Professional Documents
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(OPERATIONAL AMPLIFIER)
BY ENGR. JOEL T. MENDOZA
INTEGRATED CIRCUITS (IC)
INTEGRATED CIRCUITS (IC)
Typical IC Packages: Through Hole
Mount packages
Typical IC Packages: Surface Mount
packages
* Plastic Ball Grid Array Packages
Packages
* Quad Flat Packages
* Low Profile Fine Pitch
Ball Grid Array Package * Low Profile Quad Flat
Packages
* Dual In-Line Packages
* Through Hole Power
* Shrink Dual In-Line Packages
Packages
* Through Hole Medium
* Small Outline Packages Power Packages
High speed
Reliability
Ease of maintenance
Modular construction
Limitations of IC Technology
2 STRUCTURE
3 FUNCTIONS
SCALE OF INTEGRATION
OP-AMPS Power
Microwave Multiplexers
Amplifier
Oxidation
Epitaxial Growth
A thin layer of SI02 is
grown over the N type
Wafer Preparation An N-type Si layer is layer by exposing the
•A P-type Si bar (ingot) is taken grown on the P-type wafer to an oxygen
and cut into thin slices called substrate by the atmosphere at
wafers
•Czochralski Method is one of introduction of a gas 1000°C temperature
the most popular process in ingot containing
growth
•Wafers are thin sliced of a phosphorous at
semiconductor material either 1200°C temperature
circularly or rectangular in shape
in which a number of IC’s are
fabricated simultaneously
•These wafers are being tapped
and polished to mirror finish and
serve as the substrate for hundred
of IC’s
Monolithic IC’s Preparation
Isolation Diffusion
P-type base is
diffused into the N-
Photolithographic
Process Wafer is subjected to type which itself acts
•Involves the selective etching of a P-type diffusion as a collector
SiO2 with the help of process by which N-
photolithographic mask,
type layer is isolated
Types of Etching into islands on which
components are
1. Wet Etching- use of
fabricated
nitric (hydrofluoric
acid)
Circuit probing
Metallization
Each IC on the wafer is
checked electrically
Pre-Ohmic Etch Process involve in for proper
making performance by
•For food metal placing probes on the
interconnections and
contact with diffused bonding pads
providing bonding
layers, N+ regions are
pads around the
diffused into the
circumference of the
structure
chip
Monolithic IC’s Preparation
Encapsulation
1 Offset null 1 8
2 Inverting input 7
2
3 Non inverting input
6
4 Negative supply 3
5 Offset null 4 5
6 Output
7 Positive supply
8 No connection
TYPES OF PACKAGING
A SIMPLE BIPOLAR
OPERATIONAL AMPLIFIER
CHARACTERISTICS OF AN IDEAL OP-
AMP
Infinite Voltage Gain
(AOL )
Infinite Bandwidth
Infinite Input
Impedance (Open)
Zero Output Impedance
The Internal Block Diagram of an Op-
Amp
non-inverting inverting
Double-ended Differential Mode
Common Inputs
Vc 12 (Vi1 Vi2 ) Same
V Polarity
A V Inputs
o c s
Output Voltage
Vo AdVd AcVc
Common-mode Rejection Ratio (CMRR)
I1 I 2
I IB
2
5. Input offset current, IIO – this is the difference
between the two input currents (20 – 200 nA)
I IO I1 I 2
6. Input Impedance – can either be differential input
impedance or common-mode input impedance
7. Output resistance – the resistance viewed from the
output terminal of an op-amp
Op-amp input and output impedance
V V
The Inverting Amplifier
Most commonly used constant
gain amplifier circuit.
The input is applied to the
inverting terminal
The noninverting terminal is
connected to ground.
The closed-loop gain is independent
The feedback resistor connects of the op-amp’s internal open-loop
gain. It is determined by the external
to the inverting input. resistors and is given by
The negative sign indicates Vo Rf
phase inversion. Av
Vi Ri
The Noninverting Amplifier
The input is applied to
the noninverting
terminal
The feedback resistor
is again connected to
the inverting input
The feedback resistor
forms a voltage
divider circuit with the Rf
input resistor. Av 1
Ri
The Voltage Follower
A special case of NINV
amplifier
It has a gain of unity and has
no phase inversion
There is a direct feedback
from the output to the input.
It has a very high Zi and very
low Zo
Vo Vi
Commonly used as a buffer
amplifier for interfacing circuits Av 1
Effects of the Negative Feedback:
Inverting Amplifier
Input Impedance Output Impedance
Zi (1 Aol )Zin Zout
Zo
Ri 1 Aol
Ri R f
Zin is the open-loop input
impedance The output impedance of
The Zi of NINV amplifier with a NINV with negative
negative feedback is much feedback is much less than
greater than the Zi of the op- the internal output
amp itself
impedance.
Effect of the Negative Feedback:
Voltage Follower
Input Impedance
BW fc
Open-loop voltage gain vs frequency of a
typical op-amp
Above the critical frequency, the gain rolls-off at the rate of
20 dB/decade or 6 dB/octave
The RC lag circuits within the op-amp are responsible for this
roll-off
RC Lag Circuit
The attenuation of an RC
lag circuit is given by
Vout 1
Vin 1 f fc
2 2