A Vision Systems Platform For K&S Equipment Driven by the Golden Arrow

Author: Deepak Sood Date: 12/10/2010, Rev. 1.0

Strategic Lead: Deepak Sood
Vision Technical Lead: Zhijie Wang
Strategic Sourcing Lead: Jeff Sowers
Technical Leads Needed: Wedge Bonding
Technical Leads Needed: Die Attach
GOALS
As K&S explores opportunities for organic growth, a Vision systems platform should be defined and developed.
Requirements for the Vision Systems Platform will encompass the needs of the existing K&S equipment.
The Vision system platform development effort will produce
Assemblies and components that are common to multiple pieces of K&S equipment
Assemblies and components that are unique to some K&S equipment
The ICONN Vision system, the SX/DX Vision system, and the ISTACK Vision system will be used to define and abstract the interfaces and form the basis for the Vision
system platform development.
The Vision System consists of Optics, Cameras, Illumination Systems, Image Processing Hardware, Image Processing Algorithms, and Vision Application Software
BACKGROUND ON VISION SYSTEMS PLATFORM
Industrial PC with PC-E slot
Intel Dual Core CPU XP-Pro
Matrox PCI-E frame grabber
Image Processing shared with
Main Machine Control
Runs Vision Application
Matrox Nexis 15fps Digital Camera
4 Camera heads
1/2 inch CCD, 1280x1024
Digital interface via PCIe card
in Main PC
Vision System communicates with Die
Bonder Software using function calls
Image processing sub-system
task
Acquires images from the
Matrox cameras using MIL
Controls Display, Keyboard
and Mouse
Illumination control by Nyquist
control system
Vision Application owned by K&S
Uses Cognex library for Image
Processing
Uses Matrox Image Library
(MIL) for image acquisition
only
Matrox 4Sight-M
Celeron-M based PC with
XP-Embedded
Runs Vision Application
Runs X-Server for Wire
Bonder GUI
Matrox Nexis 100fps Digital Camera
Single/Dual head
1/3 inch CCD, 640x480 7.4
micron square pixels
Programmable Integration
Time
Digital interface
Vision system communicates with
Wire Bonder using Ethernet
TCP/IP based Hex
command interface to Host
CPU (VME, Pentium
Celeron, VxWorks OS)
Controls Display, Keyboard
and Mouse
Serial connection for Wire
Bonder Console
Connection to I/O board for
Illumination control
Vision Application owned by K&S
Uses Matrox Imaging
Library (MIL)
Industrial PC with PCI-E slot
Intel Dual Core PC with XP-
Embedded
Matrox PCI-E frame grabber
Runs vision application (PRP)
Matrox Nexis 100fps Digital Camera
Single/Dual head
1/3 inch CCD, 640x480 7.4
micron square pixels
Programmable Integration Time
Digital interface
Vision System communicates with Wire
Bonder using Ethernet
TCP/IP based command
interface to Host CPU (VME,
PowerPC, VxWorks OS)
Acquires images from the
Matrox cameras using MIL
Controls Display, Keyboard and
Mouse
Serial connection for Wire
Bonder Console
Connection to Host CPU which
interfaces to I/O board for
Illumination control
Vision Application owned by K&S
Uses Wedge Bonder Home
Grown Algorithms
Ball Bonder Wedge Bonder (SX/DX) Die Bonder
The three tables below compare the Vision Systems of the Ball Bonder, Wedge Bonder and Die Bonder with respect to the cameras, manifestation of the Image
Processing CPU and its relation to the Machine Control CPU, and the Image Processing Algorithms and Vision Application Software
Ball Bonder Wedge Bonder Die Bonder
OPTICAL SYSTEM
The Optical systems of the Ball
Bonder, Die Bonder and Wedge
Bonder are shown above.
The optical systems are designed
with the same design principles and
using the same tools.
The specifications and tolerance
analysis of the optical systems are
provided using the same methods.
The optical systems are tested
using the same test methods and
tools.
Physical Layout

A Vision Systems Platform For K&S Equipment Driven by the Golden Arrow (Page 2)
Author: Deepak Sood Date: 12/10/2010, Rev. 1.0
Strategic Lead: Deepak Sood
Vision Technical Lead: Zhijie Wang
Strategic Sourcing Lead: Jeff Sowers
Technical Leads Needed: Wedge Bonding
Technical Leads Needed: Die Attach
BLOCK DIAGRAMS OF VISION SYSTEMS ON CURRENT K&S EQUIPMENT
Block diagrams of the Ball Bonder, Wedge Bonder (SX/DX) and Die Bonder Vision Systems are shown below.
The Vision Systems Platform will be designed to be cost-effective with re-useable, re-locatable, and scalable components with clearly defined interfaces.

Matrox 4Sight-M
PRS Application
S/W
X-Server
CPU-1
VME PCOAB
VxWorks
Ball Bonder S/W
DMHS
X-Client
Illumination Control
GUI
PRS Interface
Power supply
KBd/Mouse
Monitor
Ethernet TCP/IP
NEXIS
Cameras
Programmable
Focus
Serial Console
Ball Bonder Block Diagram
KBd/Mouse
Monitor
Ethernet TCP/IP
Nexis VGA
Camera 2
DX
Serial Console
Nexis VGA
Camera 1
SX/DX
CPU-1
VME Power PC
VxWorks
Wedge Bonder S/W
Bond Process
Real Time I/O
Illumination Control
Matrox PCI-E
Board
Industrial PC with
PCI-E slot
PR Process (PRP)
(with Matrox Acquisition)
GUI
Ethernet TCP/IP
Wedge Bonder Block Diagram
KBd/Mouse
Monitor
Nexis Mega
Pixel
Camera 1
CPU-1 / Vision PC

Intel Dual Core
Windows XP-Pro
Die Attach S/W
Vision Sub-System
GUI
Nyquist for Illumination Control
Matrox PCI-E Board
Die Bonder Block Diagram
Nexis Mega
Pixel
Camera 4
A Vision Systems Platform For K&S Equipment Driven by the Golden Arrow (Page 3)
Driving a Common Vision System Platform By Analyzing Functional Layout of Three Vision Applications
Our vision applications have been developed and optimized for best UPH/Accuracy/MTBA for each unique process. The vision applications also have a strong tie to the
physical hardware used on each platform. Decoupling of software and hardware is a necessary step for us to move to a common platform.
Key modules can (and should) be reused among different platforms. To minimize the reuse effort, reorganization of the application is needed to make sure all the
application requirement needs are met and the future scalability is in place.
Author: Deepak Sood Date: 12/10/2010, Rev. 1.0
Strategic Lead: Deepak Sood
Vision Technical Lead: Zhijie Wang
Strategic Sourcing Lead: Jeff Sowers
Technical Leads Needed: Wedge Bonding
Technical Leads Needed: Die Attach
Vision Application Functional Layout
Ball Bonder Wedge Bonder (SX/DX) Die Bonder
Acquisition
Overlapped image acquisition
Asychronized software trigger
Acquisition state machine optimized using
matrox camera
Processing
Pattern Matching (MIL)
Pad finder (MIL and K&S in house)
VLL (K&S in house)
PBI (K&S in house and MIL)
OCR and Datamatrix (MIL)
Auto-focus and auto illumination (MIL and
K&S)
Display/Graphics

Video and graphics using DirectDraw
Zooming capability
Calibration

PRS operates in pixel unit
Compile/Runtime
Standalone or Vision on Host PC
XP Visual Studio .Net Compiler
XP Embedded runtime
Dedicated matrox vision box
Platform
Function Module
To do items for a more generic
vision system architecture
Split of grab/display engine to decouple strong
hardware dependency
Feasibility study of combining vision and
main CPU
Standardize testing procedure/applications
Develop more and package existing image
processing algorithms for more generic use
Current
State
Middle
State
Plug and Play Reuse of Hardware and Software Components
Final
State
A Vision Systems Platform For K&S Optical System by the Golden Arrow (Page 4)
Driving a Common Vision System Platform By reusing the methodologies in the 4 key steps to deliver successful optics
If vision hardware and software function as a human brain, the optics work just as human eyes to see and capture an undistorted image of the interested object with a clear focus.
The function of the optics is highly demanded by the customers to be able to resolve small and dense objects and to cover the wide range in the dimension of x, y and z.
Successful optics delivery comprises 4 key steps: 1.Imaging design 2.Illumination design 3.Procurement and manufacturing 4. Performance verification.
Methodology in each steps for a ball bonder optics can be reused for a wedge bonder and a die bonder.
Author: Gordon Tang Date: 12/10/2010, Rev. 1.0
Strategic Lead: Deepak Sood
Vision Technical Lead: Zhijie Wang
Strategic Sourcing Lead: Jeff Sowers
Technical Leads Needed: Wedge Bonding
Technical Leads Needed: Die Attach
Ball bonder (IConn/Connx) Wedge bonder (SX/DX) Die bonder (IStack)
Common design considerations
Optical Magnification 2x, 4x, 6x, 8x 0.65x, 1.2x, 2x, 3x 0.16x
Camera Sensor size/ pixel size 1/3" 1/3" 1"
Pixel resolution (pixel size / optical mag) 3.7, 2.25, 1.5, 1.25 um /pixel 11.4, 6.4, 3.7, 2.5 um/pixel 30 um/pixel
Optical resolution (MTF performance)
Field of veiw (Sensor size x optical mag) 2.37 x1.78 mm (2x), 0.96 x 0.72 mm (6x) 7.3 x 5.5 mm (0.65x), 2.4 x 1.8 mm (2x) 30 x 30 mm (0.16x)
Distortion 0.005% 1% 0.50%
Depth of field 10 mils (2x) , 5 mils (6x) 10 mils (0.65x) , 3 mils (2x) 20 mils
Field curvature < 20 um
Telecentricity (mag change in the depth of field) 0.02% (2x) 0.05% (0.65x)
Focus adjustment range 2.5 mm 10 mm
Mag change in the focus adjustment 3.9% (2x) 0.45% (0.65x)
Wavelength 470 and 650 nm 470 to 650 nm 470 to 650 nm
Aperture size (diameter) 1.875 mm (2x), 5 mm (6x) 2.203 mm (0.65x), 4.372 mm (2x) 1.748, 2.998 mm
Working distance 31 mm 100 mm 165, 286 mm
Total optical path 221.966 mm (2x), 251.206 mm (6x) 402.5 mm 200, 340 mm
Lens diameter < =18 mm <26 mm
Tolerence analysis Sensitivity for mag and spot size Sensitivity for mag and spot size Sensitivity for spot size
Number of lenses 2 (2x), 4 (4x, 6x, 8x) 2 (2x), 3 (1.2x), 4 (2x, 3x) 3
Complexity for housing
Complexity for focus adjustment Move relay lens Move objective lens Move lens assembly
Stray light analysis Hot spot reduction Hot spot reduction Hot spot reduction
Dual mag optical path or single mag optical path Dual and single Single Single
Zoom lens or easy swap-out lens No Easy swap-out Easy swap-out
Imaging design
Ball bonder (IConn/Connx) Wedge bonder (SX/DX) Die bonder (IStack)
Brightness
Uniformaity across FOV
Uniformaity through angle of incidence
Die tilt coverage 3 degree (Vertical), 10 degree (Oblique) 3 degree (Vertical), 4 degree (Oblique)
Color Red, Blue Red, Green Red Green, White
Full ring or partiall ring Full Full Full
Partial ring angle
Illumination design
Ball bonder (IConn/Connx) Wedge bonder (SX/DX) Die bonder (IStack)
Mechanical and Optical tolerance spec
Test plate fitting Yes No Yes
Glass selcetion
Baffle design
Lens drawing
Lens curvature verification methods Test plate Laser interferometer Test plate
Procurement and Manufacturing
Performance verification

Ball bonder
(IConn/Connx)
Wedge bonder
(SX/DX)
Die bonder
(IStack)
Mag and distortion test Distortion application
Focus quality test Focus application
Depth of field test Pad find repeatability
Telecentricity test Distortion application
Focus adjustment range
test
Focus application and
Distortion application
Lighting uniformity and
brightness test
Die tilt test
Camera linearity and gain
test