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Modeling the Impact of PCB traces on

the Performance of an RF Amplifier in an


ASIC with the help of CST-Studio Full
Field EM Simulations and Cadence
Virtuoso Co-Simulations

Harman Malhotra

Supervisor: Sreekesh Lakshminarayanan


TU Darmstadt
Integrated Electronic Systems Lab
Prof. Dr.-Ing. Klaus Hofmann
Merckstr. 25, 64283 Darmstadt, Germany

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 1 Systems Lab
Outline

• Introduction & Motivation

• ASIC Chip

• RF Amplifier-Design & Modelling Losses

• Full Field EM Simulation using CST

• CST EM Simulation Results

• CST to Cadence Import

• Co-Simulation in Cadence

• Co-simulation Results

• Conclusion and Future Work

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 2 Systems Lab
Introduction & Motivation-I
Optical Fibre Fibre to the x (FTTx)
• Larger Bandwidth • FTTP {FTTH, FTTB}
• Low Loss → Longer Distances • FTTN
• Lower Maintenance Costs • FTTC

Wireless/
Passive Optical Network (PON) FTTH λ2 Celltower

λ1
λ3 FTTB

Central λ1λ2 λ3 λ4 … λN Passive


Remote λ4
Office
FTTC
Node Ethernet

Lakshminarayanan [1]

λN FTTN

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 3 Systems Lab
Introduction & Motivation-II
Optical Transceiver Module SFP (Small form-factor pluggable)
• Receiver • Interface between network device
and fibre optic
• 8.5mm x 13.4mm x 56.5mm

Finisar [2]
• Transmitter

m
8.5 mm

m
.5
56
13
.4
mm

Mixed-Signal ASIC
• RF signal chain
• Wavelength control for Laser Diode
• Gain tuning

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 4 Systems Lab
ASIC Chip - Architecture
Mixed Signal ASIC
• RF, Analog & Digital
Blocks

IHP SG13S
• 130 nm SiGe technology
• High Performance BiCMOS
• npn BJT‘s fT /fmax = 250/300 GHz
• 3.7 V Breakdown Voltage
• 3.3 V CMOS
• 1.2 V Digital Library

Lakshminarayanan [1]

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 5 Systems Lab
ASIC Chip – Test Chip
Mixed Signal ASIC
• RF, Analog & Digital
Blocks
• Test Chip
IHP SG13S
• 130 nm SiGe technology
• High Performance BiCMOS
• npn BJT‘s fT /fmax = 250/300 GHz
• 3.7 V Breakdown Voltage
• 3.3 V CMOS
• 1.2 V Digital Library

Lakshminarayanan [1]

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 6 Systems Lab
RF Amplifier - Design
Design
• Cascode Amplifier
• Inductive Load
• Active Input Matching
• Active Output Matching

 Frequency 0.7– 2.3 GHz


 Gain > 18 dB
Bachmann [3]

 Gain Flatness < 2 dB


 Return Loss > 10 dB
 Output P1dB > 10 dBm

450μm
 OIP3 > 20 dBm
 Noise Figure < 6 dB
 DC Power < 300 mW 650μm
Bachmann [3]
Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 7 Systems Lab
RF Amplifier - Modelling PCB Losses
• Package
PCB
• QFN 9mm x 9mm

www.smartjac.biz [4]
• Packaged Chip mounted on PCB

• Model PCB Losses using CST Studio


Suite

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 8 Systems Lab
Full Field EM Simulation using CST
CST Import Flow Simulation Setup-CST MWS

• Each trace – one discrete port at each end

• 28 ports in total

• Each port set to 50 ohms

• All materials– defined by their permittivity and conductivity

• Frequency Range: 0.5 GHz to 2.5 GHz

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 9 Systems Lab
CST EM Simulation Results-I

Results for Amplifier Input Trace

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 10 Systems Lab
CST EM Simulation Results-II

Results for Amplifier Output Trace

PCB traces cannot be considered lossless in the frequency


range of interest !!!

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 11 Systems Lab
CST to Cadence Import
Cadence Import flow
• The N-port component acts
as an interface
N-port component
• It is basically a black box

• Uses an s-parameter file

• Can mimic any component


based on the s-parameter file

• Used to mimic the PCB traces

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 12 Systems Lab
Co-Simulation in Cadence

Test Bench Setup in the Cadence


Environment

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 13 Systems Lab
Co-simulation Results-I

Gain Comparison
• The figure shows how the gain
of the RF amplifier changes

• The PCB trace leads to gain


loss

• The maximum gain drops by


approx. 1.15 dB

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 14 Systems Lab
Co-simulation Results-II
Scattering Parameter Comparison

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 15 Systems Lab
Conclusion and Future Work
PCB
• Bond Wire Modeling

• QFN Package Modeling

• I/O Pad Modeling

• Combining and Testing

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 16 Systems Lab
References
[1] Sreekesh Lakshminarayanan, “A Mixed-Signal ASIC for an RF Optical
Transceiver Module for FTTx Applications”, Analog Workshop 2016

[2] Finisar web portal, https://www.finisar.com/optical-transceivers/ftlf1619p1xcl

[3] Oliver Bachmann, “Design and Layout of an 0.7 GHz to 2.3 GHz, 18 dB Gain
and 10 dB Return Loss RF Amplifier”, Master Thesis, IES, TU Darmstadt

[4] http://www.smartjac.biz/webstore/oem/gem-serial-lite-pro-32-pin-qfn-chip-t-r

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 17 Systems Lab
Thank you for
your attention!

QUESTIONS…?

Integrated Electronic
27.04.2017 | TU Darmstadt | Integrated Electronic Systems Lab | Harman Malhotra | 18 Systems Lab

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