric Ceramics

1.Filter, Isolator, MIC

sFeatures
q

2.Dielectric Resonator (DR) (Satellite Broadcast, Base Station)

sFeatures
q Downsizing

Miniaturization of circuit size is possible due to the ceramic's high dielectric constant. Q values even at high frequencies.

of DR or cavity is possible because of high and

q High q

high Q value.
q Stable

Stable circuit operation can be obtained due to the low temperature coefficient of the dielectric constant. Because of a wide range of dielectric values, circuit design can be tailored to fit the application more easily. Surface finish can be selected to allow use with thin film or thick film technologies. Numerous custom designs such as holes, complicated 3 dimensional shapes, and snaplines are available due to Kyocera's advanced dry press technology.

electrical characteristics

sCharacteristics of Material
Material Code Dielectric Constant Q value Temperature Coefficient ( or f) Coefficient of Linear Thermal Expansion (40~400C) Thermal Conductivity Bulk Density Flexural Strength Water Absorption Application (GHz) ppm/C 1/C W/m k kg/m3 MPa % SM200 201 >8000 (6) -2530 9.2 10-6 7.5 3.7 103 190 0 SM210 211 >8000 (6) -2530 9.2 10-6 7.5 3.7 103 190 0 SH790 791 >1500 (2.6) -3530 SH890 891 >1800 (2.6) -3530 SH110 1103 >1200 (2.3) -7030 10.1 10-6 2.1 5.7 103 180 0 SB350 35~37 4500 (10) f 01~81 9.0 10-6 2.9 4.6 103 180 0 SL390 39~42 6500 (10) f -31~81 SV430 43~46 4400 (10) f -71~81

10.1 10-6 10.1 10-6 2.1 5.7 103 180 0 2.1 5.7 103 180 0

10.3 10-6 10.2 10-6 2.9 5.6 103 100 0 DR 2.9 4.8 103 290 0

MIC Filter/Isolator/MIC

sShapes
q Snaplines

and via holes can be added by the pressing

process.
q Products

can be designed to the customer's individual

specifications and requirements.

Aluminum Nitride Substrates

sFeatures
q High

thermal conductivity (7 to 8 times as much as Al2O3) expansion is close to Silicon wafer. mechanical strength and high density. chemical durability.

q Thermal q High q High

sCharacteristics of Material
Item Color Bulk Density Thermal Conductivity Thermal Characteristics Coefficient of Linear Thermal Expansion Dielectric Strength Volume Resistivity Dielectric Constant Materials g/cm
3

AN215 Black

AN217 Light Russet

3.4 150 170

W/m k 10-6/C RT~400C ~800C V/m cm 1MHz

4.8 5.4 12 10-6 >10

14

sCharacteristics Comparison (AIN/AL2O3)

Thermal Conductivity (W/m K) 200 Dielectric Strength V/m 106 20 150 100 15 10 5 50 Dielectric Constant (1MHz) 10 5

Electrical Characteristics

8.7 3 10.8 310 300

Flexural Strength MPa

Dielectric Loss Angle 1MHz (10-4) Hardness (Hv1.0) Mechanical Characteristics Flexural Strength Young's Modulus GPa MPa GPa

100 200 300 400 500 5 2.5 Dielectric Loss Angle 1MHz (10-4) 5max

10 Thermal Expansion *10-6/C (RT-400C)

AIN Al2O3

sThermal Characteristics
300 250 200 ALN 150 100 Si 50 0 1 2 3 4 5 6 Thermal Expansion (10-6/C) 7 8 9 BN GaAs Al2O3 SiC BeO

sThermal Conductivity VS Temperature

300 250 200 150 100 50 0 1 50 100 150 Temperature (C) 200 250 BeO

Thermal Conductivity (W/mK)

Thermal Conductivity (W/mK)

AN217 AN215

Al2O3

Multiform Glass

sFeatures
q High

thermal resistivity dielectric strength

q High q High

mechanical strength electrical resistivity

q Excellent q Sealing

operation is made simple

sCharacteristics of Material
Item Material Code Coefficient of Linear Thermal Expansion Annealing Temperature Softening Temperature Strain Point Bulk Density Flexural Strength 1/C Unit Characteristics G901 30~380C 24.01.5 (10-7) G902 27.51.5 (10-7)

C C C kg/m
3

525 825 470 2.150.0510 45 >1014 1012 109 25 (120) 10

520 820 465

3

MPa 20C

Volume Resistivity

cm 300C 500C

Viscosity-Temperature Curve
-6

Dielectric Strength

V/m

(120) is measured by direct current using .010 thickness test piece.

14

Strain point Annealing point 12

Cathode-Ray Tube
10 Log Viscosity (poise)

Softtening point

Working-point

400

600

800

1000 1200 Temperature (C)

1400

1600

Ferrite

Magnetic materials Soft magnetic materials Ferrite

sFeatures
q Manufactured

by the highest technical ceramic manufacturer

in the world.
q Many

standard materials to fit your application. shapes, high precision are no problem with Kyocera

q Complex

outstanding pressing technology and are available at competitive prices.

q The

industry's best selection for magnetic shielding for SMT is also available.

components or entire circuit.

q Metallization

sCharacteristics of Material
Code No. 100kHz Initial Permeability 1MHz 10MHz 100kHz (10-6) Relative loss factor (tan / ) 1MHz (10-6) 10MHz (10-6) 25~20C Relative Temperature Coefficient ( r) (10-6) 20~80C (10-6) Saturated Magnetic Flux Density Bs (mT) Residual Magnetic Flux Density Br (mT) Electrical Resistivity ( cm) 108 NZ001A NZ021A NZ112A NZ131A NZ221A NZ241A NZ273B NZ311A NZ312B NZ341A NZ411A NZ411B NZ511A NZ511G 1 1 1 7 7 7 26,000 3,600 1,300 35 35 80 20 108 65 65 65 200 130 180 0 0 380 230 108 160 160 160 150 80 280 50 35 370 160 108 370 370 220 30 60 3,000 4 2 290 110 108 480 480 300 15 30 2,700 15 7 350 120 108 150 150 160 120 50 80 15 10 250 90 108 650 650 270 20 55 4,500 20 10 390 210 108 490 500 260 15 60 3,200 0 1 290 110 108 900 950 330 15 65 4,400 20 9 360 160 108 800 800 200 50 80 4,700 25 15 380 190 108 1,100 1,200 250 15 120 5,300 15 6 380 170 108 2,000 1,500 240 15 360 9,600 7 2 320 100 108 450 430 220 80 210 4,400 8 2 230 130 108

sDESIGN GUIDELINE
DR CORE
q Both q d,

SQUARE CORE
q Both

alumina and ferrite are available.

alumina and ferrite are available. shape, high precision are no problem with

W&w depends on D&t.

Minimum Dimension
W

q Complicated

KYOCERA out-standing press technology.

UNITS:mm (d) (D) (t) (W) (w) D 7.0 D' 7.0 d' 1.5 t
d D D d d' D'

0.8 1.0 1.0 0.2 0.25

d 1.5 0.4

l 1.0 2t+l 7.0 UNITS:mm

PUSHPIN CORE
q Suitable q Using

CAP CORE
q Suitable q Square q Using B 2.5 A 10.0, 1.0 C 5.0 B 0.3 atA 4.0 B 0.5 at4.0 A 6.0 B 0.8 at6.0 A A A B

for magnetic shielding components.

for magnetic shielding components.

with cap core, low-height is possible.

type is suitable for auto mounting system.

with pushpin core, low-height is possible.

A = 2.2~6.0 C D 0.5 4.5 UNITS:mm

C D

1.2

METALIZATION
q Both

Ag(Ag/Pd)+Ni+Sn/Pb(Au) Alumina & Ferrite core with metalization

normal metalization side metalization flat metalization

alumina and ferrite are available.

A B 0.2MAX. 0.1MAX.
B A

1008 (2520) 0805 (2012) 0603 (1608) 0402 (1005)

0.450.15 0.400.15 0.15 +0.25/0.10 0.15 +0.25/0.10

figure
0.1-0.35 0.3-0.8

D 0.3 D 0.5 atC 3.0 at3.0 C 5.0 Minimum dimension of B&D in round pot cores as follows B 0.4 D 0.3 NOTE:B&D depends on A&C

C
0.1

0.1MAX. 0.1MAX.

Ag(AgPd)+Ni+Sn/Pb

good point

alumina ferrite

good adhesion good adhesion

higt Q (45 at 25MHz) higt Q (28 at 8MHz)

Single Crystal Sapphire Substrates

sSapphire sFeatures
q Perfect q Mirror q Low q High

control of crystal orientation. (Fig. 1)

polished surface.

dielectric loss: Tan <10-4. thermal conductivity. chemical durability.

q Excellent

Crystal Orientation (Fig.1)

sSOS Substrates sFeatures

sCharacteristics of Material
Material Code Appearance Color Principle Materials Bulk Density (kg/m3 ) Water Absorption (%) Vickers Hardness (GPa, Hv 1.0) Flexural Strength (MPa) Young's Modulus (GPa) Coefficient of Linear Thermal Expansion at 25C (1/C) Thermal Conductivity (W/mk) Dielectric Strength (V/m) 20 C Volume Resistivity ( cm) 300 C 500 C Parallel to C-axis Dielectric Constant (1MHz) Vertical to C-axis Dielectric Loss Angle (1MHz) 9.3 <10-4 Parallel to C-axis Vertical to C-axis SA-100 Dense Transparent Al2O3 3.97 103 0 22.5 690 470 5.3 10-6/C 4.5 10-6/C 41.9 48 106 1016 1011 11.5
q SOS

(Silicon On Sapphire) structure. circuit miniaturization. (Fig.2) for high speed circuits. radiation hardness.

q Enable

q Applicable q Excellent q Simplify

IC designing and process.

Comparsion in structure and individual chip size of SOS and bulk silicon