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12 ELECTROSTATICS SENSITIVE DEVICE

ESD
Electrostatic Sensitive Devices (ESD) are electronic components and other parts that are prone to damage from stray electric charge.
Extensive (and permanent) damage to static sensitive devices can result from mishandling and inappropriate methods of storage and transportation.

STATIC ELECTRICITY
When two dissimilar, initially uncharged nonconducting materials are rubbed together, the friction is responsible in transferring charge from one material to.
The process of electron transfer known as 'triboelectric charging'.

The amount of charge depends on factors like the rate of separation, humidity etc.

POSITIVE TRIBOELECTRIC
The following materials give up electrons and become positive when charged when rubbed against other materials: Air (most positive) Dry human skin Leather Rabbit fur Glass Human hair Nylon Wool Lead Cat fur Silk Aluminium Paper (least positive).

NEGATIVE TRIBOELECTRIC
The following materials tend to attract electrons when rubbed against other materials and become negative when charged: Wood (least negative) Amber Hard rubber Nickel, copper, brass & silver Gold and platinum Polyester Polystyrene Saran Polyurethane Polyethylene Polypropylene Polyvinylchloride (PVC) Silicon Teflon (most negative)

VALUE ELECTROSTATIC

CAUSES ESD
Electrostatic discharge from a human body charged material to the ESDS device. Electrostatic discharge from the device Field induced discharges

ESD WARNING

HANDLING ESD EQUIPMENT


Placards installed on the ESD LRU The ESD printed circuit boards are identified with a static sensitive placard. Contaminated or unwanted material should be kept clear of the sensitive devices. Connect the wrist strap into the Electrostatic Ground Jack of the card file or recognised aircraft ESD ground point. LRU or circuit boards are to be placed in the correct conductive bag or container which must display an ESD label.

TRANSPORTING ESD EQUIPMENT


1. Use of wrist straps which must be worn when handling ESD 2. Use a heel strap 3. Use of static dissipative floor and bench mats. 4. Avoidance of very dry environments 5. Availability of ground jacks 6. Use of grounded test equipment 7. Use of low-voltage soldering equipment and anti-static soldering stations 8. Use of anti-static insertion and removal tools for integrated circuits. 9. Avoidance of nearby high-voltage sources 10.Use of anti-static packaging

WRIST STRIP

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