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Paraphrasing Francis Fukuyamas essay "The End of History?" The National Interest, 1989
2014
Fastest i7
3.6/4.0GHz, 150W
Fastest Xeon 3.4/3.7GHz, 155W
Intel CPU Introductions (graph updated August 2009; article text original from December 2004)
Source: The Free Lunch Is Over: A Fundamental Turn Toward Concurrency in Software
Electronics $ 91
Other
$120
4
150
Samsung
Apple
Microsoft
Amazon
100
Google
Intel
Facebook
50
0
2005
2006
2007
2008
2009
2010
2011
2012
2013
HW vs. SW
Software-Defined Satellite
Wikipedia
Xilinx
DMV 1981-1988
Daisy, Mentor, Valid
Still substantial focus on Hardware sales
Gen 3 1988
Cadence (88 ECAD +SDA), Mentor, Synopsys (Optimal
Solutions 86)
Software
8
EDA
$B
$8
$7
$5
$4
$3
$2
$1
EDAC MSS
$1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
EDA
$B
$8
CAGR = 6%
$7
$5
$4
$3
$2
$1
EDAC MSS
$1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
10
1950
1960
1970
1980
1990
2000
2010
Source: Board of Governors of the Federal Reserve System and U.S. Bureau of Economic Analysis
11
$70
$60
$50
$40
$30
$20
$10
$-
12
$70
CAGR = 6.1%
$60
$50
$40
$30
$20
$10
$-
13
Semiconductors
$T
$B
$80
$400
$70
$350
$60
$300
$50
$250
$40
$200
$30
$150
$20
$100
$10
$50
$-
$-
Source: SIA
14
Semi / WDC
0.7%
0.6%
0.5%
0.4%
0.3%
0.2%
0.1%
0.0%
15
Semi / WDC
0.7%
0.6%
0.5%
0.4%
0.45%
0.3%
0.2%
0.1%
0.0%
16
EDA
$B
$8
$400
$7
$350
$6
$300
$5
$250
$4
$200
$3
$150
$2
$100
$1
$50
$-
$-
Source: EDAC
17
EDA
$B
$B
$8
$400
$7
$350
$6
$300
$5
$250
$4
$200
$3
$150
$2
$100
$1
$50
$-
$-
Source: EDAC
18
EDA / Semi
3.5%
3.0%
2.5%
2.0%
2.2%
1.5%
1.0%
0.5%
0.0%
19
20
6%
21
Software
Die
EDA
Package
MCM, EM,
Thermal, Mechanical
Board
Connector
PCB, EM,
Thermal, Mechanical
Sub-System
Mechanical,
Thermal, EM
System
Mechanical, CFD,
Thermal, EM
Package
MCM, EM
Board
Connector
PCB, EM
23
3D
2.5D
3D
24
Hybrid Mode
Return Loss
Insertion Loss
Method
Full 3D
Hybrid 2.D / 3D
50 GB
6 min
5 GB
Hybrid
3D
25
Parallelism in EM Simulation
Layers: 8
Nets: 320
Ports: 1000
Time
Speedup
MS&S 8 cores
235 min
6x
RHS
7.3 min
32x
80 machines
0.7 min
Result download
1.0 min
Max Speedup =
N=80
Max Speedup =
n=
1
p
(1-p) +
n
1
p
(1-p) +
n
= 50x
= 131x
27
Time
MS&S 8 cores
Speedup
2741 min
6x
50 min
55x
1.0 min
Result download
3.0 min
Peak Memory: 14 GB
RHS
Setup time:
= 28 min (serial)
p = (2741-28) / 2741 = 0.98978
Max Speedup =
n=125
Max Speedup =
n=
1
p
(1-p) +
n
1
p
(1-p) +
n
= 55x
= 98x
28
S-Parameters
Computation
Time
MS&S 8 cores
5954 min
RHS
5 machines
Freq 25x5 machines
70 min
1.0 min
Result download
5.0 min
Speedup
6x
3.4x
25x
Peak Memory: 11 GB
RHS
Setup time
= 11.5 min (serial)
p = (119-11.5) / 119 = 0.8067
Max Speedup =
n=5
Max Speedup =
n=
1
p
(1-p) +
n
1
p
(1-p) +
n
= 3.6x
= 10.3x
29
S-Parameters
Transmission
Reflection
30
Licensing
nCloud supports a flexible licensing model,
ranging from hourly pay-as-you-go softwareas-a-service (SaaS) licensing to longer term
subscriptions such as monthly or annual.
31
32
33
Software
Die
EDA
Package
MCM, EM,
Thermal, Mechanical
Board
Connector
PCB, EM,
Thermal, Mechanical
Sub-System
Mechanical,
Thermal, EM
System
Mechanical, CFD,
Thermal, EM
Software
Rank Rank
2013 2012 Vendor
1
2
3
4
5
6
7
8
9
10
1
3
2
4
5
6
7
9
8
12
Microsoft
Oracle
IBM
SAP
Symantec
EMC
HP
VMware
CA Technologies
Salesforce.com
Others
Total
2013
Revenue
2012
Revenue
2012-2013
Growth Rate (%)
65.7
29.6
29.1
18.5
6.4
5.6
4.9
4.8
4.2
3.8
234.6
407.3
62.0
28.7
28.7
16.9
6.4
5.4
5.0
4.2
4.3
2.9
224.0
388.5
6.0
3.4
1.4
9.5
-0.8
4.9
-2.7
14.1
-2.6
33.3
4.7
4.8
35
CAD / Simulation
$B
Rank Rank
2013 2012
1
2
3
4
5
1
2
3
4
5
Vendor
Dassault Systmes
Autodesk
Siemens PLM
PTC
Ansys
Total
2013
Revenue
2012
Revenue
2012-2013
Growth Rate (%)
2.6
2.3
1.8
1.3
.86
8.9
2.5
2.2
1.7
1.3
.80
8.5
1.8
4.1
7.5
3.0
7.9
4.7
36
CAD / Simulation
$B
$10
$9
$8
$7
$6
$5
$4
$3
$2
$1
$2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
37
CAD / Simulation
$B
$10
$9
CAGR = 9.3%
$8
$7
$6
$5
$4
$3
$2
$1
$2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
38
Software
Application
Development $9 / $407B
2.2%
Software
Die
Package
EDA
$.8 / $80B
1.0%
Board
Connector
Sub-System
$6.2 / $303B
2.0%
CAD
>$9 / >2T ?
<0.5%
System
39
40
Summary
Semiconductors and EDA have been
growing at the pace of GWP since 1996
Cost, complexity and functionality
continue to migrate to SW and system
EDA and CAD are poised for contact,
leading to system design
41