You are on page 1of 23

Event Handling Guideline

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 1
Key Event Assurance Service Overview
Event Preparation

Network Security Network Performance End user Experience


Before Event In Event Post Event
Contingency Plan Adjustment &
Capacity Assessment Network check Network Adjustment On-Duty Support
Preparation Summarization
• Capacity Evaluation • Health Checking • Parameter/Feature • Draft Nodin by RNP • Real-time Alarm • Temporary Parameter
• Total cell for cover the • Hardware Alarm Adjustment Design & Team Monitoring in M2K By and Configuration
event Current Alarm, VSWR, Implementation • NPT (New site OSS Team Rollback
• Suggestion Transmission Alarm, etc • Hardware Adjustment Parameter Tuning) after • Troubleshooting • Project Summary and
Design & integration site by BSS • Remote Technical Report
Implementation Team Support
• Neighbor Preparation • Reporting Service
(L2U,U2L,L2G,G2L) • Real-time KPI
Network KPI and Data Throughput Monitoring
Network Monitor System
Evaluation • Real-time Parameter
• Platform Deployment (KPI,Alarrm PM, GIS) Optimization
• Network KPI and Data Throughput Summary
• KPI & Report Template Customization
• Drill

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 2
Event Preparation and Contingency Plan
Pre-event In-event Post-event

Resource Capacity Emergency Plan


Network Check Network Adjustment Spare Part Assurance Event Attendance Recovery and Summary
Assessment Formulation and Drill

• Assess resource • Check the network • Design the network • Formulate emergency • Ensure spare parts • Monitor the network in • Restore the network to its
capacities. health. adjustment plan. plans. allocation. real time. original status.
• Forecast the traffic • Analyze the resource • Adjust the network. • Perform emergency • Ensure proper delivery of • Address on-site • Summarize experience for
volume. load. drills. the project. troubleshooting. sharing.
• Analyze the network
performance. • Arrange remote expert
• Check the disaster attendance.
tolerance (DT) or
backup plans.

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 3
3G CONTINGENCY FLOW 1. Execute NPT For Event
2. Activate Feature and Strategic
Optimization

KPI Or Speed Test


Degradation

CSSR CS PS CSSR Upload Speed


Degradation Degradation DL Speed Lower
Lower than 512
than 1Mbps
kbps

If there is no UL CE congestion, 1. LDR first action IRAT to 2G


CPU Load XPU is Rebalance cell to CPU Load XPU is
change BGN to 421 2. Speed up reselection and HO (2D2F) to 2G
Higher 70%? other XPU SSN Higher 70%?
3. Reduce CPICH 3 dB until reach 5%

UL Speed
1. Allow CS services preempt the
Improved?
network resources of PS services. 2nd
1. LDR First action to CodeAdj,
2. Optimization in Power Resource, BERateRed
Code Resource, and CE Resource 2. Speed up reselection and IRAT
Admission Algorithms CS (2D2F) to 2G
3. Reduce CPICH 3 dB until reach 5%
4. Speed up reselection and IRAT CS 1. Reduce HSUPA user to 20
(2D2F) to 2G 2. Disable HSUPA 2msTTI

END

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 4
2G AND LTE CONTINGENCY FLOW
2G 1. Execute NPT For Event
2. Activate Feature and Strategic
LTE 1. Execute NPT For Event
2. Activate Feature and Strategic
Optimization
Optimization (ex: Vamos)

KPI Or Speed Test


Degradation

Degradation

High UL
CPU Load RRC and ERAB Success
Inteference / Low
Increase Degraded <90%
UL throughput

SDCCH PDCH
TCH Blocking
Blocking Congestion
Increase intra-frequency handover 1. Disable PreAllocation
threshold to 5dB. 2. Disable downlink FSS of eNodeBs in and around the
1. Improve scheduling priority of uplink access signalling
assurance Area.
2. RBG Round Up and Adaptive to save PDCCH resouces.
3. Reduce p0 of PUSCH
3. CCE level Optimization and PDCCH Utilization
1. Change PDCH to TCH 4. Limiting PUSCH RSRP upper limit threshold
1. Add PDCH Improvement
2. Modify CRO to share the load to 4. Increasing the offset for the target SINR in PUCCH
1. Set MINRESTIMETCH to 600 to 2. Speed up PS redirection to 3G
NBR cell power control
reduce SDCCH adjusted to TCH. 5. Optimizing P0 nominal PUCCH
2. Add SDCCH channel Increasing the value of P0NominalPUCCH and Setting
PucchCloseLoopPcType to USE_P0NOMINALPUCCH
6. Increasing the interval between cyclic shifts used for the
PUCCH (DeltaShift)

END END

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 5
Event Preparation :
1. Drivetest/Walktest

2. Assessment

3. Parameter Standard Event

4. KPI Dashboard

5. Worst Cell Analysis

6. Parameter/CR Fallback

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 6
1. Drive Test/Walktest for Event Preparation:
 Make sure we get the right LAC and CI (serving and surrounding Cell)

 Make Sure no PIPOL

 Make Sure no missing neighbour

 Check Throughput

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 7
2. Assessment
 Check Feature and License

 Check Capacity

 Check Utilization (IUB,CE, Power and Code)

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 8
 Check Feature and License
 NodeB Level
 DSP LICENSE Operator Index Operator Name License Identifier License Item Allocated
65535 SHARED LQW9ULCE01 UL CE Num 1024
65535 SHARED LQW9DLCE01 DL CE Num 1536
65535 SHARED LQW9HSDPA01 HSDPA Function(per NodeB) 1
65535 SHARED LQW9HDPCK01 HSDPA RRM Package 1(per NodeB) 1
65535 SHARED LQW9HDCODE01 HSDPA Code Number 90
65535 SHARED LQW9HSUPA01 HSUPA Function(per NodeB) 1
65535 SHARED LQW9HU2MS01 HSUPA 2ms TTI Function(per NodeB) 1
65535 SHARED LQW9CCPIC01 CCPIC Function(per NodeB) 1
65535 SHARED LQW9DYNCCE01 Dynamic CE Function(per NodeB) 1
65535 SHARED LQW964QAM01 DL 64QAM Function(per Cell) 6
65535 SHARED LQW9UIC01 IC Function(per Cell) 6
65535 SHARED LQW9DDC01 DC-HSDPA Function(per Cell) 6
65535 SHARED LQW9CEOVER01 CE overbooking(Per NodeB) 1
65535 SHARED LQW9CCPIC201 Control Channel Parallel Interference Cancellation (Phase 2)(Per NodeB) 1
65535 SHARED LQW9FDCDB01 Flexible Dual Carrier HSDPA Function(per NodeB) 1
65535 SHARED LQW9UTIC01 Turbo IC Function(per Cell) 6
65535 SHARED LQW9DPASPL01 HSDPA Scheduler Pool (per NodeB) 1
65535 SHARED LQW9CCPIC301 Control Channel Parallel Interference Cancellation (Phase 3)(per NodeB) 0
65535 SHARED LQW9CEEFF01 CE Efficiency Improvement for HSUPA TTI 2ms (per NodeB) 1
65535 SHARED LQW9ULSHA01 Turbo IC Phase2 (per Cell) 6

Note: Zero (0) Value its mean Not active

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 9
 Check Feature and License
 Cell Level
 DSP ULOCELL

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 10
 Check Feature and License
 Cell Level
 DSP UCELLCHK

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 11
 Check Capacity
 DSP BRD

 DSP BRDMFRINFO

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 12
 Check Capacity
 DSP BBPTC

 DSP BRDMFRINFO

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 13
 Check Feature, License and Capacity
 Template Assessment Report (Feature)

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 14
 Check Feature, License and Capacity
 Template Assessment Report (Capacity)

FACH Assessment
CTFC FACH1(Signaling) FACH2(Data)
0 0*168 0*360
1 1*168 0*360
2 2*168 0*360
3 0*168 1*360

CTFC FACH1(Signaling) FACH2(Data)


0 0*168 0*360
1 1*168 0*360
2 2*168 0*360
3 0*168 1*360
4 1*168 1*360
5 2*168 1*360
6 0*168 2*360

- Basicly FACH&PCH use one PhyChId (PhyChId 8), if FACH congested we need to separate between PCH & FACH with add another PhyChId (PhyChId 9).
- Default FACH bandwith is 36 kbps with 4 CTFC (Calculated Transport Format Combination), then we upgrade to 72kbps by adding 3 more CTFC become 7 CTFC.
- FACH Bandwith can get by query counter “VS.CRNC.IUB.FACH.Bandwidth (byte/s)”. If value still 4500 byte it’s mean CTFC still 4 or 36kbps, then if value already 9000 byte it’s mean already 7
CTFC or 72kbps.
HUAWEI
HISILICONTECHNOLOGIES
SEMICONDUCTOR CO., LTD. Page 15
- Make sure & double cek if FACH 200 is enable/ON by checking on command UCELLALGOSWITCH.
 Check Utilization (IUB,CE, Power and Code)

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 16
3. Parameter Standard Event

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 17
4. KPI Dashboard

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 18
5. Worst Cell Analysis

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 19
User
Cell Planning Method
Experience
1Mbps 500Kbps 500Kbps 30 HSDPA Users in one cell
1Mbps 12 HSDPA Users in one cell
Sample capacity dimensioning
3G Forecast Value Remarks LTE Forecast Value Remarks
Attendance 70,000 Person Attendance 70,000 Person

Target Throughput 500 Kbps Target Throughput 2 Mbps


Telkomsel Telkomsel
28,000 40% 28,000 40%
Subscribers Subscribers
3G Penetration 16,800 60% LTE Penetration 2,800 10%

HSDPA Online Ratio 5,040 30% LTE Online Ratio 560 20%

Dimensioning Value Remarks Dimensioning Value Remarks

1 LTE 10MHz cell @2Mbps = 200 Users


Recommend: Required 3G Cells 168
1 3G cell = 30 User
(512 kbps DL thpt)
Required 4G Cells 3 1 LTE 15MHz cell @2Mbps = 300 Users
1 LTE 20MHz cell @2Mbps = 400 Users
For current network, 30 HSDPA User Number with 500 Kbps
User Experience; Existing 3G Cells 36 GBK Indoor Existing 4G Cells 0

Additional 3G Cells 132 Additional 4G Cells 3


Additional 3G Additional 4G
44 3
Sectors Sectors

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 20
3G Feature Dependency
Activity Objective Level Site Criteria Dependency
CE Efficiency Improvement for HSUPA TTI 2ms UL Capacity NodeB WBBPf/UBBPd WBBPf
Turbo IC Phase 2 UL Capacity Cell WBBPf/UBBPd WBBPf/UBBPd
HSDPA Scheduler Pool DL Capacity NodeB at least two WBBPd or WBBPf WBBPf
40 HUSPA user per cell UL Capacity Cell Cell MAX HUSPA USER number <40 WBBPf
DC-HSDPA Throughput RNC/Cell WBBPd/WBBPf/UBBPd
96 HSDPA Users per Cell Throughput Cell NA WBBPf
CE Overbooking UL Capacity RNC/NodeB WBBPb/WBBPd/WBBPf/UBBPd
HSUPA 2ms TTI UL Capacity Cell WBBPb/WBBPd/WBBPf WBBPf
HSUPA 5.74Mbps per User Throughput RNC/NodeB NA WBBPf
HSUPA UL Interference Cancellation RTWP NodeB WBBPb/WBBPd/WBBPf/UBBPd
Control Channel Parallel Interference Cancellation
RTWP NodeB WBBPb/WBBPd/WBBPf/UBBPd
(CCPIC)
Turbo IC RTWP NodeB wbbpF Board WBBPf
HSPA+ Downlink 21Mbps per User Throughput RNC/Cell NA
F3 Only(License, has F3, min 768
Flexible Dual Carrier HSDPA Throughput Cell F3 Only HSDPA User Total in all BBP board
and no WBBPb)
60 HSUPA Users per Cell UL Capacity Cell BDBH HUSPA user max more than 40
• at least 1 UBBP Board
• support inter-board IC in a BBU3900, at least one WBBPd, WBBPf, or UBBPd board
Control Channel Parallel Interference Cancellation must be configured in slot 2 or 3 as a centralized IC board with same UL group
UL Capacity Site CCPIC & CCPIC 2
(Phase 3) • support inter-board IC in a BBU3910, a UBBPd board can be configured in any slot as a
centralized IC board.
• BBU3910A does not support this feature.

HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 21
3G Event Requirement For event purposed, suggestion used minimum required of WBBPf4 board &
also 40W(46dBm) RRU per cell.
JKP309HW1_DKHATASSDRMANSTP
+++ JKP309HW1_DKHATASSDRMANSTP 2015-09-08 14:36:34
O&M #132
%%/*5764551*/DSP BRDMFRINFO:CN=0,SRN=80,SN=0;%%
RETCODE = 0 Operation succeeded.

Display Board Manufacturing Information


---------------------------------------
Type = WD5MIRUAC10
Serial Number = 2102310CKD6TE9400991
Description = RRU3829,WD5MIRUAC10,WRRU V3,UMTS Single-mode Multi-carriers Remote Radio Unit(TX2110-
2170MHz/RX1920-1980MHz,-48VDC,5G,2T2R,With Installation Kit)
Date of Manufacture = 2014-09-21
Vendor = Huawei
Issue Number = 00
(Number of results = 1)

DSP BRDMFRINFO:CN=0,SRN=0,SN=2;
N_JKS760IW1_LAMPSITESTREETGALERYPIM3GIW
+++ C_JKS597IW1_LAMPSITEGANDARIACITYMALL1 2016-05-25 13:01:46
O&M #7709
%%/*63333643*/DSP BRDMFRINFO:CN=0,SRN=0,SN=2;%%
RETCODE = 0 Operation succeeded.

Display Board Manufacturing Information


---------------------------------------
Type = WD22UBBPd6
Serial Number = 022HEM4MFA002654
Description = Manufactured Board,BBU3900,WD22UBBPd6,Baseband Processing and Interface Unit ,1*1
Date of Manufacture = 2015-10-04
Vendor = Huawei
Issue Number = 00
(Number of results = 1)

DSP BBPTC:CN=0,SRN=0;
N_JKS760IW1_LAMPSITESTREETGALERYPIM3GIW
+++ C_JKS597IW1_LAMPSITEGANDARIACITYMALL1 2016-05-25 13:01:47
O&M #7711
%%/*63333669*/DSP BBPTC:CN=0,SRN=0;%%
RETCODE = 0 Operation succeeded.

Display Base Band Process Unit Traffic Capability


-------------------------------------------------
Cabinet No. Subrack No. Slot No. BBP Capacity

0 0 2 {UMTS: Cell=12; Uplink CE R99 and HSUPA=1024; Downlink R99 CE=1024; HSDPA Capacity=180; LTE(FDD): Cell=6; RRC Connected User=3600; LTE(TDD): Cell=6; RRC Connected User=3600; GSM: GSM Trx=48}
0 0 3
HUAWEI {UMTS: Cell=12;
HISILICON Uplink CE R99 and HSUPA=1024;
TECHNOLOGIES
SEMICONDUCTOR CO., LTD.Downlink R99 CE=1024; HSDPA Capacity=180; LTE(FDD): Cell=6; RRC Connected User=3600; LTE(TDD): Cell=6; RRCPage 22 User=3600; GSM: GSM Trx=48}
Connected
(Number of results = 2)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 23

You might also like