X ray radiography

Medical imaging
Medical imaging: The technique and
process of creating visual representations
of the interior of a body for clinical
analysis and medical intervention.
Medical imaging seeks to reveal internal
structures hidden by the skin and bones,
as well as to diagnose and treatdisease.
Medical imaging also establishes a
database of normalanatomy
andphysiologyto make it possible to
identify abnormalities.

Types of medical imaging

It incarporated radiology which uses imaging
technologies of :
1.X-ray radiography
2.Magnetic resonance imaging
3.Medical ultrasonography (ultrasound)
4.Endoscopy
5.Elastography
6.Tactile imaging
7.Thermography
8.Medical photography
9.Positron emission tomography

X-ray radiography

Types of X-Ray radiography

:Dental Imaging

(1) Plain film radiography :

All X-ray photons passing through patient, easily go
through the film without interaction, but they are caught by
the high-Z phosphor screen.This screen absorbs the X-rays
and gives out fluorescent light exposing the film. The film is
subsequently processed to form a final image.
(2) PSP-photo-stimulable phosphor (indirect system):
This application uses psp plate to capture and
store a latent radiographic image. After exposure to x-rays,
excited electrons in the phosphor material on the plate
remain trapped in the crystal lattice. The laser beam
within the scanning unit stimulates the phosphor crystals,
releasing the trapped electrons, and light is emitted in
proportion to the amount of radiation absorbed by the
phosphor crystals. This light is then converted into a digital
image.

Types of X-Ray radiography :Dental

Imaging

(3) CCD-Charge-Coupled Device (direct

system):

In a CCD for capturing images, there is a photoactive region

(anepitaxiallayer of silicon), and a transmission region made out of
a shift register. An image is projected through alensonto the
capacitor array (the photoactive region), causing each capacitor to
accumulate an electric charge proportional to thelightintensity at
that location. A control circuit causes each capacitor to transfer its
contents to its neighbor (operating as a shift register). The last
capacitor in the array dumps its charge into acharge amplifier,
which converts the charge into avoltage. The sequence of voltages
are then sampled, digitized, and usually stored in memory.

Charge packet
transfer

Types of X-Ray radiography :Dental

Imaging
(4) CMOS-Complementary Metal Oxide
Semiconductor
It is composed of: An array
(direct system)
of identical pixels, each

having at least a photodiode

and an addressing transistor,
A Y-addressing or scan
register to address the
sensor line-byline, by
activating the in-pixel
addressing transistor.
A X-addressing or scan
register to address the pixels
on one line, one after
another.
An output amplifier.

Types of CMOS Pixel

architectures :1. Passive
At the beginning of an exposure the photodiode is reverse
biased to a high voltage (e.g. 3.3 V).
During the exposure time, impinging photons decrease
the reverse voltage across the photodiode.
At the end of the exposure time the remaining voltage
across the diode is measured, and its drop from the
original value is a measure for the amount of photons
falling on the photodiode during the exposure time.
To allow a new exposure cycle, the photodiode is reset
again.

Passive cmos pixel based on one

in-pixel transistor, RS used as the
row selection switch

Types of CMOS Pixel architectures :2.

Active

The pixel is composed out of the photodiode, the reset

transistor, the driver of the source-follower and the
addressing transistor. The current source of the sourcefollower is placed at the end of the column bus
The photodiode is reverse biased or reset.
Impinging photons decrease the reverse voltage across the
photodiode.
At the end of the exposure time the pixel is addressed and
the
voltage across the diode is brought outside the pixel by
means
the source-follower.
The photodiode is reset again..
Active cmos pixel based on inpixel amplifier. The transistor RST
and RS are used for resetting and
selection of the pixel

Types of CMOS Pixel

architectures
:3.
PPD
To pixel of APS sensor, an extra (pinned) photodiode is added which is connected
to
the readout circuit by means of an extra transfer gate, TX. With this pixel the
photodiode is separated from the readout node. It operates as follows :
Conversion of the incoming photons is done in the (pinned) photodiode.
At the end of the exposure, the readout node is reset by the reset transistor.
A first measurement is done of the output voltage after reset.
The photodiode is emptied by activating TX and transferring all charges from
the photodiode to the readout node.
A second measurement is done of the output voltage after transfer.
The two measurements are subtracted from each other (correlated double
sampling, CDS)

PPD cmos pixel based on in-pixel

amplifier in combination with pinned
photodiode. RST , RS , TX are
respectively the reset row select and
transfer transistor

Improvement flow in CMOS Pixel

architectures
1.

In passive cmos pixel, due to the mismatch

between
the small pixel capacitance and the large vertical
bus
capacitance; pixel suffered from large noise level.
2. To overcome above issue; concept of active pixel
was introduced, in which every pixel gets its own
in-pixel amplifier, being a source follower.
Unfortunately, the
kTC noise component,
introduced by resetting the photodiode, still
remained.
3. To solve the latter issue of thermal FET noise in the
presence of a filtering capacitor, the so-called
pinned photodiode pixel was introduced.

CMOS Vs. CCD

CMOS Vs. CCD

CMOS sensor has higher responsivity than CCD.

Dynamic range, noise level hence image quality is better in CCD than
CMOS sensor

CMOS sensor has superior ability for windowing, i.e. the ability to read
out the portion of the image sensor.

CMOS imagers operate with single bias voltage and clock level, CCD
typically require few higher voltage biases but clocking has been simplified

in modern devices that operate with low voltage clocks.

CMOS is the technology of choice for high-volume, space constrained
applications where image quality requirements are low. This makes them a
natural fit for security cameras, PC videoconferencing, wireless handheld
device videoconferencing, bar-code scanners, fax machines, consumer
scanners, toys, biometrics and some automotive invehicle uses. CCD
remain the most suitable technology for high-end imaging applications,
such as digital photography, broadcast television, high-performance
industrial imaging, and most scientific and medical applications.

Scintillator
The scintillation process in
inorganic materials is due to
the electronic band structure
found in crystals and is not
molecular in nature as is the
case with organic scintillators.
An incoming particle (X ray
photons)can excite an electron
from the valence band to either
the conduction band or the
exciton band (located just
below the conduction band and
separated from the valence
band by an energy gap. This
leaves an associated hole
behind, in the valence band.
Impurities
create
electronic
levels in the forbidden gap. The
excitons are loosely bound
electron-hole
pairs
which
wander through the crystal
lattice until they are captured
as a whole by impurity centers.
The latter then rapidly deexcite by emitting scintillation
light

FOP
The FOP is an optical device comprised of a bundle of micronsized optical fibers. The FOP is used as a lens to convey the
light and image with high efficiency and low distortion. Unlike
a normal optical lens, no focusing distance is required

CMOS DENTAL SENSOR

CMOS DENTAL SENSOR ARCHITECTURE:
SCINTILLATOR + FOP + CMOS CHIP
CMOS DENTAL SENSOR WORKING
MECHANISM :

X RAY incident on scintillator are

converted to light signal. Light is
transported through FOP to CMOS chip.
Light incident on CMOS chip is coverted
to electronic digital signal which produces
the final image

USB INTERFACE
Universal Serial Bus (USB) is a set of interface
specifications for high speed wired
communication between electronics systems
peripherals and devices with or without
PC/computer.

The USB trident logo

USB 2.0, also known as

hi-speed USB. This hispeed USB is capable of
supporting a transfer rate
of up to 480 Mbps,
compared to 12 Mbps of
USB 1.1. That's about 40
times as fast! Wow!